Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ……………………………………...+150°C
Storage Temperature Range…………………….-65°C to +150°C
Lead Temperature (soldering, 10s)…………………………+300°C
Soldering Temperature (reflow)……………………………+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........68°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............11°C/W
μMAX
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........97°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................5°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics (±5V Supply)
(V
S
+ = +5V, V
S
- = -5V, V
CLPH
= V
S
+, V
CLPL
= V
S
-, V
OCM
= 0V,
SHDN
= V
S
+, GND/EP = 0V (Note 2), R
F
= R
G
= 1kΩ, R
L
= 1kΩ
(between OUT+ and OUT-), T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
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