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MA000911406

Description
Material Content Data Sheet
File Size37KB,2 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
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MA000911406 Overview

Material Content Data Sheet

Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC014N03LS G
MA000911406
PG-TDSON-8-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.396
0.038
0.011
37.762
0.039
0.086
6.098
36.758
1.452
0.166
0.049
0.039
1.862
0.011
0.003
11.320
0.022
0.007
22.292
Average
Mass
[%]
1.17
0.03
0.01
31.62
0.03
0.07
5.11
30.78
1.22
0.14
0.04
0.03
1.56
0.01
0.00
9.48
0.02
0.01
18.67
29. August 2013
119.41 mg
Sum
[%]
1.17
Average
Mass
[ppm]
11690
317
95
31.66
0.03
316238
325
719
51066
35.96
1.22
0.14
307833
12157
1386
408
326
1.63
15590
95
28
9.49
94801
187
56
18.70
186683
186926
1000000
94924
16324
359618
12157
1386
316650
325
Sum
[ppm]
11690
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com

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