IC IC,MICROPROCESSOR,16-BIT,MOS,DIP,40PIN,PLASTIC, Microprocessor
| Parameter Name | Attribute value |
| Objectid | 1164078983 |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| bit size | 16 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 100 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| speed | 6 MHz |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Z08002-06PEC | Z08001-06PEC | Z08001-10CEE | 5962-01-261-0919 | Z08002-06DEE | Z08002-10PSC | |
|---|---|---|---|---|---|---|
| Description | IC IC,MICROPROCESSOR,16-BIT,MOS,DIP,40PIN,PLASTIC, Microprocessor | IC IC,MICROPROCESSOR,16-BIT,MOS,DIP,48PIN,PLASTIC, Microprocessor | IC IC,MICROPROCESSOR,16-BIT,MOS,DIP,48PIN,CERAMIC, Microprocessor | IC MICROPROCESSOR, Microprocessor | RISC Microprocessor, 16-Bit, 6MHz, CMOS, CDIP40 | IC IC,MICROPROCESSOR,16-BIT,MOS,DIP,40PIN,PLASTIC, Microprocessor |
| package instruction | DIP, DIP40,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknow | unknown | unknown |
| bit size | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | R-PDIP-T40 | R-PDIP-T48 | R-XDIP-T48 | R-PDIP-T48 | R-XDIP-T40 | R-PDIP-T40 |
| Number of terminals | 40 | 48 | 48 | 48 | 40 | 40 |
| Maximum operating temperature | 100 °C | 85 °C | 85 °C | 70 °C | 100 °C | 70 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 6 MHz | 6 MHz | 10 MHz | 6 MHz | 6 MHz | 10 MHz |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | MOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Parts packaging code | DIP | DIP | DIP | - | - | DIP |
| Contacts | 40 | 48 | 48 | - | - | 40 |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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