IC,FIFO,16X4,ASYNCHRONOUS,CMOS, RAD HARD,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 101162232 |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 1.5 MHz |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Filter level | 38535V;38534K;883S |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| CD40105BFMSH | CD40105BDMSH | |
|---|---|---|
| Description | IC,FIFO,16X4,ASYNCHRONOUS,CMOS, RAD HARD,DIP,16PIN,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,CMOS, RAD HARD,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| Objectid | 101162232 | 101162230 |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 1.5 MHz | 1.5 MHz |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 |
| Number of terminals | 16 | 16 |
| word count | 16 words | 16 words |
| character code | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 16X4 | 16X4 |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified |
| Filter level | 38535V;38534K;883S | 38535V;38534K;883S |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |