Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 19
7.2. Start-up output frequency and signaling types .......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................. 20
9 I C/SPI Control Registers...................................................................................................................................................... 30
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 30
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 31
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 32
9.4. Register Address: 0x03. Flac-N PLL Integer Value and Flac-N PLL Fraction MSW ................................................. 33
9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 34
9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 35
2
10 I C Operation ........................................................................................................................................................................ 36
2
10.1. I C protocol ............................................................................................................................................................... 36
2
10.2. I C Timing Specification ............................................................................................................................................ 38
2
10.3. I C Device Address Modes ....................................................................................................................................... 39
Dimensions and Patterns ........................................................................................................................................................... 46
Additional Information ................................................................................................................................................................ 47
Revision History ......................................................................................................................................................................... 48
Rev 0.91
Page 3 of 48
www.sitime.com
SiT3522
340 to 725 MHz Elite™ I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
PRELIMINARY
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
340.000001
340.000001
Typ.
–
–
Max.
725.000000
500.000000
Unit
MHz
MHz
Condition
LVDS and LVPECL output driver, factory or user
programmable, accurate to 6 decimal places
HCSL output driver, factory or user programmable, accurate to
6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-20
-20
-25
-50
First Year Aging
Operating Temperature Range
F_1y
T_use
–
-20
-40
-40
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Duty Cycle
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
VIH
VIL
Z_in
DC
T_start
T_oe_hw
70%
–
–
45
–
–
–
–
–
–
±1
–
–
–
3.3
3.0
2.8
2.5
–
–
100
–
–
–
+20
+20
+25
+50
–
+70
+85
+105
Supply Voltage
3.63
3.3
3.08
2.75
–
30%
–
55
3.0
9.1
V
V
V
V
Vdd
Vdd
kΩ
%
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
OE pin
OE pin
OE pin, logic high or logic low
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1 -year aging at 25°C
Extended Commercial
Industrial
Extended Industrial. Available only for I C operation, not SPI.
2
st
Temperature Range
Input Characteristics – OE Pin
Output Characteristics
Startup and Output Enable/Disable Timing
T_oe_sw
–
–
11.8
µs
Rev 0.91
Page 4 of 48
www.sitime.com
SiT3522
340 to 725 MHz Elite™ I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
PRELIMINARY
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
I really don’t know how to ask an expert to give me some advice. It’s best if I can give you some code and ideas (the equipment doesn’t necessarily need to be told by me). If the language is written i...
Confucius met Laozi. Confucius asked: How are you doing recently? Laozi said: Nothing special. Confucius asked: How is your research going? Laozi said: I have been repeating the same old things, but I...
The 2007 Global 430DAY Seminar (China) is larger than ever before, touring 14 cities from south to north for one and a half months. MSP430 technical training was also held in Shenzhen, Beijing, Shangh...
// Communication protocol: // Receive: six digits of data // The first digit is the instruction category: 0--Modify SysId, 1--Read SysId, 2--Read current, 3--Read conversion coefficient, 4--Modify coe...
This is a load transient diagram obtained by webench simulation, but I don't understand what Vin sim:6 means? And since it is load transient, why is there no load change curve?...
Sailing is gaining more and more attention. How to use modern technology to assist training and improve competition results is particularly important. Considering the real-time data collection in t...[Details]
This paper establishes a fuel cell engine test platform based on the NI integrated hardware and software environment. This platform can realize the test and control of fuel cell engines and their a...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
introduction
At present, the research on micron and nanotechnology is very active, which has led to the rapid development of microtechnology and micro-mechanical electronic system (MEMS) t...[Details]
The power consumption of a switching power supply includes fixed losses caused by parasitic resistances such as semiconductor switches, magnetic components, and wiring, as well as switching losses ...[Details]
introduction
Sudan's Muglad Oilfield is a large oilfield jointly invested, developed and constructed by a four-party consortium of China, Malaysia, Canada and Sudan. It consists of 8 satellite...[Details]
The rotor of the brushless DC motor used in electric bicycles is composed of 30 to 40 pieces of NdFeB magnets. Since the surface magnetic field strength of NdFeB magnets exceeds 500mT, the position se...[Details]
0 Introduction
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The ways to reduce costs are: ① Use the Bluetooth data transmission...[Details]
When designing a PLC system, the control scheme should be determined first, and the next step is to select the PLC engineering design. The characteristics of the process and the application require...[Details]
Improving the coordination of material handling and internal transportation between departments in modern factories is an important measure to achieve full automation of production. Traditional mat...[Details]
0 Introduction
In the fields of petroleum, chemical industry, metallurgy, electricity, textile, light industry, water conservancy and other industries and scientific research, relevant pressur...[Details]
Background
The proliferation of ultra-low-power wireless sensor nodes for measurement and control purposes, combined with new energy harvesting techniques, has made it possible to create ful...[Details]
0 Introduction
In microwave, radar, radio and television, and communication systems, the problem of coupling RF power is often encountered. A directional coupler is a directional power divide...[Details]
1 Introduction
The ball nut is the internal thread element of the ball screw pair. Its precision directly affects the transmission quality of the ball screw pair. Due to its advantages such as...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
