Microcontroller, 8-Bit, OTPROM, Z8 CPU, 8MHz, CMOS, PDSO18, PLASTIC, SOIC-18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 1440960089 |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP18,.4 |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| bit size | 8 |
| CPU series | Z8 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| JESD-30 code | R-PDSO-G18 |
| JESD-609 code | e0 |
| length | 11.55 mm |
| Number of I/O lines | 14 |
| Number of terminals | 18 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP18,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 124 |
| rom(word) | 2048 |
| ROM programmability | OTPROM |
| Maximum seat height | 2.65 mm |
| speed | 8 MHz |
| Maximum slew rate | 11 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Z86E0808SSC | |
|---|---|
| Description | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 8MHz, CMOS, PDSO18, PLASTIC, SOIC-18 |
| Is it Rohs certified? | incompatible |
| Objectid | 1440960089 |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP18,.4 |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| bit size | 8 |
| CPU series | Z8 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| JESD-30 code | R-PDSO-G18 |
| JESD-609 code | e0 |
| length | 11.55 mm |
| Number of I/O lines | 14 |
| Number of terminals | 18 |
| Maximum operating temperature | 70 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP18,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 124 |
| rom(word) | 2048 |
| ROM programmability | OTPROM |
| Maximum seat height | 2.65 mm |
| speed | 8 MHz |
| Maximum slew rate | 11 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
京公网安备 11010802033920号
EEWORLD
