• Transformer Coupled Across 70 ohms, Measured on Stub:
• BU-63147/157XX-XX0
• BU-63147X3-XX2 (Note 9)
Output Noise, Differential (Direct Coupled)
Output Offset Voltage, Transformer Coupled Across 70 ohms
Rise/Fall Time
• BU-63147/157X3
• BU-63147X4
LOGIC
V
IH
V
IL
I
IH
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
I
IL
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
V
OH
(Vcc=4.75V,I
OH
=max)
V
OL
(Vcc=4.75V,I
OH
=max)
I
OL
I
OH
6
18
20
-250
100
200
7
20
22
150
150
250
9
27
27
10
250
300
300
Vp-p
Vp-p
Vp-p
mVp-p, diff
mVp-p, diff
ns
ns
2.0
20
-100
2.4
0.4
3.4
-3.4
0.8
100
-20
V
V
µA
µA
V
V
mA
mA
POWER SUPPLY REQUIREMENTS
Voltages/Tolerances
• +5V
Current Drain (Total Hybrid)
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
4.75
5.0
80
199
286
455
80
210
308
500
5.25
100
229
348
535
100
240
370
580
V
mA
mA
mA
mA
mA
mA
mA
mA
Data Device Corporation
www.ddc-web.com
3
BU-63147
R-10/14-0
TABLE 1. BU-63147/157 SPECIFICATIONS (CONT.)
PARAMETER
POWER DISSIPATION (NOTE 10)
Total Hybrid
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
Hottest Die
BU-63147/157/XX-XX0
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
THERMAL
• Thermal Resistance, Junction-to-Case, Hottest Die (θ
JC
)
• Operating Junction Temperature
• Storage Temperature
• Lead Temperature (soldering, 10 sec.)
PHYSICAL CHARACTERISTICS
Size
36-Pin DIP
36-Lead Flat pack
Weight
MIN
TYP
MAX
UNITS
0.4
0.65
0.73
0.88
0.4
0.7
0.84
1.1
0.2
0.43
0.59
0.78
0.2
0.48
0.7
1.00
0.5
0.8
1.04
1.28
0.5
0.85
1.15
1.50
0.25
0.6
0.84
1.13
0.25
0.65
0.95
1.35
12
150
150
+300
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
°C/W
°C
°C
°C
-55
-65
1.900 x .800 x .205
(48.26 x 20.32 x 5.21)
1.900 x .800 x .200
(48.26 x 20.32 x 5.08)
0.6
(17)
in.
(mm)
in.
(mm)
oz
(g)
Notes:
Notes 1 through 6 are applicable to the Receiver Differential Resistance and Differential Capacitance specifications:
(1) Specifications include both transmitter and receiver (assumed tied together externally).
(2) Impedance parameters are specified directly between pins TX/RX A(B) and TX/RX A(B) hybrid.
(3) It is assumed that all power and ground inputs to the hybrid are connected and that the hybrid case is connected to ground for the impedance measurement.
(4) The specifications are applicable for both unpowered and powered conditions.
(5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz.
(6) Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested.
(7) The Threshold Level, as referred to in this specification, is meant to be the maximum peak-to-peak voltage (measured on the data bus) that can be applied to the
receiver's input without causing the output to change from the OFF state.
(8) Assumes a common mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer
coupled), and referenced to transceiver ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum
CMRR.
(9) MIL-STD-1760 requires minimum output voltage of 20 Vp-p on the stub connection. The -XX2 option is
not
available for the BU-63147X4 or BU-63157 versions.
(10) Power dissipation specifications assume a transformer coupled configuration, with external dissipation (while transmitting) of 0.14 watts for the active isolation trans-
former, 0.08 watts for the active coupling transformer, 0.45 watts for each of the two bus isolation resistors, and 0.15 watts for each of the two bus termination resistors.
(11) Assuming the use of isolation transformers with the turns ratios shown in Figure 3 and in the absence of common mode signal on the 1553 stub, this equates to a
nominal stub voltage of 38 Volts
PK-to-PK
transformer-coupled, or 53 Volts
PK-to-PK
direct-coupled.
Data Device Corporation
www.ddc-web.com
4
BU-63147
R-10/14-0
TABLE 2. BU-63157 RADIATION SPECIFICATIONS*
PART NUMBER
BU-63157X3
TOTAL DOSE
100 KRAD
SINGLE EVENT
LATCHUP
IMMUNE
INTRODUCTION
The BU-63147/157 is a dual redundant transmitter and receiver
packaged in a 36-pin DDIP or flat pack. It is directly compatible to
Harris 15530 encoder/decoder and has internal (factory preset)
threshold levels. The dual transceiver only requires +5V power
and conforms to MIL-STD-1553A and 1553B. For McAir compat-
ibility, versions are available with rise/fall times of 200 to 300
nsec.
Figure 3 illustrates the connection between a BU-63147/157
transceiver and a MIL-STD-1553 Data Bus. After transformer
isolating the transceiver, it can be either direct coupled (short
stub) or transformer coupled (long stub) to the Data Bus.
*Note: Radiation parameters specified on this data sheet are derived from initial
qualification testing by DDC and published data from ASIC manufacturers. These
devices have not been evaluated for compliance to the RHA requirements stipu-
lated in MIL-PRF-38534, Appendix G.
TABLE 3. HIGH RELIABILITY SCREENING OPTIONS
FOR BU-63157
ELEMENT EVALUATION
Visual Inspection:
Integrated Circuits
Transistor & Diodes
Passive Components
METHOD
TRANSMIT OPERATING MODE
MIL-STD-883, Method 2010 Condition A
MIL-STD-750, Method 2072 and 2073
MIL-STD-883, Method 2032 Class S
SEM Analysis for Integrated MIL-STD-883, Method 2018
Circuits
Element Evaluation:
Visual, Electrical, Wire
Bondability, 24-Hour
Stabilization Bake, 10
Temperature Cycles,
5000 g’s constant accelera-
tion, 240-Hour Powered
Burn-In and 1000-Hour Life
Test (Burn-In and 1000-
Hour Life Test are Only
Required for Active
Components.)
ASSEMBLY & TEST
Particle Impact Noise
Detection (PIND)
320-Hour Burn-In
(Standard on this device)
100% Non-Destructive
Wirebond Pull
(Standard on this device)
Radiographic (X-Ray)
Analysis
QCI TESTING
Extended Temperature
Cycling:
20 Cycles Including
Radiographic (X-Ray)
Testing
Moisture Content Limit of
5000 PPM
MIL-STD-883, Method 2020
Condition A
MIL-STD-883, Method 1015
The transmitter section accepts encoded TTL data and converts
it to phase-modulated bipolar form using a waveshaping network
and driver circuits. The driver outputs TX DATA OUT and TX DATA
OUT are transformer coupled to the Data Bus.
The transmitter output terminals can be put into a high imped-
ance state by setting INHIBIT high, or setting TX DATA IN and TX
DATA IN to the same logic level. The operating modes are shown
in TABLE 4.
The transceivers are able to operate in a “wraparound” mode.
This allows output data to be monitored by the receiver section
and returned to the decoder where it is checked for errors.
MIL-PRF-38534
TABLE 4. TRANSMIT OPERATING MODE
TX DATA IN
X
0
0
MIL-STD-883, Method 2023
1
1
MIL-STD-883, Method 2012
TX DATA IN
X
0
1
0
1
TX INHIBIT
H
X
L
L
X
DRIVER OUTPUT
OFF (NOTE)
OFF
TX DATA OUT ON,
TX DATA OUT OFF
TX DATA OUT ON,
TX DATA OUT OFF
OFF
NOTE: DRIVER OUTPUT terminals are in the high impedance mode during
I have come across a rather frustrating problem, can anyone help me solve it? This is such a stupid question, I don't even know how to ask it! Question: When using a single-chip microcomputer to contr...
Hello, I am currently designing FPGA. I need power conversion. Can anyone with experience recommend me some chips? Conversion 1: 24V-±5V (+5V>3A;-5V>1A;)) Conversion 2: 5V-3.3V/1.2V (1A) Temperature r...
1. If we had never met in life, I would still be the same me, occasionally dreaming, and then, I would start running around day after day, drowning in this noisy city. I would not understand that ther...
1. Proficient in VC++ programming, with more than 2 years of VC programming experience; those with WINDOWS CE programming experience are preferred; 2. Familiar with basic technologies such as MFC inte...
Commonly used embedded operating systems include the following
uC/OSII system;RTthread system;uCLinux system;FreeRTOS system;RTX system;ArmLinux system;VxWorks system;RTEMS system;pSOS system;Nucleu...
There is an FM Deviation Sen for FM transmitter testing. What does it refer to and how to test it? What does Pilot Deviation refer to and how to test it?...
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
Long ago, the lifespan of cars in my country was 15 years. Once a car reached 15 years old, it was forced to be scrapped. However, the policy was later changed. As long as the car does not exceed 6...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
With the increasing popularity of automated equipment, linear modules, a common auxiliary device for automated equipment, have also seen a bright future. In particular, in recent years, many small ...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
The screen is the first thing you notice when evaluating a phone's quality. Its quality directly impacts both visual and operational performance. However, understanding mobile phone screens r...[Details]
Driven by business opportunities such as access to new markets and government initiatives like the Belt and Road Initiative, global expansion has become a significant trend for Chinese companies. C...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
