EM9301V02LF24B+ datasheet, PDF

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EM9301V02LF24B+: DescriptionTelecom IC, PQCC24; CategoryWireless rf/communication Telecom circuit; File Size970KB，37 Pages; ManufacturerEM Microelectronic-Marin SA; Websitehttps://www.emmicroelectronic.com; Environmental Compliance

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EM9301V02LF24B+ Overview

Telecom IC, PQCC24

EM9301V02LF24B+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	114019512
package instruction	QCCN, LCC24,.2SQ,25
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-N24
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCN
Encapsulate equivalent code	LCC24,.2SQ,25
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	2.5 V
Certification status	Not Qualified
Nominal supply voltage	2.5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.635 mm
Terminal location	QUAD

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EM MICROELECTRONIC

- MARIN SA

EM9301

Single-Cell Battery

Bluetooth

Low Energy Controller

Description

The EM9301 is a low-voltage, low-power, fully-integrated,

single-chip

Bluetooth

Low Energy (BLE) controller.

It features a low-power physical layer, a link layer with an

embedded security engine, a Host/Controller Interface

(HCI), and a powerful power management which allows

operation using efficiently all kinds of batteries down to

0.8V. This feature is achieved thanks to an embedded high-

efficiency DC/DC converter which provides the required

voltage to the integrated low-power RF core. Moreover, the

DC/DC converter is designed to support an external load

current and can be used to supply low-power

microcontrollers or sensor interfaces.

EM9301 can also be ordered without DC/DC converter for

all applications where a supply voltage from a 3V battery or

from any other source is available in the system. In this

case, the bill of materials is further reduced, since no coil for

the DC/DC converter is needed.

This BLE controller offers performances tailored for

extremely low-power applications. Furthermore, the

minimum amount of external components required makes

the EM9301 suitable for applications where the form factor

is a fundamental parameter.

The EM9301 controller is designed to act as BLE master or

slave according to the

Bluetooth

specification V4.0. It can be

controlled by any external microcontroller featuring BLE

profiles and applications through the standard

Bluetooth

HCI

interface. UART and SPI interfaces are available as HCI

transport layers. Moreover, during the intervals with no

active BLE RF connection, the EM9301 features a

proprietary low-power mode which can further reduce the

power consumption.

With its high level of flexibility the EM9301 is the best choice

for a

Bluetooth

Low Energy companion chip.

Main Features



Master and slave BLE controller compliant to

Bluetooth

specification V4.0

DCDC version operating directly from a single 1.5V

battery and noDCDC version from a 3V battery

Functional down to 0.8V in case of DCDC version to

improve battery life time

Low average current consumption in case of noDCDC

version allowing the use of low-cost 3V batteries

Based on widely-spread, low-cost 26MHz quartz

1Mbps on-air data rate

200Ω differential impedance of antenna port

No antenna matching elements needed through

appropriate PCB antenna design

Programmable RF output level from -18dBm to +3dBm

to optimize current consumption for a wide range of

applications

Supply Voltage Level Detector (SVLD) function enables

monitoring the battery charge condition

QFN24 5mm x 5mm package



Typical Current consumptions

12mA

13mA

200µA

20µA

9µA



Tx current at 0dBm output power

Rx current

in Idle Mode

in Sleep Mode (noDCDC version)

in Deep-Sleep Mode (noDCDC version)

Typical Applications

Remote sensing

Wireless mouse and keyboard

Wireless sensors for watches

Wireless sport equipment

Alarm and security systems

Typical Application Schematic

EM9301

VBAT

SW_DCDC

VCC1

AVSS_PLL1

Host Controller

UART

SPI

HCI

Pin Assignment

BIAS_R

XTAL2

XTAL1

RST

IRQ

DCDC

Conv

HCI

BLE

Application

VCC2

Power

Mgt

MCU

RAM

BLE Protocol Stack

UART_TX/MISO

UART_RX/MOSI

SCK

VCC2

BLE controller

ANTP

Sensor Interface

EM9301

QFN24 5x5

AVSS_RF

ANTP

ANTN

AVSS_PA

AVDD_PA

Matching

Network

ANTN

BLE Radio

From

VCC1

Sensors

VDD

VSS

*Not all connections shown. Dotted lines correspond to the

DCDC version of EM9301.

VSS_DCDC

SW_DCDC

VCC1

WU/CSN

SEL

Bluetooth

is a trademark owned by the

Bluetooth

Special

Interest Group (SIG).

2013,

EM Microelectronic-Marin SA

9301-DS.doc, Version 2.1, 4-Feb-13

www.emmicroelectronic.com

420005-A01, 2.0

AVSS_PLL2

VBAT

EM9301

Table of contents

Table of contents .......................................................................................................................................................................... 2

List of tables ................................................................................................................................................................................ 3

List of figures ............................................................................................................................................................................... 3

Introduction..................................................................................................................................................................... 4

1.1

Related documents........................................................................................................................................................... 5

1.2

Block diagram ................................................................................................................................................................... 5

1.3

Pins description ................................................................................................................................................................ 6

1.4

Power pins configuration and description ......................................................................................................................... 6

Reference design............................................................................................................................................................ 9

2.1

Bill Of Materials (BOM) ..................................................................................................................................................... 9

Absolute maximum ratings ......................................................................................................................................... 12

3.1

Handling procedures ...................................................................................................................................................... 12

General operating conditions ...................................................................................................................................... 12

Electrical characteristics ............................................................................................................................................. 13

5.1

DC characteristics .......................................................................................................................................................... 13

5.1.1

DCDC version power supply characteristics (preliminary) .................................................................................... 13

5.1.2

noDCDC version power supply characteristics ..................................................................................................... 14

5.1.3

Current consumption ............................................................................................................................................. 14

5.2

Digital interface characteristics ....................................................................................................................................... 14

5.2.1

Digital Input/Output pins characteristics ................................................................................................................ 14

5.2.2

Digital interface timing characteristics ................................................................................................................... 14

5.3

RF characteristics ........................................................................................................................................................... 15

5.3.1

General RF characteristics.................................................................................................................................... 15

5.3.2

Xtal oscillator characteristics ................................................................................................................................. 15

5.3.3

RF timing characteristics ....................................................................................................................................... 16

5.3.4

Transmitter characteristics .................................................................................................................................... 16

5.3.5

Receiver characteristics ........................................................................................................................................ 17

Functional description ................................................................................................................................................. 18

6.1

EM9301 start up ............................................................................................................................................................. 18

6.1.1

Start-up sequence: DCDC version ........................................................................................................................ 18

6.1.2

Start-up sequence: noDCDC version .................................................................................................................... 18

6.1.3

End of the boot-up procedure ............................................................................................................................... 18

6.2

EM9301 power modes.................................................................................................................................................... 19

6.2.1

Standby Mode ....................................................................................................................................................... 19

6.2.2

Xtreme Mode (DCDC version) .............................................................................................................................. 19

6.2.3

Xtreme Mode (noDCDC version) .......................................................................................................................... 19

6.2.4

Deep-Sleep Mode (noDCDC version only) ........................................................................................................... 19

6.3

EM9301 operating modes .............................................................................................................................................. 19

6.3.1

State diagram........................................................................................................................................................ 19

6.3.2

Idle Mode .............................................................................................................................................................. 21

6.3.3

Sleep Mode ........................................................................................................................................................... 21

6.3.4

Deep-Sleep Mode (only for noDCDC version) ...................................................................................................... 21

6.3.5

BLE Active Mode .................................................................................................................................................. 21

6.3.6

BLE Sleep Mode ................................................................................................................................................... 21

6.3.7

Battery Protection Mode (DCDC version only) ...................................................................................................... 22

6.4

EM9301 reset structure .................................................................................................................................................. 22

Host/Controller Interface (HCI) .................................................................................................................................... 23

7.1

HCI UART transport layer ............................................................................................................................................... 24

7.1.1

UART interface ..................................................................................................................................................... 24

7.1.2

UART Settings ...................................................................................................................................................... 24

7.2

HCI SPI transport layer................................................................................................................................................... 24

7.2.1

SPI interface ......................................................................................................................................................... 24

7.2.2

SPI flow control ..................................................................................................................................................... 24

Peripherals information ............................................................................................................................................... 26

8.1

AES encryption/decryption accelerator ........................................................................................................................... 26

8.2

Random Number Generator (RNG) ................................................................................................................................ 26

8.3

Supply Voltage Level Detector (SVLD)........................................................................................................................... 26

Application design guidelines ..................................................................................................................................... 27

9.1

Antenna port ................................................................................................................................................................... 27

9.1.1

Folded dipole antenna .......................................................................................................................................... 27

9.2

Xtal oscillator .................................................................................................................................................................. 28

9.2.1

Frequency deviation .............................................................................................................................................. 28

9.2.2

Reference quartz crystals ..................................................................................................................................... 29

9.3

DC/DC converter and power supplies ............................................................................................................................ 29

2013,

EM Microelectronic-Marin SA

9301-DS.doc, Version 2.1, 4-Feb-13

www.emmicroelectronic.com

420005-A01, 2.0

EM9301

10.

10.1

10.2

10.3

10.4

10.5

10.6

10.7

11.

11.1

11.2

12.

12.1

12.2

12.3

13.

Vendor HCI commands ................................................................................................................................................ 30

EM_SET_PUBLIC_ADDRESS .................................................................................................................................. 30

EM_SET_POWER_MODE ........................................................................................................................................ 31

EM_SVLD .................................................................................................................................................................. 31

EM_SET_RF_POWER_LEVEL ................................................................................................................................. 32

EM_POWER_MODE_CONFIGURATION ................................................................................................................. 32

EM_SET_UART_BAUD_RATE ................................................................................................................................. 33

EM_SET_DCDC_VOLTAGE ..................................................................................................................................... 33

Vendor HCI events........................................................................................................................................................ 34

EM_POWER_MODE_IDLE ....................................................................................................................................... 34

Additional Hardware Error Event codes ..................................................................................................................... 34

Versions and ordering information ............................................................................................................................. 35

Ordering information .................................................................................................................................................. 35

Package marking ....................................................................................................................................................... 35

Firmware update ........................................................................................................................................................ 35

Package information .................................................................................................................................................... 36

List of tables

Table 1.1 EM9301 pins description ................................................................................................................................................. 6

Table 1.2 Power supply pins description ........................................................................................................................................ 7

Table 1.3 Recommended component list for the power section of the EM9301 ............................................................................. 8

Table 2.1 Recommended component list for the EM9301 reference design .................................................................................. 9

Table 3.1 Absolute maximum ratings ............................................................................................................................................ 12

Table 4.1 General operating conditions ........................................................................................................................................ 12

Table 5.1 DCDC version power supply characteristics (preliminary) ............................................................................................ 13

Table 5.2 noDCDC version power supply characteristics ............................................................................................................. 14

Table 5.3 Current consumption ..................................................................................................................................................... 14

Table 5.4 Digital Input/Output pins characteristics ........................................................................................................................ 14

Table 5.5 Digital interface timing characteristics ........................................................................................................................... 14

Table 5.6 General RF characteristics ........................................................................................................................................... 15

Table 5.7 Xtal oscillator characteristics ......................................................................................................................................... 15

Table 5.8 Quartz crystal general specifications ............................................................................................................................ 15

Table 5.9 RF timing characteristics ............................................................................................................................................... 16

Table 5.10 Transmitter characteristics .......................................................................................................................................... 16

Table 5.11 Receiver characteristics .............................................................................................................................................. 17

Table 6.1 EM9301 operating and power modes ........................................................................................................................... 20

Table 7.1 HCI Command formats ................................................................................................................................................. 23

Table 7.2 HCI event formats ......................................................................................................................................................... 23

Table 8.1 Function of SVLD thresholds ........................................................................................................................................ 26

Table 10.1 Vendor HCI commands ............................................................................................................................................... 30

Table 11.1 Additional Hardware Error Event codes ...................................................................................................................... 34

Table 12.1 EM9301 versions ........................................................................................................................................................ 35

Table 12.2 Ordering information ................................................................................................................................................... 35

Table 12.3 EM9301 package marking for version 1 (DCDC version) ........................................................................................... 35

Table 12.4 EM9301 package marking for version 2 (noDCDC version) ....................................................................................... 35

List of figures

Figure 1.1 BLE stack ...................................................................................................................................................................... 4

Figure 1.2 Simplified EM9301 block diagram.................................................................................................................................. 5

Figure 1.3 EM9301 power configurations: (a) DCDC version; (b) noDCDC version ....................................................................... 7

Figure 2.1 Reference design schematic (EM9301 noDCDC version) ........................................................................................... 10

Figure 2.2 Reference design PCB top and bottom layout (EM9301 noDCDC version) ................................................................ 11

Figure 6.1 EM9301 state diagram ................................................................................................................................................. 20

Figure 7.1 SPI writing transaction, with a wait state at start of the transaction ............................................................................. 25

Figure 7.2 SPI writing transaction with a wait state after the first byte received............................................................................ 25

Figure 7.3 SPI read transaction with a empty buffer after the second byte ................................................................................... 25

Figure 9.1 Layout example of a folded dipole antenna. ................................................................................................................ 27

Figure 9.2 Xtal oscillator block diagram ........................................................................................................................................ 28

Figure 13.1 Package information .................................................................................................................................................. 36

2013,

EM Microelectronic-Marin SA

9301-DS.doc, Version 2.1, 4-Feb-13

www.emmicroelectronic.com

420005-A01, 2.0

EM9301

Introduction

The EM9301 is a low-power and low-voltage

Bluetooth

Low Energy (BLE) controller compliant with the

Bluetooth

specification

V4.0. It consists of a low-power physical layer, a link layer with an embedded security engine, a Host/Controller Interface (HCI),

and a powerful power management which allows operation using efficiently all kinds of batteries down to 0.8V.

The HCI communications can be performed using either UART or SPI as transport layer. This flexibility makes possible to

interface this BLE controller with several external microcontrollers where the

Bluetooth

Low Energy protocol stack can be

integrated together with any possible user application. A conceptual drawing of the BLE stack is depicted in Figure 1.1.

The EM9301 front end has been designed specifically for low-power applications. The Tx output power can be digitally

controlled in a wide range (-18dBm to +3dBm) by the BLE host in order to optimize the current consumption for a wide set of

applications. The robust Rx architecture allows the EM9301 to operate without the need of expensive external filters to

attenuate undesired signals. The differential real impedance of 200 on the antenna port allows employing a simple PCB

antenna while reducing the Bill-Of-Materials (BOM) count. Adaptation to any other antenna impedance is also granted by a

simple matching network.

EM9301 features a high-efficiency power-management system and is available in two hardware versions:

1) DCDC version which allows operation on a single 1.5V battery cell

2) noDCDC version which allows operation on a wide set of 3V batteries

The DCDC version includes a high-efficiency step-up converter capable of providing the power supply for the EM9301 itself and

for other external components like a microcontroller or a discrete sensor. The minimum battery voltage can be as low as 0.8V

during normal operation and the DC/DC output voltage can be selected by the host. Furthermore, the DC/DC converter can be

re-configured into a proprietary mode called Xtreme Mode, where a fixed voltage is available for a limited output load current.

This mode is specially suited for applications with low RF duty cycle.

Additionally, embedded features like Power-On Reset (POR) and Supply Voltage Level Detector (SVLD) ensure the correct start

up of the system and allow the host to provide an accurate protection against complete discharge of batteries.

All this features make the EM9301 an attractive choice for a broad range of wireless applications where power-efficient single-

battery operation as well as multi-cell battery operation is needed. Thanks to the minimized amount of external components, the

EM9301 is the right choice that can make the difference in terms of complete system cost.

BLE APPLICATION STACK

BLE APPLICATIONS

BLE PROFILES

HOST

HOST CONTROLLER

INTERFACE

LINK LAYER

}

External MCU

EM9301

PHYSICAL LAYER

Figure 1.1 BLE stack

2013,

EM Microelectronic-Marin SA

9301-DS.doc, Version 2.1, 4-Feb-13

www.emmicroelectronic.com

420005-A01, 2.0

EM9301V02LF24B+ Related Products

	EM9301V02LF24B+	EM9301V01LF24B+	EM9301V01LF24D+	EM9301V02LF24D+
Description	Telecom IC, PQCC24	Telecom IC, PQCC24	Telecom IC, PQCC24	Telecom IC, PQCC24
Is it Rohs certified?	conform to	conform to	conform to	conform to
Objectid	114019512	114019511	114019509	114019510
package instruction	QCCN, LCC24,.2SQ,25	QCCN, LCC24,.2SQ,25	QCCN, LCC24,.2SQ,25	QCCN, LCC24,.2SQ,25
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-N24	S-PQCC-N24	S-PQCC-N24	S-PQCC-N24
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCN	QCCN	QCCN	QCCN
Encapsulate equivalent code	LCC24,.2SQ,25	LCC24,.2SQ,25	LCC24,.2SQ,25	LCC24,.2SQ,25
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	2.5 V	1.5,2.2 V	1.5,2.2 V	2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	QUAD	QUAD	QUAD	QUAD

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