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5962-9461112HXX

Description
Standard SRAM, 32KX8, 70ns, CMOS, CQCC28
Categorystorage    storage   
File Size288KB,40 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461112HXX Overview

Standard SRAM, 32KX8, 70ns, CMOS, CQCC28

5962-9461112HXX Parametric

Parameter NameAttribute value
Objectid1820274488
package instruction,
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time70 ns
JESD-609 codee0
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal locationQUAD
REVISIONS
LTR
F
DESCRIPTION
Figure 1; changed case outline M to be available in either a single or
dual cavity package. Added vendor CAGE code 0EU86 for device
types 05 through 10. -sld
Added device types 11 through 16.
Add note to paragraph 1.2.2 and table I, conditions. Add thermal
resistance, junction-to-case (θ
JC
) for all case outlines. Add case
outline 9.
Table I, I
CC
change maximum limits and I
SB
change maximum limits.
Figure 1, case outline M, correct diagram adding "c" dimension, lead
thickness and change dimension A2 maximum from 0.020" to 0.025".
Figure 1, case outline 9, minimum dimension for D2/E2, change
0.990 inches to 0.980 inches and 25.15 mm to 24.89 mm.
Table I; Operating supply current (I
CC
) changed the maximum limit for
device types 9 and 15 at f = 50 MHz from 700 mA to 725 mA and for
device types 10 and 16 at f = 58.8 MHz from 700 mA to 750 mA. -sld
Added device types 17 through 20. -sld
Added case outline A. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
Table I; Changed the I
OL
from 8 mA to 6 mA for device types 07-10
and 13 -20 for the V
OL
test. Editorial changes throughout. -sld
DATE (YR-MO-DA)
99-04-22
APPROVED
K. A. Cottongim
G
H
99-08-18
00-04-06
Raymond Monnin
Raymond Monnin
J
00-06-19
Raymond Monnin
K
L
01-5-16
01-12-21
Raymond Monnin
Raymond Monnin
M
N
P
R
02-11-18
03-02-24
03-12-19
04-05-03
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
R
15
R
16
R
17
R
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
R
19
R
20
R
21
R
1
R
22
R
2
R
23
R
3
R
24
R
4
R
25
R
5
R
26
R
6
R
27
R
7
R
28
R
8
R
29
R
9
R
30
R
10
R
31
R
11
R
12
R
13
R
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 512K x 32-BIT, STATIC RANDOM
ACCESS MEMORY, CMOS
SIZE
A
SHEET
CAGE CODE
DRAWING APPROVAL DATE
95-11-13
REVISION LEVEL
R
67268
1 OF
31
5962-94611
5962-E251-04
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