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BSP350

Description
MiniPROFET(High-side switch Short-circuit protection Overtemperature protection with hysteresis)
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size70KB,6 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric View All

BSP350 Overview

MiniPROFET(High-side switch Short-circuit protection Overtemperature protection with hysteresis)

BSP350 Parametric

Parameter NameAttribute value
MakerInfineon
Parts packaging codeSOT-223
package instructionSOT-223, 4 PIN
Contacts4
Reach Compliance Codeunknow
ECCN codeEAR99
Built-in protectionTRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
Interface integrated circuit typeBUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 codeR-PDSO-G4
length6.5 mm
Number of functions1
Number of terminals4
Output current flow directionSOURCE
Nominal output peak current1.2 A
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOT-223
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum seat height1.8 mm
Maximum supply voltage45 V
Minimum supply voltage4.9 V
Nominal supply voltage13.5 V
surface mountYES
technologyMOS
Terminal formGULL WING
Terminal pitch2.3 mm
Terminal locationDUAL
Disconnect time140 µs
connection time100 µs
width3.5 mm
Mini PROFET® BSP 350
High-side switch
Short-circuit protection
Overtemperature protection with hysteresis
Overload protection
Overvoltage protection
Reverse battery protection
1
)
Switching inductive load
Clamp of negative output voltage with inductive loads
Maximum current internally limited
Package: SOT 223
Type
Ordering code
Q67000-S227
Pins:
1
IN
2
V
bb
3
OUT
MiniPROFET
4
3
2
1
4
V
bb
BSP 350
Maximum Ratings
Parameter
Supply voltage
Load current
self-limited
Maximum current through input pin (DC)
see internal circuit diagram
Symbol Values
V
bb
50
I
L
I
L(SC)
I
IN
±15
Unit
V
A
mA
mJ
°C
W
K/W
Inductive load switch-off energy dissipation
Operating temperature range
Storage temperature range
Max. power dissipation (DC)
2)
T
A
= 25 °C
Thermal resistance
chip - soldering point:
chip - ambient:
2
)
E
AS
T
j
T
stg
P
tot
R
thJS
R
thJA
+ V bb
2/4
5
-40 ...+150
-55 ...+150
1.7
17
72
Control
Circuit
OUT
3
R IN
IN
1
RL
Temperature
Sensor
GND
1
2
)
) For 12 V applications only. Reverse load current only limited by connected load.
BSP 350 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
Semiconductor Group
Page 1 of 6
08.04.97

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