PD - 9.1525
IRF9Z34NS/L
HEXFET
®
Power MOSFET
Advanced Process Technology
l
Surface Mount (IRF9Z34NS)
l
Low-profile through-hole (IRF9Z34NL)
l
175°C Operating Temperature
l
Fast Switching
l
P-Channel
l
Fully Avalanche Rated
Description
l
D
V
DSS
= -55V
R
DS(on)
= 0.10Ω
G
I
D
= -19A
S
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9Z34NL) is available for low-
profile applications.
D 2 Pak
T O -2 6 2
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
-19
-14
-68
3.8
68
0.45
± 20
180
-10
6.8
-5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Typ.
–––
–––
Max.
2.2
40
Units
°C/W
8/25/97
IRF9Z34NS/L
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
∆V
(BR)DSS
/∆T
J
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S
C
iss
C
oss
C
rss
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
-55
–––
–––
-2.0
4.2
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
-0.05
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
13
55
30
41
7.5
620
280
140
Max. Units
Conditions
–––
V
V
GS
= 0V, I
D
= -250µA
––– V/°C Reference to 25°C, I
D
= -1mA
0.10
Ω
V
GS
= -10V, I
D
= -10A
-4.0
V
V
DS
= V
GS
, I
D
= -250µA
–––
S
V
DS
= -25V, I
D
= -10A
-25
V
DS
= -55V, V
GS
= 0V
µA
-250
V
DS
= -44V, V
GS
= 0V, T
J
= 150°C
100
V
GS
= 20V
nA
-100
V
GS
= -20V
35
I
D
= -10A
7.9
nC
V
DS
= -44V
16
V
GS
= -10V, See Fig. 6 and 13
–––
V
DD
= -28V
–––
I
D
= -10A
ns
–––
R
G
= 13Ω
–––
R
D
= 2.6Ω, See Fig. 10
Between lead,
nH
–––
and center of die contact
–––
V
GS
= 0V
–––
pF
V
DS
= -25V
–––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Notes:
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– -19
showing the
A
G
integral reverse
––– ––– -68
p-n junction diode.
S
––– ––– -1.6
V
T
J
= 25°C, I
S
= -10A, V
GS
= 0V
––– 54
82
ns
T
J
= 25°C, I
F
= -10A
––– 110 160
nC di/dt = -100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Pulse width
≤
300µs; duty cycle
≤
2%.
Uses IRF9Z34N data and test conditions
Starting T
J
= 25°C, L = 3.6mH
R
G
= 25Ω, I
AS
= -10A. (See Figure 12)
T
J
≤
175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
≤
-10A, di/dt
≤
-290A/µs, V
DD
≤
V
(BR)DSS
,
IRF9Z34NS/L
100
VGS
- 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTT OM - 4. 5V
TOP
100
-ID , D ra in -to -S o u rc e C u rre n t (A )
10
-ID , D ra in -to -S o u rc e C u rre n t (A )
VGS
- 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTT OM - 4. 5V
TOP
10
-4 .5V
20 µ s PU LSE W ID TH
T
J
1 75°C
T
C
= 175°C
0.1
1
10
-4 .5V
1
0.1
1
2 0µ s PU LS E W ID TH
T
= 2 5°C
T c
J
= 25°C
A
10
100
1
100
A
-VD S , Drain-to-Source Voltage (V)
-VD S , Drain-to-Source V oltage (V )
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
100
2.0
R
D S (o n )
, D ra in -to -S o u rc e O n R e si sta n ce
(N o rm a li ze d )
I
D
= -17 A
-I
D
, D rain -to- S our ce C urr ent ( A )
1.5
T
J
= 2 5 °C
T
J
= 1 7 5 °C
10
1.0
0.5
1
4
5
6
7
V
DS
= -2 5 V
2 0 µ s P U L S E W ID T H
8
9
A
10
0.0
-60 -40 -20
0
20
40
60
80
V
G S
= -10 V
100 120 140 160 180
A
-V
G S
, Ga te-to-S o urce V oltage (V )
T
J
, Junction T emperature (°C)
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
Vs. Temperature
IRF9Z34NS/L
1200
-V
G S
, G a te -to -S o u rc e V o lta g e (V )
1000
V
GS
C
is s
C
rs s
C
os s
=
=
=
=
0V ,
f = 1MH z
C
gs
+ C
g d
, C
ds
SH OR TED
C
gd
C
ds
+ C
gd
20
I
D
= -10 A
V
DS
= -44 V
V
DS
= -28 V
16
C , C a p a c ita n c e (p F )
800
C
i ss
C
os s
12
600
8
400
C
rs s
200
4
0
1
10
100
A
0
0
10
20
FO R TEST C IR C U IT
SEE F IGU R E 1 3
30
40
A
-V
D S
, Drain-to-Source V oltage (V)
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
100
1000
-I
S D
, R e ve rse D ra in C u rre n t (A )
OPE R ATIO N IN TH IS A RE A LIMITE D
BY R
D S(o n)
10
-I
D
, D ra in C u rre n t (A )
100
1 0µs
T
J
= 1 75 °C
T
J
= 25 °C
100µ s
10
1m s
1
T
C
=
5°C
T
C
= 2
25°C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
V
G S
= 0 V
1.4
A
1
1
T
J
= 1 75°C
Sin gle Pu lse
10
10m s
1.6
A
100
-V
S D
, S ource-to-Drain V oltage (V )
-V
D S
, Drain-to-Source V oltage (V )
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
IRF9Z34NS/L
20
V
DS
V
GS
R
D
D.U.T.
+
I
D
, Drain Current (A)
15
-10V
10
Pulse Width
≤ 1
µs
Duty Factor
≤ 0.1 %
Fig 10a.
Switching Time Test Circuit
5
t
d(on)
t
r
t
d(off)
t
f
V
GS
10%
0
25
50
75
100
125
150
175
T
C
, Case Temperature
( ° C)
90%
V
DS
Fig 9.
Maximum Drain Current Vs.
Case Temperature
Fig 10b.
Switching Time Waveforms
10
Thermal Response (Z
thJC
)
1
D = 0.50
0.20
0.10
0.05
P
DM
SINGLE PULSE
(THERMAL RESPONSE)
t
1
t
2
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.0001
0.001
0.01
0.1
0.1
0.02
0.01
0.01
0.00001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
-
R
G
V
DD
Power technology
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