REVISIONS
LTR
A
B
C
D
E
F
G
H
DESCRIPTION
Changes in accordance with NOR 5962-R031-93.
Changes in accordance with NOR 5962-R205-95.
Update and make changes to case outline N. Update boilerplate.
Editorial changes throughout.
Changes in accordance with NOR 5962-R050-98.
Changes in accordance with NOR 5962-R138-98.
Update figure 1 for case Z to indicate pin 1. Update boilerplate
paragraphs. ksr
Update boilerplate paragraphs. glg
Update drawing to meet current MIL-PRF-38535 requirements. – glg
DATE (YR-MO-DA)
92-11-24
95-12-15
96-06-06
98-03-06
98-07-20
04-12-17
10-02-26
17-06-13
APPROVED
M.A. Frye
M.A. Frye
M.A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
Charles Saffle
Charles Saffle
REV
SHEET
REV
SHEET
H
35
H
15
H
36
H
16
H
37
H
17
H
38
H
18
REV
H
39
H
19
H
40
H
20
H
41
H
21
H
1
H
22
H
2
H
23
H
3
H
24
H
4
H
25
H
5
H
26
H
6
H
27
H
7
H
28
H
8
H
29
H
9
H
30
H
10
H
31
H
11
H
32
H
12
H
33
H
13
H
34
H
14
REV STATUS
OF SHEETS
PMIC N/A
SHEET
PREPARED BY
Rajesh Pithadia
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF
DEFENSE
AMSC N/A
CHECKED BY
Kenneth Rice
APPROVED BY
Michael A. Frye
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL, CMOS
1MEG X 4 DRAM, MONOLITHIC SILICON
DRAWING APPROVAL DATE
92-03-04
REVISION LEVEL
H
SIZE
A
SHEET
CAGE CODE
67268
1 OF
41
5962-90847
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
5962-E420-17
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90847
01
M
R
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number 1/
Circuit function
1 M x 4, DYNAMIC RAM
1 M x 4, DYNAMIC RAM
1 M x 4, DYNAMIC RAM
Access time
120 ns
100 ns
80 ns
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
R
X
Y
Z
U
T
M
N
Descriptive designator
GDIP1-T20 or CDIP2-T20
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
20
20
26/20
26/20
20
26/20
20
20
Package style
dual-in-line
flat pack
leadless ceramic chip carrier
J-leaded chip carrier
dual-in-line
leadless ceramic chip carrier
flat pack
zig-zag in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103 and QML-38535.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90847
SHEET
H
2
1.3 Absolute maximum ratings. 2/
Voltage range on any pin ----------------------------------
Voltage range on V
CC
---------------------------------------
Short circuit output current --------------------------------
Maximum power dissipation (P
D
) ------------------------
Storage temperature range--------------------------------
Lead temperature (soldering, 10 seconds) ------------
Thermal resistance, junction-to-case (θ
JC
)
Case outline R ----------------------------------------------
Case outlines X, Y, Z, U, T, M, and N-----------------
Junction temperature (T
J
) 4/------------------------------
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) 5/ ---------------------------
High-level input voltage (V
IH
)------------------------------
Low-level input voltage (V
IL
) 6/ --------------------------
Case operating temperature range (T
C
)----------------
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
+4.5 V dc to +5.5 V dc
2.4 V dc minimum to 6.5 V dc maximum
-1.0 V dc minimum to 0.8 V dc maximum
-55°C to +125°C
-1 V dc to 7 V dc
-1 V dc to 7 V dc
50 mA
1W
-65°C to +150°C
+300°C
See MIL-STD-1835
20°C/W 3/
+175°C
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
2/
3/
4/
5/
6/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated
herein.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
All voltage values in this drawing are with respect to V
SS
.
The algebraic convention, where the more negative (less positive) limit is designated as a minimum, is used in this drawing
for logic voltage levels only.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90847
SHEET
H
3
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD78 - IC Latch-Up Test.
(Copies of this document are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology Association,
3103 North 10th Street, Suite 247, Arlington, VA 22201).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1 .
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2 .
3.2.3 Truth tables. The truth table shall be as specified on figure 3 .
3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix A. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be
allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the
manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V,
alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the
internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing may not be decreased unless approved by the preparing activity. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90847
SHEET
H
4
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c.
Interim and final electrical parameters shall be as specified in table IIA herein.
b.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table IIA herein.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
b.
c.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-90847
SHEET
H
5
ARM Technology
京公网安备 11010802033920号
EEWORLD
