EEWORLDEEWORLDEEWORLD

Part Number

Search

CL32B102MIAP

Description
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.001uF, 1210,
CategoryPassive components    capacitor   
File Size252KB,9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

CL32B102MIAP Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.001uF, 1210,

CL32B102MIAP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid904395519
package instruction, 1210
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.001 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
length3.2 mm
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingCassette
positive tolerance20%
Rated (DC) voltage (URdc)1000 V
seriesCL32 (X7R,1KV,2.5)
size code1210
Temperature characteristic codeX7R
Temperature Coefficient-/+15ppm/Cel ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
width2.5 mm
CERAMIC BODY
FEATURE
INNER ELECTRODE
END TERMINATION
CONFIGURATION
AND
DIMENSIONS
Miniature Size
Wide Capacitance, Temperature Compensation and Voltage Range
Highly Reliable Performance
Industry Standard Size
Tape & Reel for Surface Mount Assembly
L
W
T
BW
Code EIA Code
DIMENSION(mm)
L
W
T(MAX)
BW
05
10
21
31
32
43
55
0402
0603
0805
1206
1210
1812
2220
1.0±0.05
1.6±0.1
2.0±0.1
3.2±0.2
3.2±0.3
4.5±0.4
5.7±0.4
0.5±0.05
0.8±0.1
1.25±0.1
1.6±0.2
2.5±0.2
3.2±0.3
5.0±0.3
0.5±0.05
0.8±0.1
1.25±0.1
1.6±0.2
2.5±0.2
2.5±0.2
2.5±0.3
0.2+0.15/-0.1
0.3±0.2
0.5+0.2/-0.3
0.5+0.2/-0.3
0.6±0.3
0.8±0.3
1.0±0.3
PART
NUMBER CODE
CL
1
10
2
C
3
101
4
J
5
B
6
N
7
C
8
SAMSUNG Multilayer Ceramic Chip Capacitor
Type(Size)
Capacitance Temperature Characteristics
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Option
Packaging Type
3
Design of Ethernet Controller Based on FPGA
I'm working on this graduation project recently, but it always fails when I simulate it, and there are also problems when I synthesize it. I wonder if any experts have relevant information, and some p...
楚楚动人 FPGA/CPLD
What are the characteristics of voice data?
RT, what are the characteristics of voice data packaging? Is there any special mark?...
ljm930103 DSP and ARM Processors
CCS4 28335 Flash Fill
[align=left][color=#000] CKFA burning program, Appcoed.bin requires the entire Flash space to be filled, the space of 28335 is 256k * 16, so the size of the generated appcode.bin should be 512k * 8. A...
applejuice102 Microcontroller MCU
EE Times China Blog
Hi everyone,I'm a researcher for EE Times (Electronic Engineering Times U.S. edition.) EE Times recently opened "the EE Times China Blog"http://www.eetimes.com/blog/news/archives/china/index.html;jses...
EETimes PCB Design
Ask for advice on 2812 power supply and power-on sequence
What is the best power supply for 2812? When using TPS73HD318, does the TPS73HD318 power chip itself consider the power-on sequence of 3.3V and 1.8V? If yes, is it 3.3V first or 1.8V first?If using 3....
pka1987 Microcontroller MCU
Philips Lighting Internship Opportunities
Philips Professional Lighting (Shanghai) has an embedded control system development project to provide internship opportunities, and there are formal employment opportunities after the internship. Int...
gelisp Recruitment

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1424  2137  2468  339  872  29  44  50  7  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号