W25Q16DVSSIQ datasheet, PDF - EEWORLD Datasheet

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W25Q16DVSSIQ: DescriptionFlash, 2MX8, PDSO8, SOIC-8; Categorystorage storage; File Size2MB，83 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25Q16DVSSIQ Overview

Flash, 2MX8, PDSO8, SOIC-8

W25Q16DVSSIQ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	1308634892
package instruction	SOIC-8
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Manufacturer	Winbond
Samacsys Modified On	2020-10-12 07:20:50
YTEOL	0
Maximum clock frequency (fCLK)	104 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	S-PDSO-G8
length	5.23 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	8
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	SQUARE
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	2.16 mm
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
width	5.23 mm
write protect	HARDWARE/SOFTWARE

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W25Q16DV

3V 16M-BIT

SERIAL FLASH MEMORY WITH

DUAL AND QUAD SPI

-1-

Publication Release Date: May 23, 2016

Revision K

W25Q16DV

Table of Contents

GENERAL DESCRIPTION ............................................................................................................... 5

FEATURES ....................................................................................................................................... 5

PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

4.1

4.2

4.3

4.4

4.5

Pin Configuration SOIC 150 / 208-mil .................................................................................. 6

Pad Configuration WSON 6x5-mm / USON 4X3-mm / USON 4X4-mm .............................. 6

Pin Configuration PDIP 300-mil ............................................................................................ 7

Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 300-mil ........ 7

Ball Configuration WLCSP ................................................................................................... 8

Ball Description WLCSP ....................................................................................................... 8

Pin Configuration SOIC 300-mil ........................................................................................... 9

Pin Description SOIC 300-mil ............................................................................................... 9

Ball Configuration TFBGA 8x6-mm .................................................................................... 10

Ball Description TFBGA 8x6-mm ....................................................................................... 10

Chip Select (/CS) ................................................................................................................ 11

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 11

Write Protect (/WP) ............................................................................................................ 11

HOLD (/HOLD) ................................................................................................................... 11

Serial Clock (CLK) .............................................................................................................. 11

PIN DESCRIPTIONS ...................................................................................................................... 11

BLOCK DIAGRAM .......................................................................................................................... 12

FUNCTIONAL DESCRIPTION ....................................................................................................... 13

6.1

SPI OPERATIONS ............................................................................................................. 13

6.1.1

6.1.2

6.1.3

6.1.4

Standard SPI Instructions ..................................................................................................... 13

Dual SPI Instructions ............................................................................................................ 13

Quad SPI Instructions ........................................................................................................... 13

Hold Function ....................................................................................................................... 13

Write Protect Features ......................................................................................................... 14

6.2

WRITE PROTECTION ....................................................................................................... 14

6.2.1

STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 15

7.1

STATUS REGISTERS........................................................................................................ 15

7.1.1

7.1.2

7.1.3

7.1.4

7.1.5

7.1.6

BUSY Status (BUSY) ............................................................................................................ 15

Write Enable Latch Status (WEL) ........................................................................................ 15

Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 15

Top/Bottom Block Protect Bit (TB) ........................................................................................ 15

Sector/Block Protect Bit (SEC) ............................................................................................. 15

Complement Protect Bit (CMP) ............................................................................................ 16

-2-

W25Q16DV

7.1.7

7.1.8

7.1.9

7.1.10

7.1.11

7.1.12

Status Register Protect Bits (SRP1, SRP0).......................................................................... 16

Erase/Program Suspend Status (SUS) ................................................................................ 16

Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 16

Quad Enable Bit (QE) ......................................................................................................... 17

Status Register Memory Protection (CMP = 0) ................................................................... 18

Status Register Memory Protection (CMP = 1) ................................................................... 19

Manufacturer and Device Identification ................................................................................ 20

Instruction Set Table 1 (Erase, Program Instructions)

(1)

....................................................... 21

Instruction Set Table 2 (Read Instructions) .......................................................................... 22

Instruction Set Table 3 (ID, Security Instructions) ................................................................ 23

Write Enable (06h) ............................................................................................................... 24

Write Enable for Volatile Status Register (50h) .................................................................... 24

Write Disable (04h) ............................................................................................................... 25

Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 26

Write Status Register (01h) .................................................................................................. 26

Read Data (03h) ................................................................................................................. 28

Fast Read (0Bh) ................................................................................................................. 29

Fast Read Dual Output (3Bh) ............................................................................................. 30

Fast Read Quad Output (6Bh) ............................................................................................ 31

Fast Read Dual I/O (BBh) ................................................................................................... 32

Fast Read Quad I/O (EBh) ................................................................................................. 34

Word Read Quad I/O (E7h) ................................................................................................ 36

Octal Word Read Quad I/O (E3h) ....................................................................................... 38

Set Burst with Wrap (77h) .................................................................................................. 40

Continuous Read Mode Bits (M7-0) ................................................................................... 41

Continuous Read Mode Reset (FFh or FFFFh) .................................................................. 41

Page Program (02h) ........................................................................................................... 42

Quad Input Page Program (32h) ........................................................................................ 43

Sector Erase (20h) ............................................................................................................. 44

32KB Block Erase (52h) ..................................................................................................... 45

64KB Block Erase (D8h) ..................................................................................................... 46

Chip Erase (C7h / 60h) ....................................................................................................... 47

Erase / Program Suspend (75h) ......................................................................................... 48

Erase / Program Resume (7Ah) ......................................................................................... 49

Power-down (B9h) .............................................................................................................. 50

Release Power-down / Device ID (ABh) ............................................................................. 51

Read Manufacturer / Device ID (90h) ................................................................................. 53

Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 54

Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 55

Read Unique ID Number (4Bh)........................................................................................... 56

7.2

INSTRUCTIONS................................................................................................................. 20

7.2.1

7.2.2

7.2.3

7.2.4

7.2.5

7.2.6

7.2.7

7.2.8

7.2.9

7.2.10

7.2.11

7.2.12

7.2.13

7.2.14

7.2.15

7.2.16

7.2.17

7.2.18

7.2.19

7.2.20

7.2.21

7.2.22

7.2.23

7.2.24

7.2.25

7.2.26

7.2.27

7.2.28

7.2.29

7.2.30

7.2.31

7.2.32

7.2.33

7.2.34

-3-

Publication Release Date: May 23, 2016

Revision K

W25Q16DV

7.2.35

7.2.36

7.2.37

7.2.38

7.2.39

7.2.40

Read JEDEC ID (9Fh) ........................................................................................................ 57

Read SFDP Register (5Ah) ................................................................................................ 58

Erase Security Registers (44h) ........................................................................................... 59

Program Security Registers (42h) ...................................................................................... 60

Read Security Registers (48h) ........................................................................................... 61

Enable Reset (66h) and Reset (99h) .................................................................................. 62

ELECTRICAL CHARACTERISTICS ............................................................................................... 63

8.1

Absolute Maximum Ratings (1) .......................................................................................... 63

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

8.10

8.11

Operating Ranges............................................................................................................... 63

Power-Up Power-Down Timing and Requirements ............................................................ 64

DC Electrical Characteristics .............................................................................................. 65

AC Measurement Conditions .............................................................................................. 66

AC Electrical Characteristics .............................................................................................. 67

AC Electrical Characteristics (cont’d) .............................................................................. 68

Serial Output Timing ........................................................................................................... 69

Serial Input Timing .............................................................................................................. 69

/HOLD Timing ..................................................................................................................... 69

/WP Timing ......................................................................................................................... 69

8-Pin SOIC 150-mil (Package Code SN)............................................................................ 70

8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 71

8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 72

8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 73

8-Pad USON 4x3-mm (Package Code UU) ....................................................................... 74

8-Pad USON 4x4-mm (Package Code UZ)........................................................................ 75

8-Ball WLCSP (Package Code BY) .................................................................................... 76

16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 77

24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) .......................................... 78

24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................. 79

Valid Part Numbers and Top Side Marking ........................................................................ 81

PACKAGE SPECIFICATION .......................................................................................................... 70

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

9.10

10.

11.

ORDERING INFORMATION .......................................................................................................... 80

10.1

REVISION HISTORY ...................................................................................................................... 82

-4-

W25Q16DV

1. GENERAL DESCRIPTION

The W25Q16DV (16M-bit) Serial Flash memory provides a storage solution for systems with limited

space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash

devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)

and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current

consumption as low as 4mA active and 1µA for power-down.

The W25Q16DV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes

can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128

(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16DV

has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater

flexibility in applications that require data and parameter storage. (See figure 2.)

The W25Q16DV supports the standard Serial Peripheral Interface (SPI), and a high performance

Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1

(DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing

equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when

using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard

Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient

memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP

(execute in place) operation.

A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,

provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and

device identification with a 64-bit Unique Serial Number.

2. FEATURES



Family of SpiFlash Memories

– W25Q16DV: 16M-bit / 2M-byte (2,097,152)

– 256-byte per programmable page

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO

, IO

, /WP, /Hold

– Quad SPI: CLK, /CS, IO

, IO



Highest Performance Serial Flash

– 104MHz Dual SPI / Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 52MB/S continuous data transfer rate

– Up to 8X that of ordinary Serial Flash

– More than 100,000 erase/program cycles

– More than 20-year data retention



Efficient “Continuous Read Mode”

– Low Instruction overhead

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash



Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

– 4mA active current, <1µA Power-down (typ.)

– -40°C to +85°C operating range



Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4/32/64K-bytes)

– Program one to 256 bytes

– Erase/Program Suspend & Resume



Advanced Security & Identification Features

– Software and Hardware Write-Protect

– Top/Bottom, 4KB complement array protection

– Power Supply Lock-Down and OTP protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Byte Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits



Space Efficient Packaging

(1)

– 8-pin SOIC 150/208-mil

– 8-pad WSON 6x5-mm

– 8-pad USON 4X3mm / 4X4mm

– 8-pin PDIP 300-mil

– 8-ball WLCSP

– 16-pin SOIC 300-mil

– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)

– Contact Winbond for KGD and other options

Note 1. Some package types are special orders, please contact Winbond for ordering information.

-5-

Publication Release Date: May 23, 2016

Revision K

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