|
TMS320LC549PGE-66 |
TMS320LC549GGUR-80 |
TMS320LC549PGE-80 |
TMS320LC549GGU-66 |
TMS320LC549GGU-80 |
| Description |
Digital Signal Processor 144-LQFP |
Digital Signal Processors & Controllers - DSP, DSC Dig Sig Processor |
Digital Signal Processor 144-LQFP |
Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc |
Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
incompatible |
conform to |
incompatible |
incompatible |
| Parts packaging code |
QFP |
BGA |
QFP |
BGA |
BGA |
| package instruction |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA144,13X13,32 |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA144,13X13,32 |
LFBGA, BGA144,13X13,32 |
| Contacts |
144 |
144 |
144 |
144 |
144 |
| Reach Compliance Code |
compli |
_compli |
compli |
_compli |
_compli |
| Address bus width |
23 |
23 |
23 |
23 |
23 |
| barrel shifter |
YES |
YES |
YES |
YES |
YES |
| bit size |
16 |
16 |
16 |
16 |
16 |
| boundary scan |
YES |
YES |
YES |
YES |
YES |
| maximum clock frequency |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
| External data bus width |
16 |
16 |
16 |
16 |
16 |
| Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
| Internal bus architecture |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PQFP-G144 |
S-PBGA-B144 |
S-PQFP-G144 |
S-PBGA-B144 |
S-PBGA-B144 |
| length |
20 mm |
12 mm |
20 mm |
12 mm |
12 mm |
| low power mode |
YES |
YES |
YES |
YES |
YES |
| Number of terminals |
144 |
144 |
144 |
144 |
144 |
| Maximum operating temperature |
100 °C |
100 °C |
100 °C |
100 °C |
100 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFQFP |
LFBGA |
LFQFP |
LFBGA |
LFBGA |
| Encapsulate equivalent code |
QFP144,.87SQ,20 |
BGA144,13X13,32 |
QFP144,.87SQ,20 |
BGA144,13X13,32 |
BGA144,13X13,32 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (number of words) |
32768 |
65536 |
32768 |
32768 |
32768 |
| Maximum seat height |
1.6 mm |
1.4 mm |
1.6 mm |
1.4 mm |
1.4 mm |
| Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage |
3 V |
3 V |
3 V |
3 V |
3 V |
| Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
GULL WING |
BALL |
GULL WING |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.8 mm |
0.5 mm |
0.8 mm |
0.8 mm |
| Terminal location |
QUAD |
BOTTOM |
QUAD |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
20 mm |
12 mm |
20 mm |
12 mm |
12 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches |
1 |
- |
1 |
- |
1 |
| Is it lead-free? |
- |
Contains lead |
- |
Contains lead |
Contains lead |