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SMBJ60C

Description
600 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA
Categorysemiconductor    Discrete semiconductor   
File Size249KB,8 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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SMBJ60C Overview

600 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA

MCC
Features
  omponents
21201 Itasca Street Chatsworth

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SMBJ5.0
THRU
SMBJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
600 Watt
DO-214AA
(SMBJ) (LEAD FRAME)
G
l
For surface mount applicationsin or der to optimize
boar d space
l
L ow pr ofil e package
l
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
l
Low inductance
l
Excellent clamping capability
Mechanical Data
l
l
l
CASE: JEDEC DO-214AA
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes posit ive end (cathode)
except Bidirectional
l
Maximum soldering temperature: 260 C for 10 seconds
o
o
H
Maximum Ratings @ 25 C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note: 1
10/1000us waveform
Peak Pulse Power
P
PP
600W
Note: 1,
Dissipation
2
Peak Forward Surge
I
FSM)
100A
Note: 2
Current
3
Operation And Storage T
J
, T
STG
-55
o
C to
Temperature Range
+150
o
C
Thermal Resistance
R
25
o
C/W
D
A
E
C
B
F
DIMENSIONS
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.083
.075
.002
.006-
.030
.200
.160
.130
MAX
.096
.083
.008
.012
.050
.220
.185
.155
MM
MIN
2.13
1.91
0.051
0.152
0.76
5.08
4.06
3.30
MAX
2.44
2.11
0.203
0.305
1.27
5.59
4.70
3.94
NOTE
NOTES:
1.
2.
3.
4.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
2
Mounted on 5.0mm copper pads to each terminal.
8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
Peak pulse current waveform is 10/1000us, with maximum duty
Cycle of 0.01%.
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.082”
0.050”
www.mccsemi.com
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