PPTC/DSM Series
Features
Surface Mount Devices
Lead free device
Size 1.5*0.8 mm / 0.06*0.03 inch
Surface Mount packaging
for automated assembly
Applications
Almost anywhere there is a low voltage
power supply, up to 15V and a load to be
protected, including:
Computer mother board, Modem. USB hub
PDAs & Charger, Analog & digital line card
Digital cameras, Disk drivers, CD-ROMs,
Dimensions(mm)
A
0.7士0.1
0.7
士0.1
B
1
1.0士0.1
D
E
C
Product dimensions (mm)
Model
DSM010
DSM020
DSM025
DSM035
DSM050
DSM075
DSM100
A
Min.
1.45
1.45
1.45
1.45
1.45
1.45
1.45
Max.
1.85
1.85
1.85
1.85
1.85
1.85
1.85
Min.
0.65
0.65
0.65
0.65
0.65
0.65
0.65
B
Max.
1.05
1.05
1.05
1.05
1.05
1.05
1.05
Min.
0.40
0.40
0.40
0.40
0.50
0.50
0.50
C
Max.
1.00
1.00
1.00
1.00
1.10
1.10
1.10
D
Min.
0.15
0.15
0.15
0.15
0.15
0.15
0.15
E
Min.
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Environmental Specifications
Test
Conditions
Passive aging
+85°C, 1000 hrs.
Humidity aging
+85°C, 85% R.H. , 168 hours
Thermal shock
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
Resistance to solvent
MIL-STD-202,Method 201
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
1.0
士
0.1
01 | www.spsemi.cn
REV.2014.05.01
PPTC/DSM Series
Electrical characteristics(25℃)
Model
Marking
V
max
(Vdc)
I
max
(A)
40
40
40
40
40
40
I
hold
@25°C
(A)
0.10
0.20
0.25
0.35
0.50
0.75
I
trip
@25°C
(A)
0.30
0.50
0.55
0.75
1.00
1.40
P
d
Typ.
(W)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Maximum
Time To Trip
Current
(A)
0.5
1.0
8.0
8.0
8.0
8.0
8.0
Time
(Sec)
1.00
0.60
0.08
0.10
0.10
0.10
0.10
Resistance
Ri
min
(Ω)
0.900
0.550
0.500
0.200
0.100
0.060
0.040
R1max
(Ω)
6.000
3.500
3.000
1.400
0.800
0.450
0.300
DSM010
DSM020
DSM025
DSM035
DSM050
DSM075
DSM100
1
2
2
3
5
7
0
15.0
9.0
9.0
6.0
6.0
6.0
6.0
40
1.00
2.00
Ihold
= Hold Current. Maximum current device will not trip in 25°C still air.
Itrip
Imax
Pd
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
= Maximum fault current device can withstand without damage at rated voltage (Vmax).
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Vmax
= Maximum operating voltage device can withstand without damage at rated current (Imax).
Rimin/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R1
max
= Maximum device resistance is measured one hour post reflow.
CAUTION :
Operation beyond the specified ratings may result in damage and possible arcing and flame.
Ihold verus tempetature
Model
-40°C
DSM010
DSM020
DSM025
DSM035
DSM050
DSM075
DSM100
0.13
0.27
0.32
0.47
0.67
0.98
1.30
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
-20°C
0.12
0.25
0.29
0.41
0.59
0.85
1.12
0°C
0.11
0.23
0.27
0.38
0.54
0.81
1.08
25°C
0.10
0.20
0.25
0.35
0.50
0.75
1.00
40°C
0.08
0.17
0.21
0.29
0.41
0.60
0.80
50°C
0.07
0.14
0.18
0.26
0.37
0.54
0.72
60°C
0.06
0.12
0.16
0.24
0.34
0.44
0.58
70°C
0.05
0.10
0.05
0.20
0.29
0.40
0.53
85°C
0.03
0.07
0.03
0.14
0.20
0.31
0.42
Thermal Derating Curve
Derating Curves for SMD0603 Series
160
Typical Time-To-Trip At 25°C
Average Time Current Curves
Percentage of Derated Current
140
120
100
80
60
0.10A
0.20A
100
0.25A
0.35A
Time In Seconds
10
1
0.1
0.01
0.50A
40
20
0
-40
-20
0
20
40
60
80
0.75A
1.00A
Temperature (°C)
0.001
0.1
1Current In Amperes 10
Recommended Solder Reflow Conditions
Preheating
Soldering
Cooling
‧Recommended
reflow methods：IR, vapor phase oven, hot air oven.
‧Devices
are not designed to be wave soldered to the bottom side
of the board.
‧Recommended
maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices
can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
60-120 sec.
300
250
200
190
160
100
0
30~60sec.
120 sec.
Packaging Information
Reel:
DSM010-100
5,000 pcs/reel
02 | www.spsemi.cn
REV.2014.05.01
Power technology
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