Low ESR Tantalum Chip Capacitors
FEATURES
• Low ESR and High Ripple Current Ratings
• Values from 10μF to 470μF
• Suitable for Flow and Reflow Soldering Processes
• Available in EIA B, C and D Case Sizes
SPECIFICATIONS
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Dissipation Factor @ 120Hz/25°C
Capacitance Change
Versus Temperature
Soldering Heat Resistance
(+260°C for 5~10 sec.)
Moisture Resistance
(500 hours; 90~95% RH @ 40°C
Load Life Test @at Rated Voltage
2,000 hours @ 85°C
Base Failure Rate (1.0Ω/Volt)
10μF to 470μF
±10% (K)
-55°C ~ +125°C
(voltage derating above 85°C, see table below)
See Part Number & Specifications Table
-55°C
+85°C
+125°C
ΔC
-10%
ΔC
+10%
ΔC
+12%
ΔC
±10% Max., Leakage Current and Dissipation
Factor will be less than value specified below.
NTC-L Series
includes all homogeneous materials
RoHS
Compliant
*See Part Number System for Details
1%/1000 hours at 60% confidence level (+85°C)
STANDARD RATINGS AND CASE SIZE
Rated Voltage @ 85°C
Surge Voltage @ 85°C
Derated Voltage @125°C
Capacitance (μF)
10
15
22
33
47
68
100
150
220
330
470
Code
106
156
226
336
476
686
107
157
227
337
477
6.3Vdc
8
4
Case Size
-
-
B
C
C
-
D
D
D
D
D
10Vdc
13
6.3
Case Size
-
B
C
C
D
D
D
D
D
D
-
16Vdc
20
10
Case Size
B
-
C
D
D
D
D
-
-
-
-
20Vdc
26
13
Case Size
C
C
D
D
D
-
-
-
-
-
-
25Vdc
32
16
Case Size
-
D
D
D
-
-
-
-
-
-
-
35Vdc
45
22
Case Size
D
D
D
-
-
-
-
-
-
-
-
PART NUMBER SYSTEM
NTC-L 106 K 16 TR B F
RoHS Compliant
Case Code
Packaging: TR=Tape/Reel
Voltage
Tolerance Code: K=±10%
Capacitance Code
Series
Please review the notes on correct use, safety and precautions found on
our
website at
www.niccomp.com/tantpc
If in doubt or uncertainty, please review your specific application - process
details with NIC’s technical support personnel:
tpmg@niccomp.com
PRECAUTIONS
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
Low ESR Tantalum Chip Capacitors
PART NUMBER AND SPECIFICATIONS TABLE
Part Number
NTC-L226K6.3TRBF
NTC-L336K6.3TRCF
NTC-L476K6.3TRCF
NTC-L107K6.3TRDF
NTC-L157K6.3TRDF
NTC-L227K6.3TRDF
NTC-L337K6.3TRDF
NTC-L477K6.3TRDF
NTC-L156K10TRBF
NTC-L226K10TRCF
NTC-L336K10TRCF
NTC-L476K10TRDF
NTC-L686K10TRDF
NTC-L107K10TRDF
NTC-L157K10TRDF
NTC-L227K10TRDF
NTC-L337K10TRDF
NTC-L106K16TRBF
NTC-L226K16TRCF
NTC-L336K16TRDF
NTC-L476K16TRDF
NTC-L686K16TRDF
NTC-L107K16TRDF
NTC-L106K20TRCF
NTC-L156K20TRCF
NTC-L226K20TRDF
NTC-L336K20TRDF
NTC-L476K20TRDF
NTC-L156K25TRDF
NTC-L226K25TRDF
NTC-L336K25TRDF
NTC-L106K35TRDF
NTC-L156K35TRDF
NTC-L226K35TRDF
Cap.
(μF)
22
33
47
100
150
220
330
470
15
22
33
47
68
100
150
220
330
10
22
33
47
68
100
10
15
22
33
47
15
22
33
10
15
22
Voltage
(Vdc)
Dissipation Factor
@ 120Hz/20°C
0.06
0.06
0.06
0.08
0.08
0.10
0.10
0.18
0.06
0.06
0.06
0.06
0.06
0.08
0.08
0.10
0.18
0.06
0.06
0.06
0.06
0.06
0.08
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
Leakage Current (μA)
@ 25°C
1.4
2.1
3.0
6.3
9.5
14
20.8
32.9
1.5
2.2
3.3
4.7
6.8
10
15
22
33
1.6
3.5
5.3
7.5
11
16
2.0
3.0
4.4
6.6
9.4
3.8
5.5
8.3
3.5
5.3
7.7
ESR (ohms)
@ 100KHz/20°C
0.50
0.35
0.35
0.15
0.10
0.10
0.10
0.20
0.60
0.50
0.35
0.25
0.20
0.10
0.10
0.10
0.15
0.60
0.40
0.25
0.20
0.15
0.10
0.60
0.50
0.35
0.30
0.20
0.30
0.30
0.30
0.30
0.30
0.50
NTC-L Series
Ripple Current Rating (mA)
@ 100KHz/25°C
440
530
530
890
1,100
1,100
1,100
770
400
440
530
690
770
1,100
1,100
1,100
890
400
500
690
770
890
1,100
400
440
580
630
830
630
630
630
630
630
490
6.3
10
16
20
25
35
CASE DIMENSIONS (mm)
Case
Code
B
C
D
L
±0.2
3.4
5.8
7.3
W
±0.2
2.6
3.2
4.3±0.3
HL
I
1
I
2
±0.2 ±0.2 ±0.2
1.9
2.5
2.8
1.4
2.4
3.8
0.8
1.3
1.3
a
±0.2
2.0
2.2
2.4
L
H
+
b
±0.2
0.7
0.7
1.2
c
±0.2
2.2
2.4
3.3
W
1
L
H
+
W
1
c
a
b
b
I
2
l
1
l
2
c
a
b
b
I
2
l
1
l
2
B and C
Case Size
Terminations:
100% Sn (Lead-Free)
Standard
D Case Size
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Low ESR Tantalum Chip Capacitors
TAPING SPECIFICATIONS (mm)
Case
Code
B
C
D
A
±0.1
3.1
3.7
4.8
B
±0.1
3.8
6.3
7.7
C
±03
8.0
12.0
12.0
D
±0.1
3.5
5.5
5.5
E
±0.1
1.75
1.75
1.75
F
±0.1
4.0
8.0
8.0
G
±0.1
2.0
2.0
2.0
H
±0.1
4.0
4.0
4.0
H
NTC-L Series
Reel
Qty
2000
500
500
J
±0.1
1.5
1.5
1.5
K
max.
2.5
3.0
3.4
G
t
max.
0.2
0.3
0.3
T
J
E
Cover tape
D
B
A
Anode
C
K
F
13.0 ± 0.5
2.0 ± 0.5
178 ± 2.0
60.0 ± 0.5
21.0 ± 0.8
9.0 ± 0.3
RECOMMENDED SOLDERING PROFILES
Note: To avoid thermal shock a preheating stage, 130°C ~ 160°C for 1 minute, should be incorporated into the soldering process
Reflow Soldering - Permitted
Temperature/Time Range
Time (Seconds)
40
Flow Soldering - Permitted
Temperature/Time Range
Time (Seconds)
30
20
10
0
200
210
220
C&D
230
240
250
260
B Case
60
40
20
0
190
200
210
220
230
240
250
260
Temperature (deg. C)
Temperature (deg. C)
Temperature (deg. C)
Temperature (deg. C)
Reflow Soldering - Recommended Profile
Maximum Temperature/Time: 260°C/10 Sec.
300
200
100
0
0
30
60
90
100
125
135
150
160
Flow Soldering - Recommended Profile
Maximum Temperature/Time: 245°C/5 Sec.
300
250
200
150
100
50
0
0
30
60
90
5 Sec.
100
125
135
150
160
Time (Seconds)
Time (Seconds)
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
3
Microcontroller MCU
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