LD13HC123ZAB1A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD13HC123ZAB1A

LD13HC123ZAB1A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 3000V, 80% +Tol, 20% -Tol, X7R, 15% TC, 0.012uF, Surface Mount, 1825, CHIP; CategoryPassive components capacitor; File Size56KB，2 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD13HC123ZAB1A Overview

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 80% +Tol, 20% -Tol, X7R, 15% TC, 0.012uF, Surface Mount, 1825, CHIP

LD13HC123ZAB1A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1579205215
package instruction	, 1825
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.012 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.54 mm
JESD-609 code	e0
length	4.5 mm
Manufacturer's serial number	LD13
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	80%
Rated (DC) voltage (URdc)	3000 V
series	LD13(3KV,X7R)HV
size code	1825
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	6.4 mm

Preview

Download Datasheet

View All

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Application

AVX Corporation will support those customers for commercial and

military Multilayer Ceramic Capacitors with a termination consisting of

5% minimum lead. This termination is indicated by the use of a “B” in

the 12th position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our customers. AVX

has provided in the following pages, a full range of values that we are

offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip product. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak

temperature reached by the ceramic bodies through the soldering

process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external

arcing.

NEW 630V RANGE

HOW TO ORDER

LD08

AVX

Style

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD08 - 1808

LD12 - 1812

LD13 - 1825

LD20 - 2220

LD14 - 2225

LD40 - 3640

Voltage

600V/630V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Temperature

Coefficient

C0G = A

X7R = C

271

Capacitance Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF = 105

Capacitance

Tolerance

C0G: J = ±5%

K = ±10%

M = ±20%

X7R: K = ±10%

M = ±20%

Z = +80%, -20%

Test

Level

A = Standard

Termination

B = 5% Min Pb

Packaging

1 = 7" Reel

3 = 13" Reel

9 = Bulk

Special Code

A = Standard

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

DIMENSIONS

SIZE

(L) Length

millimeters (inches)

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD25* (2225) LD40* (3640)

2.01 ± 0.20

3.20 ± 0.20

4.57 ± 0.25

4.50 ± 0.30

5.70 ± 0.40

5.72 ± 0.25

9.14 ± 0.25

(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

(W) Width

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.20

2.03 ± 0.25

3.20 ± 0.20

6.40 ± 0.30

5.00 ± 0.40

6.35 ± 0.25

10.2 ± 0.25

(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

1.30

1.52

1.70

2.03

2.54

3.30

2.54

Max.

(0.051)

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

(0.100)

(t) terminal min. 0.50 ± 0.25

0.25 (0.010)

0.76 (0.030)

max. (0.020 ± 0.010) 0.75 (0.030)

0.75 (0.030)

1.02 (0.040)

1.52 (0.060)

* Reflow soldering only.

Recommended Resources

TDA2822 power amplifier circuit diagram

Transistor audio amplifier circuit with DC coupling

Function generator circuit with variable frequency range

Simple magnetically controlled AC switch circuit

An alarm circuit that is not easily damaged

Motorcycle charger circuit diagram

Why does the transistor burn?: Arc discharge is carried out through the triode. Why does the triode burn? (The circuit diagram is as shown below, and the discharge point is between points a and d in the circuit diagram)...; zqs0001 Analog electronics

Help: Are students majoring in electrical and communications suitable for learning embedded systems? Which direction is better for them to develop in?: I am a sophomore majoring in communications and will soon be a junior. I have already taught myself microcontrollers, C++, analog electronics, digital electronics and other courses. I have also read s...; utraedit Embedded System

Receive NUCLEO board for L053 or F411: [i=s] This post was last edited by sacq on 2015-4-15 17:37 [/i] Interested in receiving: STM32L053 NUCLEO or STM32F411 NUCLEO. E-coins preferred, other methods can be discussed. ---------- (4-14) Have...; sacq Buy&Sell

There is an error "no model specified for u1" in proteus. u1 is lm311: There is an error "no model specified for u1" in proteus. u1 is lm311. I made an amplifier and shaping circuit in proteus. After simulation, an error "no model specified for u1" appears. However, I al...; littlefish603 MCU

【TI Recommended Course】#Smart Building Wireless Solutions#: //training.eeworld.com.cn/TI/show/course/5720...; czhuangwei TI Technology Forum

The arm development board is connected to the keyboard through the USB port, and an error is reported after a period of time: [font=Source Sans Pro, Helvetica, Arial, sans-serif][color=#555555]报错信息：[/color][/font] [color=#000][font=Arial][color=#555555] [/color][/font][/color] [color=#000][font=Arial][color=#555555][23927.04...; om181225 ARM Technology

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components