5962-8606301XX datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> 5962-8606301XX

5962-8606301XX: DescriptionUVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28; Categorystorage storage; File Size111KB，19 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

Download Datasheet Parametric View All

5962-8606301XX Overview

UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28

5962-8606301XX Parametric

Parameter Name	Attribute value
Objectid	2081031470
package instruction	0.600 INCH, WINDOWED, CERDIP-28
Reach Compliance Code	unknown
Maximum access time	200 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
length	37.215 mm
memory density	262144 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.72 mm
Maximum standby current	0.0003 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Add three vendors, 18324, 1FN41, and 66579. Add device types 04, 05,

06, and 07. Add margin test method C. Update vendor's PIN. Change

code indent. no. to 67268. Editorial changes throughout.

Add device type 08 with vendors CAGE 1FN41 and CAGE 66579.

Added time temperature regression equation for unbiased bake.

Removed vendor CAGE 66302. Made technical changes to table I, 4.2

back end margin test method step 3, 4.3.1 step C, table II, and table III.

Editorial changes throughout. Added vendor's PIN from XMB/883 to

either LM/883 for appropriate device types. Deleted the top CE waveform

on figure 6. This was incorrect for this device.

Added vendor CAGE 34335 to the drawing as a source of supply for

device types 01 through 07. Add vendor CAGE number 66579 to device

types 01 through 04, also add vendor CAGE number 01295 to devices

04XX and 05XX. Add test condition A to 4.2 and 4.3.2. Add margin test

method E for vendor CAGE number 34335. Change to vendor similar

PIN for vendor CAGE numbers 1FN41 and 66579. Change to figure 3,

margin test method C for vendor CAGE 01295 and change to

programming waveforms. Change to 4.5. Editorial changes throughout.

Add case outline Z for vendor CAGE number 1FN41.

Changes in accordance with NOR 5962-R130-92.

Add case outline U. Add device types 09 and 10. Remove vendor

27014 from drawing. Editorial changes throughout.

Changes in accordance with NOR 5962-R118-94.

Updated boilerplate. Added device types 11-21. Removed vendors

1FN41, 18324, 34335, and 61394 from drawing. Added vendor 65786

to drawing. Removed margin test methods from drawing.

DATE

(YR-MO-DA)

87-12-17

APPROVED

M. A. Frye

89-01-01

M. A. Frye

90-12-05

M. A. Frye

92-01-30

93-10-15

94-02-16

97-06-11

M. A. Frye

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

CURRENT CAGE CODE 67268

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

REV

SHEET

PMIC N/A

PREPARED BY

James E. Jamison

CHECKED BY

Charles Reusing

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

87-02-12

REVISION LEVEL

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 262,144-BIT

UV ERASABLE PROM, MONOLITHIC SILICON

SIZE

SHEET

CAGE CODE

14933

5962-86063

AMSC N/A

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E112-97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of

this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue

of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.

SPECIFICATION

MILITARY

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

MILITARY

MIL-STD-883 - Test Methods and Procedures for Microelectronics.

MIL-STD-973 - Configuration Management.

MIL-STD-1835 - Microcircuit Case Outlines.

HANDBOOKS

MILITARY

MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device

class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.2 Truth table. The truth table shall be as specified on figure 3.

3.2.2.1 Unprogrammed or erased devices. The truth table for unprogrammed devices shall be as specified on figure 3.

3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.

SIZE

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

DSCC FORM 2234

APR 97

REVISION LEVEL

5962-86063

SHEET

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical

performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating

temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical test

for each subgroup are described in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked

as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the

manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator

shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M

shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer

prior to delivery.

3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics

specified in 4.5.

3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures

and characteristics specified in 4.6.

3.6.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern

or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper

state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot.

3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed

manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing

shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or

for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.9 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)

involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.

3.10 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available

onshore at the option of the reviewer.

3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit

group number 42 (see MIL-PRF-38535, appendix A).

SIZE

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

DSCC FORM 2234

APR 97

REVISION LEVEL

5962-86063

SHEET

Recommended Resources

DC power supply circuit for semiconductor radio

Electric hoist remote control electrical wiring

Current expansion circuit diagram of DN-25

Cosine conversion circuit diagram

STK457 power amplifier circuit

Cordless phone doubles as remote control circuit

Date in spring + go out and get a sea bass: 5.1 When I have nothing to do, I go out for some lure fishing. I've never played this before, and I didn't quite believe that fish would bite, but this time I really believed it......; strong161 Talking

【Multi-function open source custom macro keyboard】Bluetooth keypad project construction and experiment: The project mainly uses esp32-s3 as the main control to build the keyboard, and the development environment is PlatformIO The development board used is ESP32-S3-DevKitC-1 Create a project step by step...; qwert1213131 DigiKey Technology Zone

Huang Zhiwei uses bypass capacitors to reduce the output voltage VO and feeds it back to the amplifier pre-stage input through the power supply.: [i=s] This post was last edited by paulhyde on 2014-9-15 09:00 [/i] Huang Zhiwei uses bypass capacitors to reduce the output voltage VO and feeds it back to the amplifier pre-stage input through the p...; 黄智伟 Electronics Design Contest

Chapter 10, Part 3, "10.5 Memory Protection Unit (MPU) Firmware Library Functions": ...; 平湖秋月 Microcontroller MCU

About mt9d111 camera sensor: Has anyone in the forum used mt9d9111 camer sensor? This is my first time to develop a camera driver. I don't know where to start....; zw357234798 Microcontroller MCU

IAR compilation error: An error occurred after compiling, and I don’t know how to modify it Error[Li006]: duplicate definitions for “AI2_Cal_4"; in "E:\DEH卡\ARM source\source\EWARMv5\Debug\Obj\ARMcommtoSTC.o",and "E:\DEH卡\A...; eeleader MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components