Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 19
7.2. Start-up output frequency and signaling types .......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................. 20
C/SPI Control Registers...................................................................................................................................................... 30
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 30
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 31
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 32
9.4. Register Address: 0x03. Frac-N PLL Integer Value and Frac-N PLL Fraction MSW ................................................ 33
9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 34
9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 35
10 I
2
C Operation ........................................................................................................................................................................ 36
10.1. I
2
C protocol ............................................................................................................................................................... 36
10.2. I
2
C Timing Specification ............................................................................................................................................ 39
10.3. I
2
C Device Address Modes ....................................................................................................................................... 40
Dimensions and Patterns ........................................................................................................................................................... 47
Additional Information ................................................................................................................................................................ 48
Revision History ......................................................................................................................................................................... 49
Rev 1.00
Page 3 of 49
www.sitime.com
SiT3542
340 to 725 MHz Endura™ Series I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
340.000001
340.000001
Typ.
–
–
Max.
725.000000
500.000000
Unit
MHz
MHz
Condition
LVDS and LVPECL output driver, factory or user
programmable, accurate to 6 decimal places
HCSL output driver, factory or user programmable, accurate to
6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-20
-20
-25
-50
First Year Aging
F_1y
–
–
–
–
–
±1
–
–
–
+20
+20
+25
+50
–
ppm
ppm
ppm
ppm
ppm
1
st
-year aging at 25°C
Temperature Range
Operating Temperature Range
T_use
-20
-40
-40
+70
+85
+105
°C
°C
°C
Extended Commercial
Industrial
Extended Industrial. Available only for I
2
C operation, not SPI.
Rugged Characteristics
Acceleration (g) sensitivity,
Gamma Vector
Supply Voltage
F_g
–
–
0.1
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
V
V
V
V
ppb/g
Low sensitivity grade; total gamma over 3 axes; 15 Hz to
2 kHz; MIL-PRF-55310, computed per section 4.8.18.3.1
Input Characteristics – OE Pin
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
–
Vdd
Vdd
kΩ
OE pin
OE pin
OE pin, logic high or logic low
Output Characteristics
Duty Cycle
DC
45
–
–
55
%
Startup and Output Enable/Disable Timing
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
T_start
T_oe_hw
3.0
9.1
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
T_oe_sw
–
–
11.8
µs
Rev 1.00
Page 4 of 49
www.sitime.com
SiT3542
340 to 725 MHz Endura™ Series I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
This electronic program is called engineering production program. Seeing many hard-working learners in the forum, I hope I can help you. If you have any questions about the program, please contact QQ2...
After setting up the project, you can finally start the project. First, get familiar with the development board and implement the LED and button functions. 1. Modify and write 2 function files respect...
[i=s] This post was last edited by johnrey on 2015-11-22 00:50 [/i] [size=4]Schematic diagramSimple flow chartVideo [/size] [size=4] [size=4] [size=4] [media=swf,500,375] http://player.youku.com/playe...
I have added the HIVE registry component, but I don't know how to modify the registry. The current content in nandflash.reg is as follows: ; HIVE BOOT SECTION [HKEY_LOCAL_MACHINE\Drivers\BuiltIn\NandF...
This is actually the lamp head of a foldable LED desk lamp. One day, I accidentally dropped the desk lamp on the ground and the lamp head broke. I was going to throw it away, but when I was about to p...
Everyone buys components in local places. I am a component salesman and I don’t know how to find customers. I would like to ask you masters where do you purchase.
I work with imported materials such a...
ZTE
The communication embargo incident has impacted the communication industry and sounded the alarm for the semiconductor industry. Let's follow the embedded editor to learn more about the r...[Details]
In our common sense, the word technology often has two definitions. The first is the technology sealed in the laboratory. They are like flowers on the mountain top. Only a few people on the mountai...[Details]
China Energy Storage Network News:
According to reports, in order to reduce carbon emissions, a group of Japanese technology and energy companies are launching a pilot project that aims to al...[Details]
1. Photovoltaic inverter installation process
1. Preparation before installation
Are the product accessories, installation tools and parts complete? Is the installation environmen...[Details]
This part of the code in the void SystemClock_Config(void) function in the main file generated by stm32cubemx RCC_OscInitStruct.OscillatorType = RCC_OSCILLATORTYPE_HSE; This bug occurs, and the f...[Details]
From small households to large enterprises, energy consumption has always been a concern for everyone. The energy consumption of Chinese enterprises has always been high, and the country has also wor...[Details]
Using the WWDG of STM32F030, it is found that the MCU will not be reset under STOP, just like the sleep mode of STM8S. Paste the watchdog code: /******************************************************...[Details]
The first one is a DMA mode of multiple channel acquisition void ADC_DMA_Config(void) { ADC_InitTypeDef ADC_InitStructure; RCC_HSICmd(ENABLE); while (RCC_GetFlagStatus(RCC_FLAG_HSIRDY) == RESET); ...[Details]
Please help me analyze the clock cycles occupied by the following delay program. Seek to explain: DELAY: MOV R6, #13 DELAY1: MOV R5, #250 DELAY2: NOP DJNZ R5, DELAY2 DJNZ R6, DEL...[Details]
Mobile phone battery charger program made by STC12C2052AD microcontroller #include stc12c2052ad.h #include intrins.h #define uchar unsigned char #define uint unsigned int sbit REF =P1^0; sbi...[Details]
At CES 2018, Samsung launched a 146-inch giant TV, The Wall. This is Samsung's first product developed using
MicroLED
technology. It not only has ultra-high picture quality and contrast, bu...[Details]
1 Main features of EM78P447S The EM78 series of MCUs are 8-bit high-cost-effective MCUs manufactured by Taiwan Elan Electronics Co., Ltd. using CMOS technology. This series of MCUs generally have bui...[Details]
Scientists have developed an
electronic skin
that allows users to manipulate virtual objects remotely
, which will further enhance the user's immersive virtual experience. Let's follow the ...[Details]
In a photovoltaic system, a photovoltaic array is usually formed by connecting multiple components in series and parallel. Due to the inconsistency of the electrical parameters of the components ...[Details]
51mcu
京公网安备 11010802033920号
EEWORLD
