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D55342H07W23B4T-W

Description
RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 23400 ohm, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    The resistor   
File Size106KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

D55342H07W23B4T-W Overview

RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 23400 ohm, SURFACE MOUNT, 1206, CHIP

D55342H07W23B4T-W Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7024335130
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPRECISION
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance23400 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage100 V
State of the Art, Inc.
Thin Film Chip Resistor
D55342/07 RM1206
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
99.6% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
PRETINNED
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
100
W
- 1M
W
0.1%, 1%, 2%, 5%
250 mW
100 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
CHARACTERISTICS*
H
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
D55342 H 07 B 100D R - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
TERMINATION MATERIALS:
SIZE CODE: /07* = RM1206
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.
B: Solderable wraparound
A: 0.1%
W
D: 1%
W
G: 2%
W
J: 5%
W
B: 0.1% K
W
E: 1% K
W
H: 2% K
W
K: 5% K
W
C: 0.1% M
W
F: 1% M
W
T: 2% M
W
L: 5% M
W
W: Gold wire bondable
MECHANICAL
INCHES
MILLIMETERS
.156
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.118 - .134)
.061 (.058 - .068)
.018 (.015 - .033)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.00 - 3.40)
(1.47 - 1.73)
(0.38 - 0.84)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
.067
.084
.036
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
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