5962-9461102HUA datasheet, PDF

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5962-9461102HUA: DescriptionSRAM Module, 512KX32, 100ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66; Categorystorage storage; File Size2MB，175 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461102HUA Overview

SRAM Module, 512KX32, 100ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66

5962-9461102HUA Parametric

Parameter Name	Attribute value
Objectid	1820274221
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	100 ns
Other features	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	30.1 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	6.22 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	30.1 mm

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INCH-POUND

This document and process

conversion measures necessary

to comply with this revision shall

be completed by 15 May 2018

MIL-PRF-38534K

15 November 2017

SUPERSEDING

MIL-PRF-38534J

13 March 2015

PERFORMANCE SPECIFICATION

HYBRID MICROCIRCUITS,

GENERAL SPECIFICATION FOR

Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime-VAS,

P. O. Box 3990, Columbus, OH 43218-3990, or emailed to

PRF38534@dla.mil.

Since contact information can

change, you may want to verify the currency of this address information using the ASSIST Online database at

https://assist.dla.mil.

AMSC N/A

DISTRIBUTION STATEMENT A. Approved for public release. Distribution in unlimited.

FSC 5962

MIL-PRF-38534K

CONTENTS

PARAGRAPH

PAGE

1. SCOPE ................................................................................................................................................................... 1

1.1 Scope .................................................................................................................................................................. 1

1.2 Description of this specification ........................................................................................................................... 1

1.3 Classification ....................................................................................................................................................... 1

1.3.1 Class K ........................................................................................................................................................... 1

1.3.2 Class H........................................................................................................................................................... 1

1.3.3 Class G .......................................................................................................................................................... 1

1.3.4 Class D........................................................................................................................................................... 2

1.3.5 Class E ........................................................................................................................................................... 2

1.3.6 Class L ........................................................................................................................................................... 2

1.3.7 Class F ........................................................................................................................................................... 2

2. APPLICABLE DOCUMENTS .................................................................................................................................. 2

2.1 General ............................................................................................................................................................... 2

2.2 Government documents ...................................................................................................................................... 2

2.2.1 Specification, standards, and handbooks ....................................................................................................... 2

2.2.2 Other Government documents, drawings, and publications ........................................................................... 2

2.3 Non-Government publications ............................................................................................................................. 3

2.4 Order of precedence ........................................................................................................................................... 3

3. REQUIREMENTS ................................................................................................................................................... 3

3.1 Performance requirements for Class K devices .................................................................................................. 3

3.2 Performance requirements for Class H devices .................................................................................................. 3

3.3 Performance requirements for Class G devices .................................................................................................. 3

3.4 Performance requirements for Class E devices .................................................................................................. 3

3.5 Performance requirements for Class D devices .................................................................................................. 3

3.6 Performance requirements for radiation hardness assurance (RHA) devices ..................................................... 4

3.7 Performance requirements for Class F non-hermetic devices............................................................................. 4

3.8 Performance requirements for Class L non-hermetic devices ............................................................................. 4

3.9 General ............................................................................................................................................................... 6

3.9.1 Implementation of this specification ............................................................................................................... 6

3.9.2 Device specification ....................................................................................................................................... 7

3.9.3 Design and construction ................................................................................................................................. 7

3.9.3.1 Lead finish ................................................................................................................................................. 7

3.9.4 QML qualification requirements...................................................................................................................... 7

3.9.5 Marking of devices ......................................................................................................................................... 8

3.9.5.1 Part or Identifying Number (PIN) ............................................................................................................... 8

3.9.5.1.1 Device type .......................................................................................................................................... 8

3.9.5.1.2 Device class designator ....................................................................................................................... 8

3.9.5.1.3 Case outline ......................................................................................................................................... 8

3.9.5.1.4 Lead finish ............................................................................................................................................ 9

3.9.5.2 Index point................................................................................................................................................. 9

3.9.5.3 Lot identification code (date code) ............................................................................................................ 9

3.9.5.4 Manufacturer’s identification...................................................................................................................... 9

3.9.5.5 Manufacturer’s designating symbol ........................................................................................................... 9

3.9.5.6 Country of manufacture ............................................................................................................................. 9

3.9.5.7 Serialization............................................................................................................................................... 9

3.9.5.7.1 Class K and L serialization ................................................................................................................... 9

3.9.5.7.2 Class H, G, D and F ............................................................................................................................. 9

3.9.5.8 Special marking ......................................................................................................................................... 9

3.9.5.8.1 Beryllium oxide package identifier ...................................................................................................... 10

3.9.5.8.2 Electrostatic discharge (ESD) sensitivity identifier.............................................................................. 10

3.9.5.8.3 Certification mark ............................................................................................................................... 10

3.9.5.9 Marking option for controlled storage of Class H and G .......................................................................... 11

3.10 Item requirements ........................................................................................................................................... 11

3.10.1 Certification of conformance....................................................................................................................... 11

MIL-PRF-38534K

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3.11 Recycled, recovered, environmentally preferable, or biobased materials ....................................................... 12

3.12 Workmanship .................................................................................................................................................. 12

3.12.1 Rework and repair provisions ..................................................................................................................... 12

4. VERIFICAITON ..................................................................................................................................................... 12

4.1 General verification ........................................................................................................................................... 12

4.2 Quality Management (QM) Program ................................................................................................................. 12

4.3 Baseline process flows ...................................................................................................................................... 12

4.4 Quality management (QM) plan ........................................................................................................................ 13

4.4.1 Self-audit program ........................................................................................................................................ 13

4.4.2 Change control procedures .......................................................................................................................... 13

4.5 Verification for QML listing ................................................................................................................................ 13

4.5.1 Verification audit........................................................................................................................................... 13

4.5.1.1 On-site verification................................................................................................................................... 13

4.5.1.2 Certification ............................................................................................................................................. 13

4.5.1.3 Classes E, G, H, K, F, and L process flow audits .................................................................................... 13

4.5.1.4 Class D process flow audit ...................................................................................................................... 13

4.5.2 Technology capability verification (qualification) .......................................................................................... 13

4.5.2.1 Class H and K QML listing ...................................................................................................................... 14

4.5.2.2 Class G, D, F and L QML listing .............................................................................................................. 14

4.5.2.3 Class E listing .......................................................................................................................................... 14

5. PACKAGING ........................................................................................................................................................ 14

5.1 Packaging ......................................................................................................................................................... 14

6. NOTES .................................................................................................................................................................. 14

6.1 Intended use ..................................................................................................................................................... 14

6.2 Acquisition requirements ................................................................................................................................... 14

6.2.1 Optional acquisition data .............................................................................................................................. 14

6.3 Qualification ...................................................................................................................................................... 15

6.4 Terms, definitions, methods, symbols, and abbreviations ................................................................................. 15

6.4.1 Acquiring activity .......................................................................................................................................... 15

6.4.2 Acquisition documents ................................................................................................................................. 15

6.4.3 Audit checklist .............................................................................................................................................. 15

6.4.4 Baseline index of documents ....................................................................................................................... 15

6.4.5 Baseline process flow................................................................................................................................... 15

6.4.6 Burn-in lot ..................................................................................................................................................... 15

6.4.7 Compliant devices ........................................................................................................................................ 15

6.4.8 Compound bond ........................................................................................................................................... 15

6.4.9 Cpk ............................................................................................................................................................... 15

6.4.10 Critical control parameters ......................................................................................................................... 16

6.4.11 Customer compliance matrix (CCM) .......................................................................................................... 16

6.4.12 Delta (∆) limits ............................................................................................................................................ 16

6.4.13 Design activity ............................................................................................................................................ 16

6.4.14 Design analysis .......................................................................................................................................... 16

6.4.15 Design of experiments (DOE) .................................................................................................................... 16

6.4.16 Design robustness ..................................................................................................................................... 16

6.4.17 Electrostatic discharge sensitivity (ESDS).................................................................................................. 16

6.4.18 Element ...................................................................................................................................................... 16

6.4.19 Film microcircuit ......................................................................................................................................... 16

6.4.20 Final seal .................................................................................................................................................... 16

6.4.21 Flip chi[p bonding ....................................................................................................................................... 16

6.4.22 Hybrid microcircuit ...................................................................................................................................... 16

6.4.23 Hybrid microcircuit type (device type)......................................................................................................... 17

6.4.24 Inspection lots ............................................................................................................................................ 17

6.4.25 Inspection lot formation .............................................................................................................................. 17

iii

MIL-PRF-38534K

CONTENTS

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6.4.26 Integral substrate/package ......................................................................................................................... 17

6.4.27 Known good die (KGD) .............................................................................................................................. 17

6.4.28 Microelectronics ......................................................................................................................................... 17

6.4.29 Microcircuit ................................................................................................................................................. 17

6.4.30 Monolithic microcircuit ................................................................................................................................ 17

6.4.31 Multichip module (MCM) ............................................................................................................................ 17

6.4.32 Non-continuous production ........................................................................................................................ 17

6.4.33 Off-line reliability assessment..................................................................................................................... 17

6.4.34 Package type ............................................................................................................................................. 17

6.4.35 Passive element ......................................................................................................................................... 17

6.4.36 Percent defective allowable (PDA) ............................................................................................................. 17

6.4.37 Periodic capability certification ................................................................................................................... 17

6.4.38 Production lot ............................................................................................................................................. 17

6.4.39 Qualifying activity ....................................................................................................................................... 18

6.4.40 Quality function deployment (QFD) ............................................................................................................ 18

6.4.41 Self-audit .................................................................................................................................................... 18

6.4.42 Semiconductor element.............................................................................................................................. 18

6.4.43 Similar devices ........................................................................................................................................... 18

6.4.44 Standard evaluation circuit (SEC) .............................................................................................................. 18

6.4.45 Statistical process control (SPC) ................................................................................................................ 18

6.4.46 Sub-assembly ............................................................................................................................................ 18

6.4.47 Tape automated bonding (TAB) ................................................................................................................. 18

6.4.48 Technology capability ................................................................................................................................. 18

6.4.49 Wafer lots ................................................................................................................................................... 18

6.5 Destruction tests ............................................................................................................................................... 19

6.6 Nondestructive tests .......................................................................................................................................... 19

6.7 Subject term (key work) listing .......................................................................................................................... 19

6.8 List of acronyms ................................................................................................................................................ 20

6.9 Change from previous issue.............................................................................................................................. 20

A.1 SCOPE ............................................................................................................................................................... 21

A.1.1 Scope............................................................................................................................................................. 21

A.1.2 Technology Review Board ............................................................................................................................. 21

A.1.3 Description of appendix A .............................................................................................................................. 21

A.2 APPLICABLE DOCUMENTS .............................................................................................................................. 21

A.2.1 General .......................................................................................................................................................... 21

A.2.2 Government documents................................................................................................................................. 21

A.2.2.1 Specifications, standards, and handbooks................................................................................................ 21

A.2.3 Non-Government publications ....................................................................................................................... 22

A.2.4 Order of precedence ...................................................................................................................................... 22

A.3 QUALITY SYSTEM REQUIREMENTS ............................................................................................................... 22

A.3.1 Management responsibility ............................................................................................................................ 22

A.3.2 Quality system ............................................................................................................................................... 22

A.3.2.1 QM plan .................................................................................................................................................... 22

A.3.2.1.1 Functional block organization chart...................................................................................................... 22

A.3.2.1.2 Baseline process flowchart .................................................................................................................. 22

A.3.2.1.3 Design guidelines ................................................................................................................................ 22

A.3.2.1.4 Travelers .............................................................................................................................................. 22

A.3.2.1.5 Baseline index of documents ............................................................................................................... 23

A.3.2.1.6 Manufacturer’s self-audit...................................................................................................................... 23

A.3.2.2 Design, processing, manufacturing, and testing instructions .................................................................... 23

A.3.2.3 Design, processing, manufacturing, equipment, and material instructions ............................................... 23

A.3.2.4 Quality improvement program................................................................................................................... 24

A.3.2.5 QM program (TRB option) ........................................................................................................................ 24

MIL-PRF-38534K

CONTENTS

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A.3.2.5.1 General ................................................................................................................................................ 24

A.3.2.5.2 Implementation .................................................................................................................................... 24

A.3.2.5.3 TRB...................................................................................................................................................... 24

A.3.2.5.3.1 TRB organizational structure .......................................................................................................... 25

A.3.2.5.3.2 TRB responsibilities ........................................................................................................................ 25

A.3.2.5.4 Alternative method correlation, confirmation, and implementation procedures .................................... 25

A.3.2.5.4.1 Correlation, confirmation, and implementation ................................................................................ 25

A.3.2.5.4.2 Alternative methods ........................................................................................................................ 26

A.3.2.5.4.2.1 Standard evaluation circuits (SEC) ............................................................................................ 26

A.3.2.5.4.2.2 Periodic assessment of alternative methods .............................................................................. 26

A.3.2.5.5 TRB records ......................................................................................................................................... 26

A.3.3 Conversion of customer requirements ........................................................................................................... 26

A.3.4 Design requirements ...................................................................................................................................... 26

A.3.4.1 Changes in design, materials, or processing ............................................................................................ 27

A.3.5 Change control .............................................................................................................................................. 27

A.3.5.1 Configuration control ................................................................................................................................. 27

A.3.6 Control and acceptance of incoming materials .............................................................................................. 28

A.3.6.1 Supplier control program........................................................................................................................... 28

A.3.6.2 Incoming, in-process, and outgoing inventory control ............................................................................... 28

A.3.7 Customer supplied material ........................................................................................................................... 28

A.3.8 Traceability .................................................................................................................................................... 28

A.3.8.1 Material and element traceability .............................................................................................................. 28

A.3.8.2 Process/test traceability ............................................................................................................................ 28

A.3.8.3 Production lot traceability .......................................................................................................................... 28

A.3.8.4 Country of manufacture ............................................................................................................................ 28

A.3.8.5 Production lot identification ....................................................................................................................... 28

A.3.9 Process control .............................................................................................................................................. 29

A.3.9.1 Process and material controls................................................................................................................... 29

A.3.10 Inspection and testing .................................................................................................................................. 29

A.3.10.1 Inspection operations .............................................................................................................................. 29

A.3.10.2 Quality control operations ....................................................................................................................... 29

A.3.10.3 Performance verification operations........................................................................................................ 29

A.3.10.4 Inspections operations ............................................................................................................................ 29

A.3.11 Tool, gauge, and test equipment maintenance and calibration .................................................................... 29

A.3.11.1 Equipment calibrations............................................................................................................................ 29

A.3.12 Examples of assembly and verification travelers ......................................................................................... 29

A.3.13 Failure and defect analysis and data feedback ............................................................................................ 30

A.3.13.1 Procedure in case of test equipment failure or operator error ................................................................. 30

A.3.13.1.1 Procedure for sample tests ................................................................................................................ 30

A.3.13.1.2 Procedure for screening tests ............................................................................................................ 30

A.3.13.2 Failure and corrective action reports ....................................................................................................... 30

A.3.14 Failure analysis and corrective action program............................................................................................ 30

A.3.14.1 Reports and analyses of defective devices and failure ........................................................................... 30

A.3.15 Atmospheric control and handling................................................................................................................ 30

A.3.15.1 ESD handling control program ................................................................................................................ 30

A.3.15.2 Cleanliness and atmosphere control in work areas ................................................................................ 31

A.3.16 Control of quality records ............................................................................................................................. 31

A.3.16.1 Records to be maintained ....................................................................................................................... 31

A.3.16.1.1 Computerized records........................................................................................................................ 31

A.3.16.2 Altered records ....................................................................................................................................... 31

A.3.17 Internal quality audits ................................................................................................................................... 31

A.3.17.1 Self-audit representatives ....................................................................................................................... 31

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