PPTC/USM Series
Features
Surface Mount Devices
Lead free deivce
Size 3225mm/1210 mils
Surface Mount packaging for automated assembly
Agency recognition:
Dimensions (mm)
A
Applications
Almost anywhere there is a low voltage
power supply, up to DC30V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
1.0 ± 0.1
1.0 ± 0.1
2.5 ± 0.1
B
2.0 ± 0.1
D
C
Product dimensions (mm)
Model
USM005
USM010
USM020
USM035
USM050
USM075
USM110
USM150
USM175
USM200
min
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
A
max
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
min
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
B
max
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.40
0.50
0.50
C
max
0.80
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.20
1.20
D
min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Conditions
85℃,1000hrs
Passive aging
85℃,85%℃R.H.,168hrs
Humidity aging
85℃,to-40℃,13times
Thermal shock
MIL-STD-202,Method 215
Resistance to solvent
MIL-STD-202,Method 201
Vibration
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
Resistance change
±
5% typical
±
5% typical
33% typical
±
No change
No change
Termination pad characteristics
Terminal pad materials
Terminal pad solderability
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
01 | www.spsemi.cn
PPTC/USM Series
Electrical characteristics(25℃)
Model
Marking
Ihold
(A)
USM005
USM010
USM020
USM035
USM050
USM075
USM110
USM150
USM175
USM200
Itrip
(A)
0.15
0.30
0.40
0.75
1.00
1.50
2.20
3.00
3.50
4.00
Vmax
(Vdc)
30
30
30
6
13.2
6
6
6
6
6
Imax
(A)
100
100
100
100
100
100
100
100
100
100
Pd max
(w)
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
Maximum Time To Trip
Current
Time
(A)
0.25
0.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Resistance
Rmin
Rmax
(Ω)
2.800
0.800
0.400
0.200
0.180
0.070
0.050
0.030
0.020
0.015
(S)
1.5
0.60
0.02
0.2
0.1
0.1
0.3
0.5
0.6
1.0
(Ω)
50.000
15.000
5.000
1.300
0.900
0.400
0.210
0.110
0.080
0.070
A
B
C
D
F
G
H
L
N
S
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
1.75
2.00
Ihold
Itrip
Vmax
Imax
Pd
Rmin/max
R1max
*CAUTION
Hold Current:Maximum current device will not trip in 25℃ still air.
.
Trip current:Minimum current at which the device will always trip in 25℃ still air
Maximum operating volatge device can withstand without damage at ratde current(imax)
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Typical power dissipatde from device when in the tripped state in 25℃ still air.
Minimum/Maximum device resistance prior to tripping at 25℃.
Maximum resistance of device at 25℃ measured one hour after trippde tripping.
Operation beyond the specified rating may result in damage and possible arcing.
Ihold versus tempetature
Model
—40℃
USM005
USM010
USM020
USM035
USM050
USM075
USM110
USM150
USM175
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
—20℃
0℃
25℃
40℃
50℃
60℃
70℃
85℃
0.07
0.14
0.26
0.45
0.67
0.97
1.48
1.92
2.30
0.080
0.16
0.29
0.47
0.76
1.00
1.69
2.13
2.54
0.070
0.12
0.22
0.40
0.58
0.86
1.29
1.71
2.02
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
1.75
0.040
0.080
0.160
0.330
0.430
0.640
0.880
1.260
1.470
0.04
0.07
0.14
0.28
0.40
0.59
0.76
1.14
1.33
0.03
0.06
0.13
0.24
0.36
0.54
0.65
1.01
1.18
0.03
0.05
0.11
0.21
0.32
0.48
0.57
0.89
1.05
0.020
0.03
0.08
0.18
0.28
0.40
0.43
0.71
0.86
USM200
2.90
2.63
2.31
2.00
1.680
1.52
1.35
1.20
0.98
Thermal Derating Curve
Derating Curves for SMD1210 Series
160
Typical Time-To-Trip At 25°
C
Average Time Current Curves
0.75
Percentage of Derated Current
100
140
Time In Second
120
10
1
0.1
0.01
0.1
1
Current In Amperes
10
0.05
A
100
80
60
40
20
0
-40
-20
0
20
40
60
80
0.20
A
0.35
A
Temperature (°C)
0.50
A
Package Information
Reel:
USM005½035
USM050½075
USM110
½
USM200
REV.2014.05.01
4500pcs/Reel
4000pcs/Reel
4500pcs/Reel
02 | www.spsemi.cn
Embedded System
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