SURF ACE MOUNT
UNIDIREC TIONAL AND BIDIRECT IONAL
TRANSIE NT V OLTA GE S UPPRESS ORS
REVERSE VOLTAGE - 6.8 to 200 VOLTS
FORWARD CURRENT - 400 Amperes
FEATURES
Rating to 200V
VBR
For surface mou nted applications
Reiiable low cost construction utilizing
molded plastic te chnique
Plastic material has UL flammability
classification 94V-0
Fast response time: typically less than 1.0ps for
Uni-direction, less than 5.0ns for Bi-direction, form
0 Volts to BV min
SMA
.062(1.60)
.055(1.40)
.181(4.60)
.157(4.00)
.114(2.90)
.098(2.50)
MECHANICAL DA
Case: Molde d Plastic
Polarity: By cathode band denot es uni-directional
dev ice none cathode b and denotes bi-direc tional
dev ice
Weig ht: 0.002 ounce s, 0.064 grams
TA
.103(2.62)
.079(2.00)
.060(1.52)
.030(0.76)
.208(5.28)
.188(4.80)
.012(.305)
.006(.152)
.008(.203)
.002(.051)
Rating at 25
ambient temperaature unless
otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
MAXIMUM RA
TINGS AND
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS
Pea k Power Dissipation at T
TP= 1ms(No te 1,2 )
A
=25
SYMBOL
P
PK
VALUE
Minimum 400
UNIT
WATTS
Peak Forward Surge Current
8.3ms single half sine-wave
super imposed on rated load (JEDEC Method)
Steady State Power Dissipation at TL=75
I
FSM
40
1.0
AMPS
P
M(AV)
WATTS
Maximum Instantaneous forward voltage
at 25A for unidirectional devices only (Note 3)
V
F
3.5
VOLTS
Operating Temperature Range
T
J
-55 to +125
-55 to +150
Storage Temperature Range
T
STG
NOT ES:1 . No n-repetitive current pulse, per Fig. 3 and derated above T
A
=25 per Flg. 1.
2 . Thermal Resistance Junction to Lead.
3. 8 . 3ms s ingle h alf sine- wave duty c ycle=4 puls es per m inutes ma ximum (uni-direction al units only).
FIG. 1 - PULS E DERA TING CUR VE
100
60
50
FIG. 2 - M AXIMUM NON -REP ETIT IVE
SUR GE CUR REN T
P E AK P U LS E D E R AT IN G IN % O F
P E AK P O W E R O R C U R R E N T
PEAK FORWARD SURGE CURRENT,
AMPERES
75
40
30
20
10
0
1
Pulse Wld th 8.3ms
Single Hia f-Sine- Wave
(JEDEC M ETHOD )
50
25
10 1000 WA VEFORM
AS DEFINED BY R.E.A.
0
0
25
50
75
100
125
150
175
200
2
5
10
20
50
1
00
T
A
AMBIENT TEM PERATURE,
NUM BER OF CYCLE S 60Hz
FIG.3 - PULSE
TR =1 0u s
WAVEFORM
10000
FIG . 4 - T YP IC AL JU NC TIO N C APA CI TAN CE
I
P
, P E A K P U L S E C U R R E N T, ( % )
100
Peak value (I
RSM)
Half value=
I
RSM
C APAC ITA N C E ,(
2
Un
50
Pulse width (T
P
) is defined
as that point where the
peak current decays to
50% of I
RSM
T
J
=25
10
1000 waveform as
defined by R.E.A.
10 00
i-d
ir
ec
tio
na
l
TJ=25
F)
P
1 00
Bi
-di
rec
tio
n
al
TP
0
0
1.0
2.0
3.0
4.0
10
T,TIME (ms)
1
4
REVER SE VOLTAGE, VOLTS
10
100
1000
FIG. 5 - PULSE RATING CURV
100
E
1.0
FIG. 6 - STEAD Y ST ATE POWER
DERAT ING CUR VE
P
P
, P E AK P O W E R (
10
0.6
0.4
1.0
STEADY STATE POWER DISSIPATION (W)
TA=2 5
NON-RE PETIVE
PULSE WA VEFOR M
SHOWN IN FI G. 3
0.8
W)
5.0mm LEAD AREAS
0.2
60Hz RESISTIVE OR
INDUCTIVE LOAD
M(AV),
0.1
K
P
0.1us
1.0us
10us
TP, PU
100us
LS E W IDT H
1.0
ms
10ms
0.0
0
25
5
0
75
100
125
150
175
200
TL, LE AD TE MP ER ATU RE
Microcontroller MCU
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