SMT Devices
Series IC51 (Clamshell)
SOP, TSOP Type I & II
Specifications
Series Overview
*SOP (Small Outline Packages, Gullwing Leads)
*SOP variations e.g. TSSOP...
0.4 to 1.27mm Pitch
Part Number (Details)
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +150°C (for type PSF)
–55°C to +170°C (for type PES & PEI)
Mating Cycles:
10,000 insertions min.
IC51
Series No.
-
028
2
-
334-1
-
MF
No. of Contact Pins
No. of Sides with Contacts
Design Number
MF= Flanged
Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC189 (Open Top)
SOP, TSOP Type I & II
Specifications
1,000MΩ min. at 100V DC, pitch 0.4, 0.5
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5
500V AC for 1 minute, pitch 0.65
700V AC for 1 minute, pitch 0.8, 1.27
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions
Contact Force:
20g to 80g per pin
Insulation Resistance:
0.4 to 1.27mm Pitch
Part Number (Details)
IC189
Series No.
-
016
2
019
0 9 *
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC235 (Open Top)
SOP, TSOP Type II
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 80g per pin
0.8 and 1.27mm Pitch
Part Number (Details)
IC235
Series No.
-
020
2
-
201
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
40
Test Solutions
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Series Overview
*SOP (Small Outline Packages, Gullwing Leads)
Series IC191 (Open Top)
Thin Small Outline Package (TSOP Type I)
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Current Rating:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
1A max.
–40°C to +170°C
–40°C to +150°C (type -004*)
10,000 insertions min.
20g to 80g per pin
SMT Devices
0.5mm Pitch
Part Number (Details)
IC191
Series No.
-
032
2
-
001 *
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Contact Styles
Series IC51
Series IC (two point
Contact)
Series IC235
Series IC (kelvin)
Series IC189 / IC191
cont‘d next page
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test Solutions
Gullwing-Leads - SO
41
FPGA/CPLD
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