IC,SRAM,2KX8,CMOS,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1125526212 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 120 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T24 |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.000025 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.017 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| 5962-01-348-1035 | 5962-01-189-9527 | |
|---|---|---|
| Description | IC,SRAM,2KX8,CMOS,DIP,24PIN,CERAMIC | 5962-01-189-9527 |
| Is it Rohs certified? | incompatible | incompatible |
| Objectid | 1125526212 | 1515162707 |
| Reach Compliance Code | not_compliant | not_compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 120 ns | 200 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 |
| memory density | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 |
| Number of terminals | 24 | 24 |
| word count | 2048 words | 2048 words |
| character code | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum standby current | 0.000025 A | 0.00005 A |
| Minimum standby current | 2 V | 2 V |
| Maximum slew rate | 0.017 mA | 0.014 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
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