Customer Specific Product Data Sheet
VTB4-1000-20M000
CMOS TCXO
Pin Information
Table 1. Pin Function
Pin
Symbol
1
7
8
14
NC
GND
Output
V
DD
Function
No Connect
Case Ground
CMOS Output waveform
Power Supply Voltage (3.3 V
±
5%)
Performance Characteristics
Table 2. Electrical Performance
Parameter
Nominal Output Frequency
Supply Voltage
1
Symbol
f
0
V
DD
T
OP
T
stor
I
DD
V
OH
V
OL
I
OH
I
OL
Minimum
-
3.14
0
-40
Typical
20.000
3.3
Maximum
-
3.47
+70
+85
20
Units
MHz
V
°C
°C
mA
V
Operating Temperature Range
Storage Temperature
Supply Current
Output Voltage Levels (from V
DD
)
High
Low
Output Current Levels
High
Low
Output Rise/Fall Time
2
3
2.2
0.40
mA
-4.0
+4.0
5
40
-4.6
60
+4.6
ns
%
ppm
t
R
/t
F
D
deltaf/f
O
Output Duty Cycle or Symmetry
Stability over operating temperature/initial
tolerance/ 15 years aging/ power supply and load
variation
Jitter, 10Hz to 20MHz, RMS
Jitter, 12kHz to 20MHz, RMS
Phase Noise
10 Hz
100 Hz
1kHz
10kHz
100kHz
Start Up Time
2
0.5
5
1
pS
pS
dBc/Hz
-70
-100
-125
-135
-140
T
su
10
mS
1. A 0.1
µF
low frequency ceramic bypass capacitor in parallel with a 0.01
µF
high frequency ceramic capacitor is
recommended.
2. Figure 1 defines these parameters. Figure 2 illustrates the operating conditions.
3. Duty cycle is defined as (on time/period) per Figure 1.
4. Measured using a Wavecrest DTS2075 or equivalent.
Vectron International
•267
Lowell Rd, Hudson, NH 03051
•
Tel: 1-88-VECTRON-1• http://www.vectron.com
1/3
VTB4-1000
t
R
t
F
+
-
I
D D
4
V
DD
V
O H
50%
.
1µF
. 0 1µF
1
2
3
1 5pF
V
OL
On Time
Period
Figure 1. Output Waveform
Figure 2. Output Test Conditions (25±5°C)
Recommended Reflow Profile:
This oscillator contains a quartz crystal which is susceptible to damage if handled roughly or dropped.
Transportation and handling should be carefully performed. ESD precautions should be taken. When
stored, units should be kept in conductive containers and only handled at properly grounded workstations
by operators using proper ESD procedures.
We recommend hand placing and hand soldering units into a PCB. The soldering tip and temperature
should be appropriate for 60/40 type solder. Once installed and inspected a non-aqueous board wash is
recommended. If cleaning is required then a manual brush cleaning with an appropriate solvent is
recommended. Care should be given to prevent mechanical shock to the unit.
If not hand placed then we recommend the following solder profile:
Figure 4 IR Reflow Diagram
VTB4-1000
13.7 +/- 0.3
mm
11.5+/-0.3
mm
5.0 mm max
1.73+/-0.2
mm
20.3 +/- 0.3
mm
1.73 +/-0.2
mm
Figure 4. Outline Diagram
Figure 5. Suggested Pad Layout
VTB4-1000
Ordering Information:
VTB4-1000-20M000
Table 4. Revision Control
Revision History
-
A
B
Date
02/03/04
2/10/04
8/13/04
By
FBoudreau
FBoudreau
FBoudreau
Description
Initial
Change stability spec, +/-4.6 ppm min, to -4.6
min and +4.6 max. Delete references to tristate.
Correct package drawing dimensions , add
suggested pad layout, correct test circuit
diagram
USA:
Vectron International
•
267 Lowell Road, Hudson, NH 03051
•
Tel: 1-88-VECTRON-1
•
Fax: 1-888-FAX-VECTRON
Vectron International reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is assumed
as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.
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