MCC
Features
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omponents
21201 Itasca Street Chatsworth
!"#
$
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SMLJ5.0
THRU
SMLJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
3000 Watt
DO-214AB
(SMLJ) (LEAD
FRAME)
G
For surface mount application in order to optimize board space
Low inductance
Low profile package
Built-in strain relief
Glass passivated junction
Excellent clamping capability
Repetition Rate( duty cycle): 0.5%
Fast response time: typical less than 1ps from 0V to BV min
Typical I
D
less than 1uA above 10V
High temperature soldering: 250 C/10 seconds at terminals
Plastic package has Underwrites Laboratory Flammability
Classification 94V-O
o
H
Mechanical Data
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D
CASE: JEDEC DO-214AB molded plastic body over
passivated junction
E
A
C
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Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
DIM
A
B
C
D
E
F
G
H
B
F
DIMENSIONS
INCHES
MIN
.079
.115
.002
.006
.030
..305
.260
.220
MAX
.103
.121
.008
.012
.050
.320
.280
.245
MM
MIN
2.00
2.92
0.051
0.152
0.76
7.75
6.60
5.59
MAX
2.62
3.07
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
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Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PPM
See Table 1 Amps
10/1000us
waveform(Note1, Fig3)
Peak Pulse Power
P
PPM
Minimum Watts
Disspation on 10/1000us
3000
waveform(Note1,2,Fig1)
Peak forward surge
I
FSM)
200.0
Amps
current (JEDEC
Method) (Note 2,3)
Operation And Storage
T
J
,
-55
o
C to
Temperature Range
T
STG
+150
o
C
SUGGESTED SOLDER
PAD LAYOUT
0.280"
0.121”
0.060”
NOTES:
o
1.
Non-repetitive current pulse per Fig.3 and derated above TA=25 C per Fig.2.
2
2.
Mounted on 8.0mm copper pads to each terminal.
3.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
www.mccsemi.com
SMLJ5.0 thru SMLJ170CA
P
PPM:
PEAK PULSE POWER, KW
PEAK PULSE POWER (P ) OR CURRENT (I
PP
)
PP
DERATING IN PERCENTAGE
MCC
100
75
50
25
0
0
25 50 75 100 125 150 175 200
T
A
, AMBIENT TEMPERATURE
Fig. 2-PULSE RATING CURVE
100
Non-Repetitive
Pulse Waveform
Shown in Figure 3
O
T
A
=25 C
10
1.0
0.1
0.1us
1.0us
10us
100us
0.1ms
1.0ms
t
d
, PULSE WIDTH, SEC
Fig. 1-PEAL PULSE POWER VS PULSE.TIME
I
PPM
, PEAK PULSE CURRENT-%
150
CJ, CAPACITANCE, pF
tf=10usec
Peak Value
I
PP
m
Half Value-1/2Ipp
T
A
=25 C
Pulse Width (td) is Defined
As the Point Where the Peak
Current Decays to 50% of I
PP
O
10
4
T
J
=25
O
C
F=1.0MH
Z
Vsig=50mV
P_P
Measured at
Zero Bias
100
1000
50
10/1000usec Waveform
as Defined by R.E.A
100
Measured at
Stand-Off
Voltage (V
MW
)
0
0
1.0
2.0
T
r
, TIME, ms
3.0
4.0
10
5.0
10
20
50
100
200
V (BR), BREAKDOWN VOLTAGE,
VOLTS
500
Fig. 3-PULSE WAVEFORM
Fig. 4-TYPICAL CAPACITANCE VS STAND-OFF
VOLTAGE
I
FSM
, PEAK FORWARD SURGE CURRENT
200
100
AMPERES
T
J
=T
J
max
8.3ms Single Half Since-Wave
Vsig=50mV
P_P
50
UNIDIRECTIONAL ONLY
10
1
5
10
50
100
NUMBER OF CYCLES AT 60H
Z
Fig-5MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CUTTENT
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Microcontroller MCU
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