TMS320C6747BZKBD4 datasheet, PDF

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TMS320C6747BZKBD4: DescriptionDigital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，228 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc

TMS320C6747BZKBD4 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA, BGA256,16X16,40
Contacts	256
Reach Compliance Code	compli
ECCN code	3A991.A.2
Address bus width	16
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	30 MHz
External data bus width	16
Format	FLOATING POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B256
JESD-609 code	e1
length	17 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	256
Maximum operating temperature	90 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1.3,1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	8192
Maximum seat height	2.05 mm
Maximum supply voltage	1.35 V
Minimum supply voltage	1.25 V
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	17 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS320C6747BZKBD4 Related Products

	TMS320C6747BZKBD4	TMS320C6745DPTPD4	TMS320C6747BZKB3	TMS320C6747BZKB4	TMS320C6747BZKBT3	TMS320C6745CPTPA3
Description	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	Fixed/Floating-Point Digital Signal Processor 176-HLQFP	Digital Signal Processors & Controllers - DSP, DSC Fixed/Floating-Point Digital Signal Proc	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	Digital Signal Processors & Controllers - DSP, DSC Fixed/Floating-Point Digital Signal Proc	Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Contains lead	Lead free	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	QFP	BGA	BGA	BGA	QFP
package instruction	BGA, BGA256,16X16,40	LFQFP, QFP176,1.0SQ,20	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	HLFQFP, QFP176,1.0SQ,20
Contacts	256	176	256	256	256	176
Reach Compliance Code	compli	compli	compli	compli	unknow	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A001.A.3
Address bus width	16	15	16	16	16	13
barrel shifter	NO	NO	NO	NO	NO	NO
bit size	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES
maximum clock frequency	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz	50 MHz
External data bus width	16	16	16	16	16	16
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	SINGLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B256	S-PQFP-G176	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G176
JESD-609 code	e1	e4	e1	e1	e1	e4
length	17 mm	24 mm	17 mm	17 mm	17 mm	24 mm
low power mode	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	4	3	3	3	4
Number of terminals	256	176	256	256	256	176
Maximum operating temperature	90 °C	70 °C	90 °C	90 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	LFQFP	BGA	BGA	BGA	HLFQFP
Encapsulate equivalent code	BGA256,16X16,40	QFP176,1.0SQ,20	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	QFP176,1.0SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	1.3,1.8,3.3 V	1.3,1.8,3.3 V	1.2,1.8,3.3 V	1.3,1.8,3.3 V	1.2,1.8,3.3 V	1.2,1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	8192	8192	8192	8192	8192	8192
Maximum seat height	2.05 mm	1.6 mm	2.05 mm	2.05 mm	2.05 mm	1.6 mm
Maximum supply voltage	1.35 V	1.35 V	1.32 V	1.35 V	1.32 V	1.32 V
Minimum supply voltage	1.25 V	1.25 V	1.14 V	1.25 V	1.14 V	1.14 V
Nominal supply voltage	1.3 V	1.3 V	1.2 V	1.3 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	AUTOMOTIVE	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	BALL	GULL WING	BALL	BALL	BALL	GULL WING
Terminal pitch	1 mm	0.5 mm	1 mm	1 mm	1 mm	0.5 mm
Terminal location	BOTTOM	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	17 mm	24 mm	17 mm	17 mm	17 mm	24 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments

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