BD032-12-C-166-0-0250-L-D datasheet, PDF

Datasheet> All Categories > The connector> The connector> BD032-12-C-166-0-0250-L-D

BD032-12-C-166-0-0250-L-D: DescriptionBoard Connector; CategoryThe connector The connector; File Size313KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BD032-12-C-166-0-0250-L-D Overview

Board Connector

BD032-12-C-166-0-0250-L-D Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1503790601
Reach Compliance Code	compliant
ECCN code	EAR99
Connector type	BOARD CONNECTOR
Contact to complete cooperation	TIN
Contact completed and terminated	TIN
Contact material	COPPER ALLOY
JESD-609 code	e3
Manufacturer's serial number	BD032

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BD032: 1.27mm PITCH SHROUDED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL

B±0.38

A±0.25

Typ (Non-Accum)

3.92

1.27

1.27 (Typ)

1.27

2.10

The polarization & the

post will be the same end.

1.27 (Typ)

Ø1.20

C±0.20

D±0.2

PIN 0.40X0.40 (Typ)

SPECIFICATIONS

规格

CURRENT RATING

电流额定值

: 1 AMP

INSULATOR RESISTANCE

绝缘电阻值

: 1000 MΩ MIN.

DIELECTRIC WITHSTANDING

耐电压

: AC 300 V

CONTACT RESISTANCE

接触电阻值：

20 mΩ Max.

OPERATING TEMPERATURE

工½温度

: -40°C TO +105°C

CONTACT MATERIAL

端子物料

: COPPER ALLOY

INSULATOR MATERIAL

绝缘½物料

STANDARD

标准物料

: POLYESTER

聚酯

, LCP, UL 94V-0

SOLDERING PROCESS

可焊性

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

): BD065 - Allowing perfect polarisation

- Non-Polarised mating connections available - contact GCT for details

DETAIL

REV

DATE

DRAWING

RELEASE

03/04/08

AJO

INSULATOR INFO

B2B PCN002 1.27mm

BD032

HEADER N6T REMOVAL

X PCN

AMMENDED

27/07/09

15/05/14

18/03/13

G CE

N N

D E

N SC

E E

P L

1.27

3.37

5.65

1.84

1.00

Ø0

RECOMMENDED PCB LAYOUT

)

Ø1

1.575

2.20

1.20

2.30

Ø0.80

1.27

Ordering Grid

BD032

XXX

XXXX

No. of Contacts

10 to 80

Packing Options

D = Tube

(Standard)

E = Tube with Cap

Contact Plating

A = Gold Flash All Over

(Standard)

B = Selective Gold Flash Contact Area/

Tin On Tail

C = Tin All Over

G = 10µ" Gold Contact Area/Tin On Tail

I = 30µ" Gold Contact Area/Tin On Tail

TABLE A

Locating Peg

0 = No Peg

1 = With Peg

Insulator Material

L = LCP

Insulator

Height 'H'

092 = 9.20mm

(Standard)

Dimension D (1/100mm)

(Tail Length)

0225 = 2.25mm

(Standard

)

or specify Dimension D

e.g. 0250 = 2.50mm

Order

Code

070

074

076

082

083

084

087

090

092

Insulator

Height

7.00mm

7.40mm

7.60mm

8.20mm

8.30mm

8.40mm

8.70mm

9.00mm

9.20mm

Order

Code

115

Insulator

Height

Please see Table A for all options

11.50mm

121

12.10mm

12.20mm

122

132

136

153

156

166

169

13.20mm

13.60mm

15.30mm

15.60mm

16.60mm

16.90mm

Tolerances

(Except as noted)

Part Number:-

Date:-

Dimensions in mm

BD032

03 APR 08

095

9.50mm

212

21.20mm

X.°±5°

.X°±2°

X.X ± 0.20

X.XX ± 0.15

.XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X. ± 0.30

Third Angle Projection

Description:-

Sheet No.

1/1

1.27mm PITCH SHROUDED PIN HEADER, DUAL ROW,

THROUGH HOLE, VERTICAL

www.globalconnectortechnology.com

Material

Drawn by

See Note

E & OE

102

10.20mm

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Scale

NTS

Revision

Recommended Resources

FM modulation circuit using 555

Intelligent battery fast charging circuit

Reference regulator TL431

3～120V regulated power supply circuit

LED-serial LED digital tube static display circuit (common cathode)

[Chip Coin Exchange] Activity 2: Use chip coins to exchange AVR and its programmer PCB!: Thanks to tiankai001 for designing and learning AVR development board with everyone. I hope everyone will have a pleasant learning journey. All EEWORLD members can participate.------------------------...; EEWORLD社区 Microchip MCU

About CE6.0 kernel startup problem: I am studying the kernel boot process recently and looking at the code. I would like to ask, when is the image copied to the memory? Why can't I find similar code? I saw the code of copying bootloader...; naphu Embedded System

Fortune 500 company urgently recruits embedded software project manager with high salary: 符合以下大多数条件即可（薪水十分不错，美资企业,工作地点：深圳）联系方式：msn:chenhuanwanted@hotmail.comEssential Duties & Responsibilities: * Administration and management of the SW development team, which includes hiring, employee dev...; xinbt Embedded System

The compilation is successful, but MODESIM simulation does not produce waveforms: The compilation is successful, but no waveform is output when using modelsim simulation . library ieee;use ieee.std_logic_1164.all;use ieee.std_logic_arith.all;use ieee.std_logic_unsigned.all;entity d...; eeleader FPGA/CPLD

Xiangshui Lake is a thousand meters away.: Xiangshui Lake Waterfall　　Xiangshui Lake Natural Scenic Area is located in the west of Mutianyu Great Wall in Huairou, 28 kilometers away from the county seat, with a total area of 18 square kilometer...; maker Talking

TLP3547 Evaluation Board Review: After getting the side panel, I have been busy with other projects and have no time to test it. Yesterday, I took some time to simply test the basic performance of the first-line TLP3547 module. [size...; 麋鹿黑 Toshiba Photorelays TLP3547 Review

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components