Cal-Chip
C
ONSTRUCTION
F
EATURES
• High Density
• Automatic Placement
•
Convex
Electronics, Incorporated
CN S
ERIES
Thick Film Chip Resistor Arrays
CONVEX TERMINATION
D
IMENSIONS
IN MM
Unit: mm
TYPE
CN34
CN24
CN22
L
3.2±0.1
2.0±0.1
1.0±0.1
W
1.6±0.15
1.0±0.1
1.0±0.1
t
0.55±0.1
0.4±0.1
0.35±0.1
P
0.8±0.5
0.5±0.05
0.65±0.05
a
0.45±0.1
0.3±0.1
0.3±0.1
b
0.3±0.2
0.15±0.1
0.15±0.1
c
0.3±0.2
0.25±0.2
0.25±0.2
R
ATING
TYPE
Power
Rating
at 70°C
1/16W
Max
Working
Voltage
50V
Max
Overload
Voltage
100
100V
Operating
Temp. (°C)
-55~+125°C
Resistance
Tolerance
F±1%
Resistance
Range (Ω)
0Ω~1MΩ
Temp
Coefficient
ppm/°C
±200ppm/°C
CN34
CN24
J±5%
F±1%
1/16W
CN22
50V
50V
100V
-55~+125°C
J±5%
0Ω~1MΩ
±250ppm/°C
Ordering Information
CN
Chip Resistor
Networks/Arrays
Series
220402x2 4P2R
240402x4 8P4R
340603x4 8P4R
34
J
103
CT
Packaging
Nominal Resistance
Resistance Tolerance
J = ±5%
F = 1%
5% = 3 Digit designation is first two
digits are significant, 3rd is multiplier (10x)
1% = 4 Digit designation is first three
digits are significant, 4th is multiplier (10x)
Note: Calchip has completed the Lead-Free transition. All parts shipped will be Lead-Free. The customer designator of "LF" is no longer avaiable.
Lead-Free material will continue to have an LF at the end of the Lot Code and a green RoHS symbol on the label.
CN22 series is available upon request. Please consult factor
Cal-Chip
Electronics, Incorporated
CN S
ERIES
Thick Film Chip Resistor Arrays
1.0 Number of Element
Depend on its element’s number. (2-2 element. 4-4 element)
2.0 Resistance Tolerance
F: ±1%
J: ±5%
3.0 Nominal Resistance
Example: 103, 10 is effective digit, 3 is a multiple which represents the cube of 10, zero number is three.
4.0 Schematics
8
7
6
5
R
1
1
2
R
2
3
R
3
4
R
4
R
1
= R
2
= R
3
= R
4
5.0 Power Derating Curve
The resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance
with the curve in Figure 1.
100
80
60
40
20
0 -60
-40
-2 0
0
20
40
60
80 100 120 140
5.1 Rated Voltage
The value of rated voltage shall be determined from formula (1).
E=
P x R........(1)
E = Rated Voltage (V)
P = Power Rating (W)
R = Nominal Resistance (Ω)
√
6.0 Electrical / Machine Characteristics and Test Methods
Item
Temperature Coefficient
Short Time Overload
Specifications
TCR: ±200 ppm
±(2%+0.05Ω)
±(3%+0.05Ω)
Inspection Temp.
Test Methods
Cold: +25°C~-55°C
Hot: +25°C~+125°C
1. Apply 2.5 x rated voltage for 5 sec.
2. Wait 30 minutes
3. Measure resistance value
1. Dwell in chamber at 70±2°C for ON: 90 min. at
rated voltage; then OFF: 30 min.
2. Perform 1,000 hours cyclically
1. Dwell in humidity chamber at 40 ±2°C and 95% RH for
ON: 90 min. at rated voltage; then OFF: 30 min.
2. Perform 1.,000 hours cyclically
1. -55±3°C~125±3°C, make 5 cycles.
2. Released 1 hour in room temp., then measure value.
1. Immersed in molten solder at 270±5°C for 10±.01 sec.
2.Released 1 hour in room temp., then measure value.
1. Immersed in rosin solution for 5~10 seconds.
2. Re-immersed in solder pot at 230±5°C for 3±0.5 sec
1. Perform 10,000 voltage cycles as follows: ON (2.5 x rated
voltage or current) 1 sec. and OFF 25 sec.
2. Released 30 min. without loading.
3. Measure resistance.
Apply 300VAC for 1 second
Apply 100VDC.
Load Life
Load Life in Humidity
Temperature Cycling
Effect of Soldering
Solderability
Intermittent Overload
±(3%+0.05Ω)
±(1%+0.05Ω)
±(2.5%+0.05Ω)
Non-damage by machinery
95% coverage min.
±(5%+0.1Ω)
Dielectric Withstanding Voltage
Insulation Resistance
No evidence of mechanical damage
108
Ω
min
Microcontroller MCU
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