5962-01-238-2672 datasheet, PDF

5962-01-238-2672: DescriptionIC,DECODER/DEMUX,2-TO-4-LINE,HCT-CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size175KB，5 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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5962-01-238-2672 Overview

IC,DECODER/DEMUX,2-TO-4-LINE,HCT-CMOS,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	114527375
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-XDIP-T16
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.004 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	45 ns
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	5962-01-238-2672
Description	IC,DECODER/DEMUX,2-TO-4-LINE,HCT-CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible
Objectid	114527375
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-XDIP-T16
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.004 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	45 ns
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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