TSHF5210
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm,
GaAlAs Double Hetero
FEATURES
• Package type: leaded
• Package form: T-1¾
• Dimensions (in mm):
∅
5
• Leads with stand-off
• Peak wavelength:
λ
p
= 890 nm
• High reliability
• High radiant power
94
8390
• High radiant intensity
• Angle of half intensity:
ϕ
= ± 10°
• Low forward voltage
• Suitable for high pulse current operation
DESCRIPTION
TSHF5210 is an infrared, 890 nm emitting diode in GaAlAs
double hetero (DH) technology with high radiant power and
high speed, molded in a clear, untinted plastic package.
• High modulation bandwidth: f
c
= 12 MHz
• Good spectral matching with Si photodetectors
• Lead (Pb)-free component in accordance
RoHS 2002/95/EC and WEEE 2002/96/EC
with
APPLICATIONS
• Infrared high speed remote control and free air data
transmission systems with high modulation frequencies or
high data transmission rate requirements
• Transmission systems according to IrDA requirements and
for carrier frequency based systems (e.g. ASK/FSK -
coded, 450 kHz or 1.3 MHz)
• Smoke-automatic fire detectors
PRODUCT SUMMARY
COMPONENT
TSHF5210
I
e
(mW/sr)
180
ϕ
(deg)
± 10
λ
P
(nm)
890
t
r
(ns)
30
Note
Test conditions see table “Basic Characteristics“
ORDERING INFORMATION
ORDERING CODE
TSHF5210
Note
MOQ: minimum order quantity
PACKAGING
Bulk
REMARKS
MOQ: 4000 pcs, 4000 pcs/bulk
PACKAGE FORM
T-1¾
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Reverse voltage
Forward current
Peak forward current
Surge forward current
Power dissipation
t
p
/T = 0.5, t
p
= 100 µs
t
p
= 100 µs
TEST CONDITION
SYMBOL
V
R
I
F
I
FM
I
FSM
P
V
VALUE
5
100
200
1.5
160
UNIT
V
mA
mA
A
mW
Document Number: 81313
Rev. 1.2, 04-Sep-08
For technical questions, contact: emittertechsupport@vishay.com
www.vishay.com
175
TSHF5210
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Note
T
amb
= 25 °C, unless otherwise specified
t
≤
5 s, 2 mm from case
J-STD-051, leads 7 mm,
soldered on PCB
TEST CONDITION
SYMBOL
T
j
T
amb
T
stg
T
sd
R
thJA
VALUE
100
- 40 to + 85
- 40 to + 100
260
230
UNIT
°C
°C
°C
°C
K/W
180
120
100
80
P
V
- Power Dissipation (mW)
160
140
120
100
80
60
40
20
0
0
10
20 30
40
50
60
70
80
90
100
21212
I
F
- Forward Current (mA)
R
thJA
= 230 K/W
60
40
20
0
0
10
20 30 40
50 60 70
80
90 100
R
thJA
= 230 K/W
21211
T
amb
- Ambient Temperature (°C)
T
amb
- Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER
Forward voltage
Temperature coefficient of V
F
Reverse current
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of
φ
e
Angle of half intensity
Peak wavelength
Spectral bandwidth
Temperature coefficient of
λ
p
Rise time
Fall time
Cut-off frequency
Virtual source diameter
Note
T
amb
= 25 °C, unless otherwise specified
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
I
DC
= 70 mA, I
AC
= 30 mA pp
TEST CONDITION
I
F
= 100 mA, t
p
= 20 ms
I
F
= 1 A, t
p
= 100 µs
I
F
= 1 mA
V
R
= 5 V
V
R
= 0 V, f = 1 MHz, E = 0
I
F
= 100 mA, t
p
= 20 ms
I
F
= 1 A, t
p
= 100 µs
I
F
= 100 mA, t
p
= 20 ms
I
F
= 100 mA
SYMBOL
V
F
V
F
TK
VF
I
R
C
j
I
e
I
e
φ
e
TKφ
e
ϕ
λ
p
Δλ
TKλ
p
t
r
t
f
f
c
d
120
125
180
1800
50
- 0.35
± 10
890
40
0.25
30
30
12
3.7
360
MIN.
TYP.
1.4
2.3
- 1.8
10
MAX.
1.6
UNIT
V
V
mV/K
µA
pF
mW/sr
mW/sr
mW
%/K
deg
nm
nm
nm/K
ns
ns
MHz
mm
www.vishay.com
176
For technical questions, contact: emittertechsupport@vishay.com
Document Number: 81313
Rev. 1.2, 04-Sep-08
TSHF5210
High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
BASIC CHARACTERISTICS
T
amb
= 25 °C, unless otherwise specified
Vishay Semiconductors
1000
t
P
/T = 0.01
0.02
T
amb
< 50 °C
1000
I
F
- Forward Current (mA)
Radiant Power (mW)
e
-
0.05
0.1
100
10
0.2
0.5
1
100
0.01
16031
0.1
0.1
1.0
10
100
16971
1
10
100
1000
t
P
- Pulse Duration (ms)
I
F
- Forward Current (mA)
Fig. 3 - Pulse Forward Current vs. Pulse Duration
Fig. 6 - Radiant Power vs. Forward Current
1000
1.25
Φ
e rel
- Relative Radiant Power
4
I
F
- Forward Current (mA)
1.0
100
t
P
= 100
µs
t
P
/T = 0.001
10
0.75
0.5
0.25
1
0
18873
1
3
2
V
F
- Forward
Voltage
(V)
0
800
20082
900
1000
λ
-
Wavelength
(nm)
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 7 - Relative Radiant Power vs. Wavelength
0°
10 000
10°
20°
30°
I
e rel
- Relative Radiant Intensity
I
e
- Radiant Intensity (mW/sr)
1000
40°
1.0
0.9
0.8
0.7
50°
60°
70°
80°
0.6
0.4
0.2
0
100
10
t
P
= 0.1 ms
1
1
21213
10
100
1000
15989
I
F
- Forward Current (mA)
Fig. 5 - Radiant Intensity vs. Forward Current
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 81313
Rev. 1.2, 04-Sep-08
For technical questions, contact: emittertechsupport@vishay.com
www.vishay.com
177
ϕ
- Angular Displacement
TSHF5210
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS
Compliant, 890 nm, GaAlAs Double Hetero
PACKAGE DIMENSIONS
in millimeters
A
C
± 0.15
8.7
± 0.3
7.7
± 0.15
± 0.3
(4.7)
5.8
R 2.49 (sphere)
12.5
< 0.7
35.5
± 0.55
AREA
NOT
PLANE
0.2
1.2
+ 0.1
-
5
± 0.15
± 0.25
1.5
0.5
+ 0.15
- 0.05
technical drawings
according to DIN
specification
6.544-5258.02-4
Issue: 5; 03.08.98
95 10916
0.15
0.5
+ 0.05
-
2.54 nom.
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178
For technical questions, contact: emittertechsupport@vishay.com
Document Number: 81313
Rev. 1.2, 04-Sep-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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or in any other disclosure relating to any product.
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Document Number: 91000
Revision: 18-Jul-08
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1