2211AA250241MCBSPU datasheet, PDF

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2211AA250241MCBSPU: DescriptionCeramic Capacitor, Multilayer, Ceramic, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.00024uF, 2211,; CategoryPassive components capacitor; File Size581KB，8 Pages; ManufacturerKnowles; Websitehttp://www.knowles.com

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2211AA250241MCBSPU Overview

Ceramic Capacitor, Multilayer, Ceramic, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.00024uF, 2211,

2211AA250241MCBSPU Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	843654112
package instruction	, 2211
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.00024 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.5 mm
length	5.7 mm
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Bulk
positive tolerance	20%
Rated (AC) voltage (URac)	250 V
series	SIZE(SURGE/SAFETY)
size code	2211
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
width	2.79 mm

2211AA250241MCBSPU Preview

MLCC

Safety Certified capacitors

Safety Certified MLCC Capacitors

Electrical Details

Capacitance Range

Temperature Coefficient of

Capacitance (TCC)

C0G/NP0

X7R

C0G/NP0

X7R

Insulation Resistance (IR)

Dielectric Withstand Voltage (DWV)

C0G/NP0

X7R

4.7pF to 33nF

0 ± 30ppm/˚C

±15% from -55˚C to +125˚C

Cr > 50pF

≤0.0015

≤

50pF = 0.0015(15÷Cr+0.7)

≤

0.025

100G or 1000secs (whichever is the less)

Voltage applied for 5 ±1 seconds, 50mA

charging current maximum

Zero

<2% per time decade

Syfer Technology’s Safety Certified capacitors comply

with international UL and TÜV specifications to offer

designers the option of using a surface mount ceramic

multilayer capacitor to replace leaded film types.

Offering the benefits of simple pick-and-place

assembly, reduced board space required and lower

profile, they are also available in a FlexiCap™ version to

reduce the risk of mechanical cracking.

Syfer’s high voltage capacitor expertise means the

range offers among the highest range available of

capacitance values in certain case sizes. Applications

include: modems, AC-DC power supplies and where

lightning strike or other voltage transients represent a

threat to electronic equipment.

Dissipation Factor

Ageing Rate

• Surface mount multilayer capacitors

• Meet Class Y2/X1, Y3/X2 and X2 requirements

• Approved for mains ac voltages up to 250Vac

• Approved by UL and TÜV

• Sizes 1808, 1812, 2211, 2215 and 2220

• Smaller sizes suitable for use in equipment certified to

EN60950

•

Certification specifications for larger sizes include IEC/

EN60384-14, UL/CSA60950 and UL60384-14

Surface mount package

Reduces board area and height restrictions

Reduced assembly costs over conventional through hole

components

FlexiCap™ option available on all sizes

Class

Rated voltage

250Vac

150Vac

250Vac

Impulse voltage

8000V

5000V

None

2500V

4000V

2500V

None

Insulation bridging

Double or reinforced

Basic or supplementary*

Basic or supplementary

Basic or supplementary*

May be used in primary

circuit

Line to protective earth

Line to line

* 2 x Y2 or Y4 rated may bridge double or reinforced insulation when used in series.

Syfer Technology Ltd.

Old Stoke Road, Arminghall

Norwich, Norfolk, NR14 8SQ

United Kingdom

Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com

SafetyCertifiedDatasheet Issue 1 (P107531) Release Date 24/04/13

Page 1 of 8

Classification and approval specification – Safety Certified capacitors

Chip size

Dielectric

Cap Range

4.7pF

1.5nF

Syfer Family

Code

Classification

Y3/X2

(6)

(1)

Approval Specification

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60950-1, 2nd Ed

CSA 60950-1-07 2nd Ed

IEC60384-14:2005

EN60384-14:2005

UL-60384-14:2010

CSA E60384-14:09

IEC60384-14:2005

EN60384:2005

Approval

Body

TÜV

1808

C0G/NP0

NWGQ2, NWGQ8

Y3/X2

(6)

(1)

1808

X7R

150pF

4.7nF

NWGQ2, NWGQ8

Y2/X1

(6)

PY2

(1)

1808

C0G/NP0

4.7pF

390pF

NWGQ2, NWGQ8

Y2/X1

(6)

PY2

(1,3)

1808

X7R

150pF

1.5nF

NWGQ2, NWGQ8

Y2/X1

(6)

PY2

(1)

1812

C0G/NP0

4.7pF

390pF

NWGQ2, NWGQ8

Y2/X1

(6)

PY2

(1,4)

1812

X7R

150pF

4.7nF

NWGQ2, NWGQ8

Y2/X1

(2)

NWGQ2, NWGQ8

Y2/X1

(2)

2211

C0G/NP0

4.7pF

1nF

2211

X7R

100pF

3.9nF

NWGQ2, NWGQ8

Y2/X1

(2)

2215

C0G/NP0

820pF

1.0nF

NWGQ2, NWGQ8

Y2/X1

(2)

NWGQ2, NWGQ8

Y2/X1

(2)

B16

Y2/X1,

(1)

FOWX2,

FOWX8

2215

X7R

2.7nF

3.9nF

2220

X7R

150pF

5.6nF

150pF

33nF

2220

Notes:

(1)

(2)

(3)

(4)

(5)

(6)

PY2

X7R

B17

(2,5)

TÜV

Termination availability

J & Y terminations only.

J, Y, A & H terminations available.

For cap values >1000pF available in “P” ProtectiCap™ termination only.

For cap values >2200pF available in “P” ProtectiCap™ termination only.

B17 values above 22nF available in “P” ProtectiCap™ termination only.

The capacitors comply with the requirements of IEC/EN 60384-14 2005. For class Y2 or Y3 (as defined in the table) with the exception of insulation (creepage)

distances.

Unmarked capacitors also available as released in accordance with approval specifications. Family codes SY2 applies.

Unmarked capacitors also available as released in accordance with approval specifications. Family codes SYU applies.

Syfer Technology Ltd: SafetyCertifiedDatasheet Issue 1 (P107531)

Release Date 24/04/13

Page 2 of 8

Ordering Information – Safety Certified capacitors – Class SPU/SP ranges

1808

Chip Size

1808

2211

2215

Termination

= Ni barrier

= FlexiCap™

termination base with

Ni barrier (100%

matte tin plating).

RoHS compliant.

2211/2215 only

= Silver base with Ni

barrier (Tin/lead

plating with min. 10%

lead). Not RoHS

compliant.

= FlexiCap™

termination base with

Ni barrier (Tin/lead

plating with min. 10%

lead). Not RoHS

compliant.

A25

Rated Voltage

A25

= 250Vac

0102

Capacitance in Pico

farads (pF)

First digit is 0.

Second and third digits are

significant figures of

capacitance code.

The fourth digit is number of

zeros following.

Example:

0102

= 1.0nF

Capacitance

Tolerance

<10pF

= ±0.10pF

= ±0.25pF

= ±0.50pF

≥

10pF

= ±1%

= ±2%

= ±5%

= ±10%

= ±20%

Dielectric

Codes

= C0G/NP0

= X7R

Packaging

= 178mm

(7”) reel

= 330mm

(13”) reel

= Bulk pack

– tubs or trays

Suffix code

= Surge

Protection

capacitors (marked

and approved)

SPU

= Surge

Protection

capacitors (un-

marked parts are in

accordance with,

but not certified)

Ordering Information – Safety Certified capacitors – Class PY2/SY2

1808

Chip Size

1808

1812

Termination

= Ni barrier

= FlexiCap™

termination base with

Ni barrier (100%

matte tin plating).

RoHS compliant.

= ProtectiCap™

FlexiCap™ termination

base with Ni barrier,

(100% matte tin

A25

Rated Voltage

A25

= 250Vac

0102

Capacitance in Pico

farads (pF)

First digit is 0.

Second and third digits are

significant figures of

capacitance code.

The fourth digit is number of

zeros following.

Example:

0102

= 1.0nF

Capacitance

Tolerance

<10pF

= ±0.10pF

= ±0.25pF

= ±0.50pF

≥

10pF

= ±1%

= ±2%

= ±5%

= ±10%

= ±20%

Dielectric

Codes

= C0G/NP0

= X7R

Packaging

= 178mm

(7”) reel

= 330mm

(13”) reel

= Bulk pack

– tubs or trays

PY2

Suffix code

PY2

= Safety

tested Surge

Protection

capacitors (marked

and approved)

SY2

= Surge

Protection

capacitors (un-

marked parts are in

accordance with,

but not certified)

Ordering Information – Safety Certified capacitors – Class B16/B17 ranges

2220

Chip Size

2220

Termination

= Ni barrier

= FlexiCap™

termination base with

Ni barrier (100%

matte tin plating).

RoHS compliant.

= Silver base with Ni

barrier (Tin/lead

plating with min. 10%

lead). Not RoHS

compliant.

= FlexiCap™

termination base with

Ni barrier (Tin/lead

plating with min. 10%

lead). Not RoHS

compliant.

= ProtectiCap™

FlexiCap™ termination

base with Ni barrier,

(100% matte tin

plating).

A25

Rated Voltage

A25

= 250Vac

0102

Capacitance in Pico

farads (pF)

First digit is 0.

Second and third digits are

significant figures of

capacitance code.

The fourth digit is number of

zeros following.

Example:

0102

= 1.0nF

Capacitance

Tolerance

= ±5%

= ±10%

= ±20%

Dielectric

Codes

= X7R

Packaging

= 178mm

(7”) reel

= 330mm

(13”) reel

= Bulk pack

– tubs or trays

B16

Suffix code

B16

= Type A:

X1/Y2

B17

= Type B: X2

Syfer Technology Ltd: SafetyCertifiedDatasheet Issue 1 (P107531)

Release Date 24/04/13

Page 3 of 8

Soldering Information

Syfer MLCCs are compatible with all recognised

soldering/mounting methods for chip capacitors. A detailed

application note is available at syfer.com

Reflow Soldering

Syfer recommend reflow soldering as the preferred method for

mounting MLCCs. Syfer MLCCs can be reflow soldered using a

reflow profile generally defined in IPC/FEDEC J-STD-020. Sn

plated termination chip capacitors are compatible with both

conventional and lead free soldering with peak temperatures of

260 to 270˚C acceptable.

The heating ramp rate should be such that components see a

temperature rise of 1.5 to 4˚C per second to maintain

temperature uniformity through the MLCC.

The time for which the solder is molten should be maintained

at a minimum, so as to prevent solder leaching. Extended

times above 230˚C can cause problems with oxidation of Sn

plating. Use of an inert atmosphere can help if this problem is

encountered. Palladium/Silver (Pd/Ag) terminations can be

particularly susceptible to leaching with free lead, tin rich

solders and trials are recommended for this combination.

Cooling to ambient temperature should be allowed to occur

naturally, particularly if larger chip sizes are being soldered.

Natural cooling allows a gradual relaxation of thermal

mismatch stresses in the solder joints. Forced cooling should

be avoided as this can induce thermal breakage.

Wave Soldering

Wave soldering is generally acceptable, but the thermal

stresses caused by the wave have been shown to lead to

potential problems with larger or thicker chips. Particular care

should be taken when soldering SM chips larger than size 1210

and with a thickness greater than 1.0mm for this reason.

Maximum permissible wave temperature is 270˚C for SM

chips.

The total immersion time in solder should be kept to a

minimum. It is strongly recommended that Sn/Ni plated

terminations are specified for wave soldering applications.

Solder Leaching

Leaching is the term for the dissolution of silver into the solder

causing a failure of the termination system which causes

increased ESR, tan

and open circuit faults, including

ultimately the possibility of the chip becoming detached.

Leaching occurs more readily with higher temperature solders

and solders with a high tin content. Pb free solders can be very

prone to leaching certain termination systems. To prevent

leaching, exercise care when choosing solder allows and

minimize both maximum temperature and dwell time with the

molten solder.

Plated terminations with nickel or copper anti-leaching barrier

layers are available in a range of top coat finishes to prevent

leaching occurring. These finishes also include Syfer FlexiCap

for improved stress resistance post soldering.

Multilayer ceramic chip with nickel or copper barrier

termination

Rework of Chip Capacitors

Syfer recommend hot air/gas as the preferred method of

applying heat for rework. Apply even heat surrounding the

component to minimise internal thermal gradients. Soldering

irons or other techniques that apply direct heat to the chip or

surrounding area should not be used as these can result in

micro cracks being generated.

Minimise the rework heat duration and allow components to

cool naturally after soldering.

Use of Silver Loaded Epoxy Adhesives

Chip capacitors can be mounted to circuit boards using silver

loaded adhesive provided the termination material of the

capacitor is selected to be compatible with the adhesive. This

is normally PdAg. Standard tin finishes are often not

recommended for use with silver loaded epoxies as there can

be electrical and mechanical issues with the joint integrity due

to material mismatch.

Handling & Storage

Components should never be handled with fingers;

perspiration and skin oils can inhibit solderability and will

aggravate cleaning.

Chip capacitors should never be handled with metallic

instruments. Metal tweezers should never be used as these

can chip the product and leave abraded metal tracks on the

product surface. Plastic or plastic coated metal types are

readily available and recommended – these should be used

with an absolute minimum of applied pressure.

Incorrect storage can lead to problems for the user. Rapid

tarnishing of the terminations, with an associated degradation

of solderability, will occur if the product comes into contact

with industrial gases such as sulphur dioxide and chlorine.

Storage in free air, particularly moist or polluted air, can result

in termination oxidation.

Packaging should not be opened until the MLCs are required

for use. If opened, the pack should be re-sealed as soon as

practicable. Alternatively, the contents could be kept in a

sealed container with an environmental control agent.

Long term storage conditions, ideally, should be temperature

controlled between -5 and +40˚C and humidity controlled

between 40% and 60% R.H.

Taped product should be stored out of direct sunlight, which

might promote deterioration in tape or adhesive performance.

Product, stored under the conditions recommended above, in

its “as received” packaging, has a minimum shelf life of 2

years.

SM Pad Design

Syfer conventional 2-terminal chip capacitors can generally be

mounted using pad designs in accordance with IPC-7351,

Generic Requirements for Surface Mount Design and Land

Pattern Standards, but there are some other factors that have

been shown to reduce mechanical stress, such as reducing the

pad width to less than the chip width. In addition, the position

of the chip on the board should also be considered.

3-terminal components are not specifically covered by IPC-

7351, but recommended pad dimensions are included in the

Syfer catalogue/website for these components.

Syfer Technology Ltd: SafetyCertifiedDatasheet Issue 1 (P107531)

Release Date 24/04/13

Page 4 of 8

FlexiCap

Termination

FlexiCap

has been developed as a result of listening to

customer’s experiences of stress damage to MLCCs from many

manufacturers, often caused by variations in production

processes.

Our answer is a proprietary flexible epoxy polymer termination

material that is applied to the device under the usual nickel

barrier finish. FlexiCap

will accommodate a greater degree of

board bending than conventional capacitors.

REACH (Registration, Evaluation, Authorisation and

restriction of Chemicals) Statement

The main purpose of REACH is to improve the protection of

human health and the environment from the risks arising from

the use of chemicals.

Syfer Technology Ltd maintains both ISO 14001,

Environmental Management System and OHSAS 18001 Health

& Safety Management System approvals that require and

ensure compliance with corresponding legislation such as

REACH.

For further information, please contact the sales office at

sales@syfer.co.uk

Ranges are available with FlexiCap

termination material

offering increased reliability and superior mechanical

performance (board flex and temperature cycling) when

compared with standard termination materials. Refer to Syfer

application note reference AN0001. FlexiCap

capacitors

enable the board to be bent almost twice as much as before

mechanical cracking occurs. Refer to application note AN0002.

FlexiCap

is also suitable for space applications having passed

thermal vacuum outgassing tests. Refer to Syfer application

note reference AN0026.

RoHS Compliance

Syfer routinely monitors world wide material restrictions (e.g.,

EU/China and Korea RoHS mandates) and is actively involved

in shaping future legislation.

All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC

products are compliant with the EU RoHS directive (see below

for special exemptions) and those with plated terminations are

suitable for soldering common lead free solder alloys (refer to

‘Soldering Information’ for more details on soldering

limitations). Compliance with EU RoHS directive automatically

signifies compliance with some other legislation (e.g., Korea

RoHS). Please refer to the Sales Office for details of

compliance with other materials legislation.

Breakdown of material content, SGS analysis reports and tin

whisker test results are available on request.

Most Syfer MLCC components are available with non-RoHS

compliant tin/lead (SnPb) Solderable termination finish for

exempt applications and where pure tin is not acceptable.

Other tin free termination finishes may also be available –

please refer to the Sales Office for further details.

X8R ranges <250Vdc are not RoHS 2011/65/EU compliant.

Syfer has delivered millions of FlexiCap

components and

during that time has collected substantial test and reliability

data, working in partnership with customers world wide, to

eliminate mechanical cracking.

An additional benefit of FlexiCap

is that MLCCs can withstand

temperature cycling from -55 to 125˚C in excess of 1,000

times without cracking.

FlexiCap

termination has no adverse effect on any electrical

parameters, nor affects the operation of the MLCC in any way.

Application Notes

FlexiCap

may be handled, stored and transported in the

same manner as standard terminated capacitors. The

requirements for mounting and soldering FlexiCap

are the

same as for standard SMD capacitors.

For customers currently using standard terminated capacitors

there should be requirement to change the assembly process

when converting to FlexiCap

Based upon the board bend tests in accordance with IEC

60384-1 the amount of board bending required to

mechanically crack a FlexiCap

terminated capacitor is

significantly increased compared with standard terminated

capacitors.

Product: X7R

Standard

Termination

FlexiCap

Typical bend performance under

AEC-Q200 test conditions

2mm to 3mm

Typically 8mm to 10mm

Check the website, www.syfer.com for latest RoHS update.

Export Controls and Dual-use Regulations

Certain Syfer catalogue components are defined as ‘dual-use’

items under international export controls – those that can be

used for civil and military purposes which meet certain

specified technical standards.

The defining criteria for a dual-use component with respect to

Syfer products is one with a voltage rating of >750V and a

capacitance value >250nF and a series inductance <10nH.

Components defined as ‘dual-use’ under the above criteria

automatically require a licence for export outside the EU, and

may require a licence for export with the EU.

The application for a licence is routine, but customers for these

products will be asked to supply further information.

Please refer to the sales office if you require any further

information on export restrictions.

Other special components may additionally need to comply

with export regulations.

Syfer Technology Ltd: SafetyCertifiedDatasheet Issue 1 (P107531)

Release Date 24/04/13

Page 5 of 8

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