HIGH CURRENT POWER INDUCTORS
1. PART NO. EXPRESSION :
SSL1208 SERIES
SSL1005-R21MF
(a)
(b)
(c)
(d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : R21 = 0.21uH
(d) Tolerance code : M = ±20%
(e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
D
R21
B
E
L
G
C
PCB Pattern
Unit:m/m
A
B
C
D
2.54±0.5
E
5.0±0.5
G
7.1 Max.
H
7.6 Max.
L
13.8 Max.
13.46 Max. 12.95 Max. 8.0 Max.
3. SCHEMATIC :
4. GENERAL SPECIFICATION :
a) Operating temp. : -55°C to +125°C
b) Storage temp. : -55°C to +125°C
c) Irms (A) : Will cause coil temp. to rise approximately T=40°C without core loss.
d) Isat (A) : Will cause L
0
to drop approximately 20%
e) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
5. ELECTRICAL CHARACTERISTICS :
Part No.
SSL1208-R15YF
SSL1208-R21MF
SSL1208-R26MF
SSL1208-R32MF
SSL1208-R44MF
Inductance L
0
( uH )
0.15 ±30%
0.21 ±20%
0.26 ±20%
0.32 ±20%
0.44 ±20%
Test
Freq.
( Hz )
0.1V/500K
0.1V/500K
0.1V/500K
0.1V/500K
0.1V/500K
DCR
(m )
Max.
0.60
0.60
0.60
0.60
0.60
Irms
(A)
Max.
50
45
40
40
28
Isat
(A)
Max.
55
50
45
41
30
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT POWER INDUCTORS
6. CHARACTERISTICS CURVES :
SSL1208-R15YF
SSL1208 SERIES
SSL1208-R21MF
SSL1208-R26MF
SSL1208-R32MF
SSL1208-R44MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT POWER INDUCTORS
7. RELIABILITY AND TEST CONDITION :
SSL1208 SERIES
ITEM
Electrical Characteristics Test
Inductance
DCR
Heat Rated Current (Irms)
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
CH16502, Agilent33420A Micro-Ohm Meter.
Irms(A) will cause the coil temperature rise
approximately T=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Isat(A) will cause Lo to drop approximately 20%
Saturation Current (Isat)
Mechanical Performance Test
Solderability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
230°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 230±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
150°C
60
seconds
4±1
seconds
Solder Heat Resistance
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
Preheating
260°C
Dipping
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
150°C
60
seconds
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Low Temperature
Life Test
Thermal Shock
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : -55±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Conditions of 1 cycle.
Step
1
2
3
4
Temperature (°C)
-55±3
Room Temperature
+125±3
Room Temperature
Times (min.)
30±3
Within 3
30±3
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT POWER INDUCTORS
8. SOLDERIND AND MOUNTING :
8-1. Recommended PC Board Pattern ( Unit : mm )
13.8
7.1
SSL1208 SERIES
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
TEMPERATURE °C
250~260
230
180
150
60~120s
Soldering
7.6
TEMPERATURE °C
10s max.
Natural
cooling
Preheating
280
260
150
Soldering
Natural
cooling
30~60s
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT POWER INDUCTORS
9. PACKAGING INFORMATION :
9-1. Reel Dimension
SSL1208 SERIES
COVER TAPE
2.0±0.5
D
B
ØC
A
EMBOSSED CARRIER
Type
13" x 24mm
A(mm)
24.0±0.5
B(mm)
75±2
C(mm)
13.5±0.5
D(mm)
330
9-2 Tape Dimension
1.75±0.1
4.0±0.1
2.0±0.1
Ø1.5+0.1
t
W
0.15 MIN
P
Ao
Bo
Ko
Series
SSL1208
Ao(mm)
Bo(mm)
Ko(mm)
8.2±0.1
P(mm)
16.0±0.1
W(mm)
24.0±0.3
t(mm)
0.35±0.05
13.05±0.1 13.05±0.1
9-3 Packaging Quantity
Size
Chip / Reel
Inner Box
Carton
SSL1208
400
1200
2400
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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