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NTS4173P

Description
SMALL SIGNAL, FET
Categorysemiconductor    Discrete semiconductor   
File Size119KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

NTS4173P Overview

SMALL SIGNAL, FET

NTS4173P Parametric

Parameter NameAttribute value
Number of terminals3
Processing package descriptionLEAD FREE, CASE 419-04, SC-70, 3 PIN
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingMATTE TIN
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Transistor typeGENERAL PURPOSE SMALL SIGNAL
NTS4173P
Power MOSFET
−30
V,
−1.3
A, Single P−Channel, SC−70
Features
−30
V BV
ds
, Low R
DS(on)
in SC−70 Package
Low Threshold Voltage
Fast Switching Speed
This is a Halide−Free Device
This is a Pb−Free Device
http://onsemi.com
V
(BR)DSS
R
DS(on)
MAX
150 mW @
−10
V
−30
V
200 mW @
−4.5
V
280 mW @
−2.5
V
I
D
MAX
−1.2
A
−1.0
A
−0.9
A
Applications
Load Switch
Low Current Inverter and DC−DC Converters
Power Switch for Printers, Communication Equipment
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
t
5s
Power Dissipation
(Note 1)
Steady
State
t
5s
Pulsed Drain Current
t
p
= 10
ms
I
DM
T
J
,
T
stg
I
S
T
L
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
A
= 25°C
P
D
0.35
−5.0
−55
to
150
−1.0
260
A
°C
A
°C
I
D
Symbol
V
DSS
V
GS
Value
−30
±12
−1.2
−0.80
−1.3
0.29
W
A
Unit
V
V
SC−70/SOT−323 (3 LEADS)
S
G
D
3
1
2
SC−70/SOT−323
CASE 419
STYLE 8
MARKING DIAGRAM/
PIN ASSIGNMENT
3 Drain
TGMG
G
1
Gate
2
Source
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
TG
= Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
THERMAL RESISTANCE RATINGS
Parameter
Junction−to−Ambient
Steady State (Note 1)
Junction−to−Ambient
t
5 s (Note 1)
Symbol
R
qJA
R
qJA
Max
425
360
Unit
°C/W
ORDERING INFORMATION
Device
NTS4173PT1G
Package
SC−70
(Pb−Free)
Shipping
3000/Tape & Reel
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Date code orientation may vary depending upon
manufacturing location
©
Semiconductor Components Industries, LLC, 2008
September, 2008
Rev. 0
1
Publication Order Number:
NTS4173P/D
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