NCSS25C-R018TRF datasheet, PDF

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NCSS25C-R018TRF: DescriptionCurrent Sensing Chip Resistors; File Size84KB，6 Pages; ManufacturerNIC; Websitehttps://www.niccomp.com

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NCSS25C-R018TRF Overview

Current Sensing Chip Resistors

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Current Sensing Chip Resistors

FEATURES

•

SURFACE MOUNTABLE 0805, 1206, 2010 AND 2512 CASE SIZE

LOW RESISTANCE METAL STRIP CONSTRUCTION

PRECISON TOLERANCE (±1%)

TAPED & REEL PACKAGING FOR EASY PICK AND PLACE

REFLOW COMPATIBLE

Resistance

Tolerance

(Code)

NCSS Series

includes all homogeneous materials

RoHS

Compliant

SPECIFICATIONS

Type

EIA

Size

Power Rating

at 70°C

1/8W (B)

NCSS10

0805

1/4W (A)

1/2W (S)

1/4W (A)

NCSS12

1206

1/2W (S)

1W (C)

1/2W (S)

NCSS20

2010

3/4W (I)

1W (C)

1.5W (D)

1W (C)

NCSS25

2512

1.5W (D)

2W (E)

±1% (F)

±2% (G)

±5% (J)

See Part Number System for Details

Resistance

Range*

Operating

Temperature

Range (°C)

Temperature Coefﬁcient

(ppm/°C, +25°C ~ +125°C)

±100ppm

5mΩ ~ 20mΩ

1mΩ = ±200ppm

2mΩ ~ 10mΩ = ±100ppm

>10mΩ = ±75ppm

1mΩ ~ 30mΩ

-55°C ~ +170°C

5mΩ ~ 10mΩ = ±100ppm

>10mΩ = ±75ppm

5mΩ ~ 20mΩ

1mΩ = ±275ppm

2mΩ ~ 10mΩ = ±100ppm

>10mΩ = ±75ppm

1mΩ ~ 50mΩ

1mΩ ~ 15mΩ

1mΩ ~ 10mΩ

*Contact NIC regarding availability of values not shown

ENVIRONMENTAL CHARACTERISTICS

Item

Temperature Coefﬁcient

of Resistance

Load Life

Short Time Overload

Moisture Resistance

(no load)

Temperature Cycling

<±1%

<±0.5%

<±1%

<±0.5%

0805

Speciﬁcation

1206

2010

Within speciﬁed value

<±1%

<±0.5%

<±1.0%

<±0.5%

<±1%

<±0.5%

<±1%

<±0.5%

<±1%

<±0.5%

<±1%

<±0.5%

2512

Test Method

+25°C ~ +125°C

1,000 hours at rated power, +70°C, 1.5 hours

ON, 0.5 hours OFF

5 x rated power for 5 seconds

+85°C, 85% RH, 1000 hours

-55°C & +155°C, 300 cycles,

15 minutes at each temperature

+260°C ± 5°C for 10 sec. ±1 sec.,Two cycles

(20 sec. ±1 sec. for 2512 size)

+245°C ± 5°C, 2 sec. ± 0.5sec.

+170°C for 1,000 hours

-55°C for 1,000 hours

Bending within 2mm

100VDC for 1 minute

Reference Standard

IEC60115-1 4.8

JIS-C5201 4.8

IEC60115-1 4.25.1

JIS-C5201 4.25.1

IEC60115-1 4.13

JIS-C5201 4.13

IEC60115-1 4.24.2 1a

JIS-C5201 4.24.2 1a

IEC60115-1 4.19

JIS-C5201 4.19

IEC60115-1 4.18

JIS-C5201 4.18

IEC60115-1 4.17

JIS-C5201 4.17

IEC60115-1 4.23.2

JIS-C5201 4.23.2

IEC60115-1 4.23.4

JIS-C5201 4.23.4

IEC60115-1 4.33

JIS-C5201 4.33

IEC60115-1 4.6

JIS-C5201 4.6

Resistance to Soldering Heat <±0.5%

Solderability

High Temperature Exposure

Low Temperature Storage

Substrate Bending

Insulation Resistance

At least 95% coverage of electrode

surface

<±1%

<±0.5%

<±1%

<±0.5%

<±1%

<±0.5%

<±1%

<±0.5%

>100MΩ

NIC COMPONENTS CORP.

www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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