MS6167-55PDC datasheet, PDF - EEWORLD Datasheet

MS6167-55PDC: DescriptionStandard SRAM, 16KX1, 55ns, CMOS, PDIP20; Categorystorage storage; File Size393KB，6 Pages; ManufacturerMosel Vitelic Corporation ( MVC ); Websitehttp://www.moselvitelic.com

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MS6167-55PDC Overview

Standard SRAM, 16KX1, 55ns, CMOS, PDIP20

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101178551
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of terminals	20
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.045 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MS6167-55PDC	MS6167-45PDC
Description	Standard SRAM, 16KX1, 55ns, CMOS, PDIP20	Standard SRAM, 16KX1, 45ns, CMOS, PDIP20
Is it Rohs certified?	incompatible	incompatible
Objectid	101178551	101178524
package instruction	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	55 ns	45 ns
I/O type	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T20	R-PDIP-T20
JESD-609 code	e0	e0
memory density	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	1	1
Number of terminals	20	20
word count	16384 words	16384 words
character code	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	16KX1	16KX1
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	0.045 mA	0.045 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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