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WS512K32-20NH1I

Description
SRAM Module, 512KX32, 20ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size142KB,10 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32-20NH1I Overview

SRAM Module, 512KX32, 20ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WS512K32-20NH1I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1546135662
package instruction1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time20 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
JESD-609 codee4
length27.3 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height4.34 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width27.3 mm
WS512K32-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
s
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
s
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140")
(Package 502), Package to be developed.
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
• 68 lead, Hermetic CQFP (G1U), 22.4mm (0.880") square
(Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
s
Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8
s
Commercial, Industrial and Military Temperature Ranges
s
TTL Compatible Inputs and Outputs
s
5 Volt Power Supply
s
Low Power CMOS
s
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s
Weight
WS512K32-XH1X - 13 grams typical
WS512K32-XG2TX - 13 grams typical
WS512K32-XG1UX - 13 grams typical
WS512K32-XG4TX - 20 grams typical
* 15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
FIG. 1
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
PIN CONFIGURATION FOR WS512K32N-XH1X
TOP VIEW
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
18
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
8
8
8
8
PIN DESCRIPTION
56
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
512K x 8
512K x 8
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
November 1999 Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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