WSF256K8-XCX
256Kx8 SRAM/ FLASH MODULE
FIG. 1
PIN CONFIGURATION
TOP VIEW
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
V
SS
ADVANCED*
FEATURES
s
Access Times of 35ns (SRAM) and 70ns (FLASH)
s
JEDEC Standard, Hermetic Ceramic Package, 32 pin DIP
(Package 300)
s
256Kx8 SRAM
s
256Kx8 5V FLASH
s
Memory Map
Flash Memory: 0H-3FFFFH
SRAM: 40000H-7FFFFH
s
Low Power CMOS
s
Commercial, Industrial and Military Temperature Ranges
s
TTL Compatible Inputs and Outputs
s
Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
11
MIXED MODULES
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
FLASH MEMORY FEATURES
PIN DESCRIPTION
A
0-18
I/O
0-7
CS
OE
WE
V
CC
V
SS
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
s
10,000 Erase/Program Cycles
s
Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase
s
Data Retention, 10 Years at 125°C
s
5 Volt Programming; 5V
±
10% Supply
s
Embedded Erase and Program Algorithms
s
Hardware and Software Write Protection
s
Page Program Operation and Internal Program Control Time
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
BLOCK DIAGRAM
A
0
-
16
I/O
0-7
WE
OE
128K x 8
Flash
128K x 8
Flash
128K x 8
SRAM
128K x 8
SRAM
A
17
A
18
CS
Decoder
January 1996
1
White Microelectronics • Phoenix, AZ • (602) 437-1520
WSF256K8-XCX
PACKAGE 300:
32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED
11
MIXED MODULES
42.4 (1.670)
±
0.4 (0.016)
15.04 (0.592)
±
0.3 (0.012)
4.34 (0.171)
±
0.79 (0.031)
PIN 1 IDENTIFIER
3.2 (0.125) MIN
0.84 (0.033)
±
0.4 (0.014)
2.5 (0.100)
TYP
1.27 (0.050)
±
0.1 (0.005)
0.46 (0.018)
±
0.05 (0.002)
0.25 (0.010)
±
0.05 (0.002)
15.25 (0.600)
±
0.25 (0.010)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
W S F 256K8 - XXX C X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
C = 32 DIP (Package 300)
ACCESS TIME (ns)
37 = 35ns SRAM and 70ns FLASH
72 = 70ns SRAM and 120ns FLASH also available
ORGANIZATION, 256K x 8
Flash PROM
SRAM
WHITE MICROELECTRONICS
White Microelectronics • Phoenix, AZ • (602) 437-1520
2
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