Standard SRAM, 8KX8, 45ns, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 101234742 |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 45 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| V61C64P45L | V61C64P55 | |
|---|---|---|
| Description | Standard SRAM, 8KX8, 45ns, CMOS, PDIP28 | Standard SRAM, 8KX8, 55ns, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible |
| Objectid | 101234742 | 101234773 |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 45 ns | 55 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 |
| memory density | 65536 bit | 65536 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 |
| Number of terminals | 28 | 28 |
| word count | 8192 words | 8192 words |
| character code | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.00005 A | 0.0011 A |
| Maximum slew rate | 0.12 mA | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
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