EEWORLDEEWORLDEEWORLD

Part Number

Search

BD105-22G-1-0250-0460-0450-LE

Description
Board Connector
CategoryThe connector    The connector   
File Size348KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BD105-22G-1-0250-0460-0450-LE Overview

Board Connector

BD105-22G-1-0250-0460-0450-LE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid2089522436
Reach Compliance Codecompliant
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTIN
Contact materialCOPPER ALLOY
JESD-609 codee3
Manufacturer's serial numberBD105
1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL
A
A
B
C
D
E
SPECIFICATIONS
规格:
CURRENT RATING
电流额定值:
1 AMP
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MEGOHMS MIN.
03 to 33
F
DIELECTRIC WITHSTANDING
耐电压:
AC 300 V
Contact Plating
CONTACT RESISTANCE
接触电阻值:
20m
Max.
A = Gold Flash All Over
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYESTER
聚酯
, LCP, UL 94-V0
G = 10µ" Gold Contact Area/Tin On Tail
OPTIONS
可选物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
Standard = Gold Flash All Over
LCP (STANDARD
标准物料
) -
G
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
NYLON 6T (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BD074
BD075
BD080
BD090
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
28/12/07
PN
STANDARD INSULATOR
MATERIAL & PACKING
OPTIONS CHANGED
CB
PACKING OPTIONS SOLDER TEMP & MATES
WITH INFO. UPDATED
CHANGED
B
27/04/09
1
C
20/05/09
G CE
N N
I
D E
N SC
E E
P L
O
S
B
GC
O
Ordering Grid
B
C
D
E
BD105
XX X
X
XXXX
XXXX
XXXX
X
X
Type
1 = R1 Type
2 = R2 Type
Packing Options
B = Tape and Reel with Cap (Standard)
D = Tube (Standard - where height exceeds 25mm)
E = Tube with Cap
Insulator Material
L = LCP (Standard)
N = Nylon 6T
F
Dimension C (1/100mm)
(Post Height)
Standard - 3.00mm = 0300
or specify Dimension C
e.g. 2.50mm = 0250
Tol +/- 0.2mm
Dimension D (1/100mm)
(Stack Height)
Standard - 4.60mm = 0460
Please Specify Dimension D
e.g. 2.5mm = 0250
Tol +/- 0.2mm
Part Number:-
Dimension E (1/100mm)
(Footprint Width)
Standard - 4.50mm = 0450
or specify Dimension E
e.g. 2.50mm = 0250
Tol +/- 0.2mm
G
Tolerances
(Except as noted)
Date:-
Dimensions in mm
BD105
28 DEC 07
AE
2
D
27/07/09
AE
DIMENSION
AMMENDED
E
27/08/09
3
AJO
BD105
X PCN
X
15/05/14
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
Description:-
H
Sheet No.
1/1
1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW
SURFACE MOUNT, VERTICAL
www.globalconnectortechnology.com
Material
Drawn by
LYH
X
See Note
E & OE
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Scale
NTS
Revision
4
5
6
7
8
Can someone explain the difference between analog ground and digital ground?
I would like to ask the experts in the forum to explain: what types of components are digital ground and analog ground used for? Don't explain that digital ground is connected to digital signals and a...
wang168506 stm32/stm8
Notice on the online release of questions for the 2013 national competition
[i=s]This post was last edited by paulhyde on 2014-9-15 03:06[/i] [p=20, null, center][color=#000][font=Simsun][b]Notice on the Online Posting of Questions for the 2013[/b][b]National Undergraduate El...
Leo417love Electronics Design Contest
Wireless VOOC flash charging technology exposed, is it black technology?
It is reported that this year OPPO will show off its black technology at MWC, and will once again upgrade its long-standing high-tech that is worth showing off. It has been confirmed that there will b...
bootloader RF/Wirelessly
W806 Lianshengde 9.9 yuan development board experience 4 --- SDK surprise discovery
Because the SPI polling transmission was too slow last night, I was thinking about looking at the registers and configuring DMA transmission. I didn't expect to see that the official SDK actually prov...
RCSN Domestic Chip Exchange
Engineering Circuit Analysis—Sixth Edition
[i=s] This post was last edited by qq849682862 on 2014-8-23 20:24 [/i] Engineering Circuit Analysis - Sixth Edition A very good book with bookmarks for easy reading...
qq849682862 Analog electronics
ZZ《PCWorld》:15 weird "future PCs"
These highly creative computer prototypes introduced in this article have great competitive advantages in terms of flexibility, foldability, design concepts and material usage. Their exaggerated shape...
呱呱 Energy Infrastructure?

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 137  1183  1285  1192  2839  3  24  26  58  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号