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5962-01-354-8223

Description
Standard SRAM, 16KX1, 45ns, CMOS, CDIP20
Categorystorage    storage   
File Size97KB,9 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

5962-01-354-8223 Overview

Standard SRAM, 16KX1, 45ns, CMOS, CDIP20

5962-01-354-8223 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1515161348
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Maximum access time45 ns
I/O typeSEPARATE
JESD-30 codeR-XDIP-T20
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width1
Number of terminals20
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX1
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.01 A
Minimum standby current4.5 V
Maximum slew rate0.1 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature6
CMOS Static RAM
16K (16K x 1-Bit)
IDT6167SA
IDT6167LA
x
Features
High-speed (equal access and cycle time)
– Military: 25/35/45/55/70/85/100ns (max.)
– Commercial: 15/20/25ns (max.)
Low power consumption
Battery backup operation — 2V data retention voltage
(IDT6167LA only)
Available in 20-pin CERDIP and Plastic DIP, and 20-pin SOJ
Produced with advanced CMOS high-performance
technology
CMOS process virtually eliminates alpha particle
soft-error rates
Separate data input and output
Military product compliant to MIL-STD-883, Class B
high reliability CMOS technology.
Access times as fast as 15ns are available. The circuit also offers
a reduced power standby mode. When
CS
goes HIGH, the circuit
will automatically go to, and remain in, a standby mode as long as
CS
remains HIGH. This capability provides significant system-level power
and cooling savings. The low-power (LA) version also offers a battery
backup data retention capability where the circuit typically consumes
only 1µW operating off a 2V battery.
All inputs and the output of the IDT6167 are TTL-compatible and
operate from a single 5V supply, thus simplifying system designs.
The IDT6167 is packaged in a space-saving 20-pin, 300 mil Plastic
DIP or CERDIP and a Plastic 20-pin providing high board-level packing
densities.
Military grade product is manufactured in compliance with the
latest revision of MIL-STD-883, Class B, making it ideally suited to
military temperature applications demanding the highest level of
performance and reliability.
x
x
x
x
x
x
x
Description
The lDT6167 is a 16,384-bit high-speed static RAM organized
as 16K x 1. The part is fabricated using IDT’s high-performance,
Functional Block Diagram
A
0
V
CC
GND
ADDRESS
DECODE
16,384-BIT
MEMORY ARRAY
A
13
D
IN
I/O CONTROL
D
OUT
,
CS
CONTROL
LOGIC
WE
2981 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-2981/08

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Description Standard SRAM, 16KX1, 45ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 45ns, CMOS, CDIP20 Standard SRAM, 16KX1, 100ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 70ns, CMOS, CDIP20 Standard SRAM, 16KX1, 100ns, CMOS, CDIP20
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant _compli _compli
Maximum access time 45 ns 70 ns 45 ns 100 ns 70 ns 70 ns 100 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20
memory density 16384 bit 16384 bi 16384 bit 16384 bit 16384 bit 16384 bi 16384 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 1 1 1 1 1 1 1
Number of terminals 20 20 20 20 20 20 20
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 16KX1 16KX1 16KX1 16KX1 16KX1 16KX1 16KX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 6 6 6 6 6 6 6
Maximum standby current 0.01 A 0.01 A 0.01 A - 0.01 A 0.01 A -
Minimum standby current 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V 2 V
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA - 0.1 mA 0.1 mA -
Base Number Matches - 1 1 1 1 - -
Maker - - IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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