Preliminary
SF2169E
• SAW Filter for Digital Television
• Complies with Directive 2002/95/EC (RoHS)
Characteristics :
Balance-to-Balanced Operation
Terminating Source/Load Impedance : Z
S
= 150
Ω
Maximum Rating
Rating
Input Power Level
DC Voltage on any Non-ground Terminal
Operating Temperature Range
Storage Temperature Range in Tape and Reel
Maximum Soldering Profile, 5 cycles/ 10 seconds maximum
Pb
1790.48 MHz
SAW Filter
Value
0
3
-40 to +85
-40 to +85
265
Units
dBm
V
°C
°C
°C
SM3030-8
Electrical Characteristics
Characteristic
Center Frequency
Maximum Insertion Loss, 1770.48 to 1810.48 MHz
1.5 dB Passband
Amplitude Ripple, 1770.48 to 1810.48 MHz
Attenuation, Referenced to IL
MAX
50 to 1708.42 MHz
1872.54 to 1900 MHz
1900 to 2000 MHz
2000 to 6000 MHz
Group Delay Ripple, 1770.48 to 1810.48 MHz
Case Style
Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator
Standard Reel Quantity
Reel Size 7 Inch
Reel Size 13 Inch
40
37
44
20
45
50
48
30
5
20
ns
P-P
dB
Sym
f
C
IL
MAX
Notes
Min
Typ
1790.48
4.5
61
1.0
Max
5.5
1.8
Units
MHz
dB
MHz
dB
SM3030-8 3.0 x 3.0 mm Nominal Footprint
856, YWWS
500 Pieces/Reel
3000 Pieces/Reel
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 1 of 6
SF2169E - 7/19/10
Filter Broadband Rejection
Filter Passband Amplitude and Group Delay Detail
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 3 of 6
SF2169E - 7/19/10
Tuning Network, 150 ohm Balanced Source/Load
L1, L2
C1, C2, C3, C4
10 nH
10 pF
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 4 of 6
SF2169E - 7/19/10
8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min
2.87
2.87
1.14
0.79
0.62
0.47
0.47
1.07
mm
Nom
3.0
3.0
1.27
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
Max
3.13
3.13
1.40
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
0.045
0.031
0.024
0.018
0.018
0.042
Inches
Nom
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
J
K
J
I
J
N
L
N
M
I
Case Materials
Materials
Solder Pad
Plating
K
O
O
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Pb Free
Lid Plating
Body
PCB Footprint Top View
TOP VIEW
B
8
1
7
H
A
2
6
6
C
7
E
BOTTOM VIEW
8
1
2
G
3
4
5
5
4
D
F
3
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 5 of 6
SF2169E - 7/19/10
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