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5962-9461203H9A

Description
Flash Module, 512KX32, 90ns, CQFP68, CERAMIC, QFP-68
Categorystorage    storage   
File Size480KB,41 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461203H9A Overview

Flash Module, 512KX32, 90ns, CQFP68, CERAMIC, QFP-68

5962-9461203H9A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid2078440239
package instructionCERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time90 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
Data pollingYES
JESD-30 codeS-CQFP-G68
JESD-609 codee0
length23.875 mm
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size32
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.56 mm
Department size16K
Maximum standby current0.0065 A
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitNO
typeNOR TYPE
width23.875 mm
REVISIONS
LTR
D
E
DESCRIPTION
Corrected dimension D2 for case outlines U, X, and 4. Corrected
dimensions D/E and D1/E1 for case outline Y. -sld
Added case outline 9. Added device type 05. Added vendor cage
0EU86 for device types 01 through 03 in the Standard Microcircuit
Drawing Source Approval Bulletin. Figure 1; Made corrections to case
outline M. Added thermal resistance ratings for all case outlines to
paragraph 1.3 . –sld
Added case outline A. Updated drawing to current requirements of
MIL-PRF-38534. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
Table I; For COE capacitance test, changed the maximum limit from
32 pF to 36 pF and for the CWE and CAD tests changed the
maximum limit from 32 pF to 34 pF for the case outline N only.
Updated drawing to the current requirements. -sld
Update drawing to latest requirements of MIL-PRF-38534. -gc
DATE (YR-MO-DA)
98-10-02
APPROVED
K.A. Cottongim
00-05-11
Raymond Monnin
F
G
H
03-02-21
03-10-10
06-02-03
Raymond Monnin
Raymond Monnin
Raymond Monnin
J
17-10-17
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
J
35
J
15
J
36
J
16
J
17
J
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
J
19
J
20
J
21
J
1
J
22
J
2
J
23
J
3
J
24
J
4
J
25
J
5
J
26
J
6
J
27
J
7
J
28
J
8
J
29
J
9
J
30
J
10
J
31
J
11
J
32
J
12
J
33
J
13
J
34
J
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY, FLASH
ERASABLE/PROGRAMMABLE READ ONLY
MEMORY, 512K x 32-BIT
DRAWING APPROVAL DATE
96-07-31
REVISION LEVEL
J
SIZE
A
SHEET
CAGE CODE
67268
1 OF
36
5962-94612
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
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