Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300∞C
NOTES
*Absolute
Maximum Ratings apply to packaged parts, unless otherwise noted.
ABSOLUTE MAXIMUM RATINGS*
Package Type
8-Lead Hermetic DIP (Q)
8-Lead Plastic DIP (N)
8-Lead SOL (RN)
TO-99 (H)
*
JA
*
JC
Unit
∞C/W
∞C/W
∞C/W
∞C/W
148
103
158
150
16
43
43
18
JA
is specified for worst-case mounting conditions, i.e.,
JA
is specified for device
in socket for CERDIP and PDIP packages;
JA
is specified for device soldered to
printed circuit board for SO packages.
ORDERING GUIDE
DIE CHARACTERISTICS
T
A
= 25∞C
V
OS
MAX
(mV)
CERDIP
150
150
300
750
750
750
OP220AZ*
OP220EZ*
OP220FZ*
Package Options
Plastic
TO-99
Operating
Temperature
Range
MIL
IND
IND
XIND
XIND
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
DIE SIZE 0.097 INCH 0.063 INCH, 6111 SQ. MILS
(2.464 mm 1.600 mm, 3.94 SQ. mm)
NOTE : ALL V+ PADS ARE INTERNALL CONNECTED
INVERTING INPUT (A)
NONINVERTING INPUT (A)
BALANCE (A)
V–
BALANCE (B)
NONINVERTING INPUT (B)
INVERTING INPUT (B)
BALANCE (B)
V+
OUT (B)
V+
OUT (A)
V+
BALANCE (A)
OP220CJ* MIL
OP220GZ* OP220GP*
OP220GS
For military processed devices, please refer to the Mil Standard
Data Sheet
OP220AJ/883*.
*Not
for new design. Obsolete April 2002.
WAFER TEST LIMITS
(@ V
S
=
Parameter
Input Offset Voltage
Input Offset Voltage Match
Input Offset Current
Input Bias Current
Input Voltage Range
Common-Mode
Rejection Ratio
Power Supply
Rejection Ratio
Large-Signal
Voltage Gain
Output Voltage Swing
Supply Current
(Both Amplifiers)
2.5 V, to
15 V, T
A
= 25 C, unless otherwise noted.)
Conditions
OP220N
Limit
200
300
V
CM
= 0
V
CM
= 0
V
S
=
±
15 V
V– = 0 V, V+ = 5 V, 0 V
£
V
CM
£
3.5 V
–15 V
£
V
CM
£
13.5 V, V
S
=
±
15 V
V
S
=
±
2.5 V to
±
15 V
V– = 0 V, V+ = 5 V to 30 V
R
L
= 25 kW, V
S
=
±
15 V
V
O
=
±
10 V
V+ = 5 V, V– = 0 V, R
L
= 10 kW
V
S
=
±
15 V, R
L
= 25 kW
V
S
=
±
2.5 V, No Load
V
S
=
±
15 V, No Load
2
25
–15/13.5
88
93
12.5
22.5
1000
0.7/4
±
14
125
190
Unit
mV
Max
mV
Max
nA Max
nA Max
V Min
dB Min
mV/V
Max
V/mV Min
V Min
mA
Max
Symbol
V
OS
V
OS
I
OS
I
B
IVR
CMRR
PSRR
A
VO
V
O
I
SY
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packing is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on die lot qualification through sample lot assembly and testing.
–4–
REV. A
Typical Performance Characteristics– OP220
150
V
S
= 15V
100
INPUT OFFSET VOLTAGE – V
INPUT BIAS CURRENT – nA
14
V
S
= 15V
12
10
50
8
0
6
–50
4
–100
2
0
–100
–150
–50
–25
0
25
50
75
100
125
–50
TEMPERATURE – C
0
50
TEMPERATURE – C
100
150
TPC 1. Normalized Offset Voltage vs. Temperature
TPC 4. Input Bias Current vs. Temperature
80
T
A
= 25 C
60
700
V
S
= 15V
600
INPUT OFFSET VOLTAGE – V
40
INPUT OFFSET CURRENT – pA
0
4
8
12
POWER SUPPLY VOLTAGE – V
16
20
500
20
400
0
300
–20
200
–40
–60
100
0
–100
–50
0
50
TEMPERATURE – C
100
150
TPC 2. Input Offset Voltage vs. Power Supply Voltage
京公网安备 11010802033920号
EEWORLD
