RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Features:
•
•
•
•
•
Higher power ratings than standard thick film chips
Absolute TCRs to ± 100 ppm/C
Inner termination engineered to deter sulfur contamination
Absolute tolerances to 1%
RoHS compliant, lead free and halogen free
Electrical Specifications
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
(1)
(2)
Power Rating (W)
(1)
@ 70°C
0.1
0.125
0.25
0.5
Maximum Working
Voltage (V)
(2)
50
150
200
Maximum Overload
Voltage (V)
100
300
400
TCR (ppm/ºC)
Ohmic Range (Ω) and Tolerance
1%, 5%
1 - 10K
1 - 47K
1 - 100K
± 100
Power rating for each package size is valid if ambient temp ≤ 80ºC and terminal temp ≤ 105ºC
Lesser of √PR or maximum working voltage
Certain resistance values will require a higher minimum order quantity. Contact Stackpole Customer Service for details.
Please refer to the High-Power Resistor Application Note (page 5) for more information on designing and implementing high power
resistor types.
Mechanical Specifications
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
L
Body Length
0.039 ± 0.004
1.00 ± 0.10
0.061 ± 0.008
1.55 ± 0.20
0.079 ± 0.006
2.00 ± 0.15
0.122 ± 0.008
3.10 ± 0.20
W
Body Width
0.020 ± 0.002
0.50 ± 0.05
0.031 ± 0.004
0.80 ± 0.10
0.049 ± 0.006
1.25 ± 0.15
0.059 ± 0.008
1.50 ± 0.20
H
Body Height
0.012 ± 0.002
0.30 ± 0.05
0.016 ± 0.006
0.40 ± 0.15
0.020 ± 0.006
0.50 ± 0.15
0.020 ± 0.006
0.50 ± 0.15
a
Top Termination
0.010 ± 0.006
0.25 ± 0.15
0.012 ± 0.008
0.30 ± 0.20
0.016 ± 0.010
0.40 ± 0.25
0.022 ± 0.024
0.55 ± 0.60
b
Bottom Termination
0.012 ± 0.006
0.30 ± 0.15
0.014 ± 0.010
0.35 ± 0.25
0.020 ± 0.012
0.50 ± 0.30
0.024 ± 0.012
0.60 ± 0.30
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Performance Characteristics
Test Item
Temperature Coefficient
of Resistance
Short Time Overload
High Temperature
Exposure (Storage)
Reference Standard
MIL-STD-202F Method 304;
JIS-C5201-1-4.8
MIL-R-55342D Paragraph 4.7.5;
JIS-C5201-1-4.13
MIL-STD-202
Method 108
Condition of Test
+ 25 ~ +125ºC
2.5 times rated voltage for 5 seconds.
1000 hours at T = 125ºC. Unpowered.
Measurement at 24 ± 2 hours
after test conclusion.
Test Limits (ΔR)
±100 ppm/ºC
F: ± (1% + 0.1 Ω)
J: ± (2% + 0.1 Ω)
F: ± (2% + 0.1 Ω)
J: ± (2% + 0.1 Ω)
Rev Date: 03/09/2020
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Performance Characteristics (cont.)
Test Item
Temperature Cycling
Reference Standard
JESD22
Method JA-104
MIL-STD-202
Method 106
MIL-STD-202
Method 103
Condition of Test
1000 cycles (-55ºC to +125ºC).
Measurement at 24 ± 2 hours
after test conclusion.
1000 hours, T = 24 hours/cycle
Notes: Steps 7a & 7b not required.
Unpowered.
1000 hours 85ºC / 85% RH.
Specified conditions: 10% of operating
power. Measurement at 24 ± 2 hours
after test conclusion.
1000 hours TA = 125ºC at rated power.
Measurement at 24 ± 2 hours after test
conclusion. Remark: Mounted quantity:
Mounted 2 pieces on 1 PCB.
Condition B: Immerse the specimens in an
eutectic solder at 260 ± 5ºC
for 10 ± 1 seconds.
245 ± 5ºC solder, 2 ± 0.5 seconds. dwell
Solder: Sn 96.5 / Ag 3.0 / Cu 0.5.
3 mm deflection.
Pressure X kgf a R0.5 pressure rod
for 60 seconds.
0201: NA
0402: 0.5 Kg, 0805: 1 Kg
0603: 0.5 Kg, 1206: 1.8 Kg
Test Limits (ΔR)
F: ± (0.5% + 0.05 Ω)
J: ± (1% + 0.1 Ω)
Note: R ≤ 10 Ω: F/J: ± (1% + 0.1 Ω)
F: ± (1% + 0.05 Ω)
J: ± (2% + 0.1 Ω)
F: ± (3% + 0.1 Ω)
J: ± (3% + 0.1 Ω)
Moisture Resistance
Biased Humidity
Operational Life
MIL-STD-202
Method 108
MIL-STD-202
Method 210
J-STD-002
AEC-Q200-005
F: ± (1% + 0.05 Ω)
J: ± (3% + 0.1 Ω)
F: ± (0.5% + 0.05 Ω)
J: ± (1% + 0.1 Ω)
>95% area covered with tin
F: ± (0.5% + 0.05 Ω)
J: ± (1% + 0.1 Ω)
F: ± (0.5% + 0.05 Ω)
J: ± (1% + 0.1 Ω)
Resistance to Soldering
Heat
Solderability
Board Flex (Bending)
Terminal Strength (SMD)
AEC-Q200-006
Operating temperature range is -55°C to +155°C
Power Derating Curve:
100
80
-55 ºC
70 ºC
Power Load (%)
60
40
20
155 ºC
0
-60
0
20
40
60
80
100
120
140
160
180
Ambient Temperature (ºC)
Rev Date: 03/09/2020
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Packaging Specifications
RNCP0402
(2 mm Pitch Paper)
RNCP0603, 0805, 1206
(4 mm Pitch Paper)
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
Paper Tape Pitch
0.079
2.00
0.157
4.00
0.157
4.00
0.157
4.00
P1
0.079 ± 0.004
2.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
A
0.028 ± 0.002
0.70 ± 0.05
0.043 ± 0.004
1.10 ± 0.10
0.063 ± 0.006
1.60 0.15
0.079 ± 0.006
2.00 ± 0.15
P2
0.079 ± 0.004
2.00 ± 0.10
0.079 ± 0.002
2.00 ± 0.05
0.079 ± 0.002
2.00 ± 0.05
0.079 ± 0.002
2.00 ± 0.05
B
0.047 ± 0.002
1.20 ± 0.05
0.075 ± 0.004
1.90 ± 0.10
0.094 ± 0.008
2.40 ± 0.20
0.142 ± 0.008
3.60 ± 0.20
P0
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
W
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
D0(ø
)
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
E
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
T
0.018 ± 0.004
0.45 ± 0.10
0.025 ± 0.004
0.64 ± 0.10
0.033 ± 0.004
0.84 ± 0.10
0.033 ± 0.004
0.84 ± 0.10
F
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Rev Date: 03/09/2020
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Reel Specifications
Type / Code
RNCP
ØA
7.008 ± 0.079
178.00 ± 2.00
ØB
2.362 ± 0.039
60.00 ± 1.00
Øc
0.512 ± 0.039
13.00 ± 1.00
W
0.354 ± 0.039
9.00 ± 1.00
T
0.453 ± 0.039
11.50 ± 1.00
Unit
inches
mm
Peel-off Force Specifications
Peel-off force of paper and blister tape is in accordance with “JIS-C5202”, that is, 0.1 to 0.7N at a
peel-off speed of 300 mm/minute.
Solder Land Pattern
Type / Code
0402
0603
0805
1206
A
0.016
0.40
0.026
0.65
0.039
1.00
0.079
2.00
B
0.059
1.50
0.083
2.10
0.118
3.00
0.165
4.20
C
0.024
0.60
0.035
0.90
0.051
1.30
0.063
1.60
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Rev Date: 03/09/2020
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Recommended IR – Reflow Profile
(Solder: Sn96.5 / Ag3 / Cu0.5)
Peak: 250 +5 / -0 °C, 5 seconds
Pre-heat Zone: 150 °C to 180 °C, 90 ± 30 seconds
Soldering Zone: 230 °C or higher, 30 ± 10 seconds
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors, which have had higher power
ratings than standard resistor chips. This has caused some uncertainty and even confusion by users as to how to reliably use these
resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated power assumes an ambient
temperature of no more than 100°C for the CSS / CSSH series and 70°C for all other high power resistor series. In addition, IPC and
UL best practices dictate that the combined temperature on any resistor due to power dissipated and ambient air shall be no more than
105°C. At first glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR ½ 100 milliohms
at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with its unique materials, design, and processes
would have less heat rise and therefore would be easier to implement for any given customer.
Rev Date: 03/09/2020
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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