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NPI31PR33MTRF

Description
1 ELEMENT, 0.33 uH, GENERAL PURPOSE INDUCTOR, SMD
CategoryPassive components   
File Size119KB,4 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
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NPI31PR33MTRF Overview

1 ELEMENT, 0.33 uH, GENERAL PURPOSE INDUCTOR, SMD

NPI Power Inductors
RoHS
FEATURES
Compliant
• ULTRA HIGH CURRENT (UP TO 33.4 AMPS)
includes all homogeneous materials
• SURFACE MOUNTABLE CONSTRUCTION
*See Part Number System for Details
• INDUCTANCE VALUES UP TO 1,400µH)
• TAPED AND REELED FOR AUTOMATIC INSERTION
• FOR USE IN DC/DC CONVERTERS, STEPDOWN CONVERTERS
CHARACTERISTICS
Case Size
Inductance Range
Ambient Operating Temperature Range
Maximum Component Temperature
(Ambient + Self-Heating)
Temperature Rise at Irms
Inductance Change at Isat
Inductance Tolerance
Resistance to Solder Heat
NPI31P
0.33 ~ 4.7µH
NPI52P
0.78 ~ 1,000µH
NPI53P
15 ~ 1,400µH
NPI55P
2.8 ~ 10µH
NPI__P Series
-40°C ~ +85°C
+125°C
40°C max.
-10% typical
20% (M), 10% (K)
260°C for 10 seconds
PART NUMBER SYSTEM
NPI 31 P 4R7 M TR F
Termination Finish:
F = RoHS Compliant
Packaging: TR = Tape & Reel
Inductance Tolerance Code: M=±20%
Inductance Code (µH):
1st two digits are significant, R is deci-
mal point, 3rd digit is multiplier for values from 10µH
and up.
Construction Code (see drawing for details)
Size Code (see table for details)
Series
DIMENSIONS (mm)
Series
NPI31P
NPI52P
NPI53P
NPI55P
A
9.9*
15.2*
15.2
16.3
B
13.2*
18.5*
18.5
22.4
C
6.4*
8.0*
12.0
12.0
G (Ref)
8.6*
14.0*
14.0
14.3
H (Ref)
4.1*
6.4*
6.4
11.9
I (Ref)
1.6*
1.9*
1.9
3.2
CONSTRUCTION
LAND PATTERN
H
A
G
I
300
Temperature °C
250
200
150
100
50
25
Pre-Heat
150°C ~ 180°C
60 ~ 120 sec.
Time above 230°C
30 seconds max.
Cool Down
REFLOW SOLDERING PROFILE
Soldering 260°C max.
5 seconds max.
B
C
90 120 150 180 210 240 270 300
Time - Seconds
®
*Specifications reflect recent product changes. For more information refer to PCN announcement [Link]
30
60
70
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
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