S82S321F/883B datasheet, PDF - EEWORLD Datasheet

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S82S321F/883B: DescriptionOTP ROM, 4KX8, 80ns, TTL, CDIP24; Categorystorage storage; File Size142KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S82S321F/883B Overview

OTP ROM, 4KX8, 80ns, TTL, CDIP24

S82S321F/883B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	101292034
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	80 ns
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	32768 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	4096 words
character code	4000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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S82S321F/883B Related Products

	S82S321F/883B	82HS321/BJA	N82S321N-B	82HS321/BKA	S82HS321F/883B	S82HS321F/883C	S82S321F/883C
Description	OTP ROM, 4KX8, 80ns, TTL, CDIP24	OTP ROM, 4KX8, 45ns, TTL, CDIP24	OTP ROM, 4KX8, 70ns, TTL, PDIP24	OTP ROM, 4KX8, 45ns, TTL, CDFP24	OTP ROM, 4KX8, 60ns, TTL, CDIP24	OTP ROM, 4KX8, 60ns, TTL, CDIP24	OTP ROM, 4KX8, 80ns, TTL, CDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DFP, FL24,.4	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	80 ns	45 ns	70 ns	45 ns	60 ns	60 ns	80 ns
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDFP-F24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24	24
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-55 °C	-55 °C	-55 °C	-55 °C
organize	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DFP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	FL24,.4	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Objectid	101292034	-	-	-	101292031	101292037	101292040
ECCN code	EAR99	-	-	-	EAR99	EAR99	EAR99
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class C	MIL-STD-883 Class C

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